Thao P. Le

Array ( [id] => 18243208 [patent_doc_number] => 20230075519 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-09 [patent_title] => PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/055139 [patent_app_country] => US [patent_app_date] => 2022-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10622 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18055139 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18258240 [patent_doc_number] => 20230085280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER [patent_app_type] => utility [patent_app_number] => 17/984259 [patent_app_country] => US [patent_app_date] => 2022-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9713 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984259 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20807663 [patent_doc_number] => 12672586 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-30 [patent_title] => Microelectronic device packages including wirebonding and related methods, memory devices, and electronic systems [patent_app_type] => utility [patent_app_number] => 18/054103 [patent_app_country] => US [patent_app_date] => 2022-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 2080 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054103 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20933298 [patent_doc_number] => 12727509 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-09-01 [patent_title] => Hybrid element substrate and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/982347 [patent_app_country] => US [patent_app_date] => 2022-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 36 [patent_no_of_words] => 6786 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17982347 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19294697 [patent_doc_number] => 12034062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-09 [patent_title] => Semiconductor device structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/980656 [patent_app_country] => US [patent_app_date] => 2022-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 9360 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980656 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18679996 [patent_doc_number] => 20230317654 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/980740 [patent_app_country] => US [patent_app_date] => 2022-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12933 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980740 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20734842 [patent_doc_number] => 12642110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-26 [patent_title] => Multi-channel device stacking [patent_app_type] => utility [patent_app_number] => 18/052399 [patent_app_country] => US [patent_app_date] => 2022-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 21 [patent_no_of_words] => 5438 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18052399 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18195388 [patent_doc_number] => 20230048907 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/978225 [patent_app_country] => US [patent_app_date] => 2022-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8817 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17978225 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19146427 [patent_doc_number] => 20240145457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE [patent_app_type] => utility [patent_app_number] => 18/050099 [patent_app_country] => US [patent_app_date] => 2022-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9580 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18050099 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18379782 [patent_doc_number] => 20230154871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM [patent_app_type] => utility [patent_app_number] => 17/973731 [patent_app_country] => US [patent_app_date] => 2022-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10807 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973731 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19183860 [patent_doc_number] => 11990461 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Integrated circuit package for high bandwidth memory [patent_app_type] => utility [patent_app_number] => 17/970237 [patent_app_country] => US [patent_app_date] => 2022-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8004 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17970237 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19995583 [patent_doc_number] => 20250133805 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-04-24 [patent_title] => SILICON CARBIDE SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/690444 [patent_app_country] => US [patent_app_date] => 2022-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9628 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 362 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18690444 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20649804 [patent_doc_number] => 12604768 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-14 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/961954 [patent_app_country] => US [patent_app_date] => 2022-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3318 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17961954 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18456344 [patent_doc_number] => 20230197626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 17/938665 [patent_app_country] => US [patent_app_date] => 2022-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12820 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 285 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938665 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20404440 [patent_doc_number] => 12494421 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Semiconductor package including redistribution structure, and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/938672 [patent_app_country] => US [patent_app_date] => 2022-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 5003 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938672 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18473193 [patent_doc_number] => 20230207481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 17/936640 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7394 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18967499 [patent_doc_number] => 11901280 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Ground via clustering for crosstalk mitigation [patent_app_type] => utility [patent_app_number] => 17/956766 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7682 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 234 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956766 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20441599 [patent_doc_number] => 12512441 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-30 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/955778 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955778 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20201592 [patent_doc_number] => 12404361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-02 [patent_title] => Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same [patent_app_type] => utility [patent_app_number] => 17/935886 [patent_app_country] => US [patent_app_date] => 2022-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5644 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935886 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18440070 [patent_doc_number] => 20230187365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip [patent_app_type] => utility [patent_app_number] => 17/952249 [patent_app_country] => US [patent_app_date] => 2022-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 134952 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952249 [rel_patent_id] =>[rel_patent_doc_number] =>)