Thao X. Le

Array ( [id] => 1257133 [patent_doc_number] => 06667495 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-12-23 [patent_title] => 'Semiconductor configuration with ohmic contact-connection and method for contact-connecting a semiconductor configuration' [patent_app_type] => B2 [patent_app_number] => 09/732989 [patent_app_country] => US [patent_app_date] => 2000-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5650 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/667/06667495.pdf [firstpage_image] =>[orig_patent_app_number] => 09732989 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1178608 [patent_doc_number] => 06747337 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-06-08 [patent_title] => 'Semiconductor wafer with a dicing line overlapping a defect' [patent_app_type] => B1 [patent_app_number] => 09/713339 [patent_app_country] => US [patent_app_date] => 2000-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1547 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/747/06747337.pdf [firstpage_image] =>[orig_patent_app_number] => 09713339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1494782 [patent_doc_number] => 06403401 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Heat spreader hole pin 1 identifier' [patent_app_type] => B1 [patent_app_number] => 09/639679 [patent_app_country] => US [patent_app_date] => 2000-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 4138 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 269 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/403/06403401.pdf [firstpage_image] =>[orig_patent_app_number] => 09639679 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1424672 [patent_doc_number] => 06515374 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-04 [patent_title] => 'Contact connection of metal interconnects of an integrated semiconductor chip' [patent_app_type] => B1 [patent_app_number] => 09/633704 [patent_app_country] => US [patent_app_date] => 2000-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2290 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/515/06515374.pdf [firstpage_image] =>[orig_patent_app_number] => 09633704 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1518781 [patent_doc_number] => 06501108 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-31 [patent_title] => 'Semiconductor integrated circuit' [patent_app_type] => B1 [patent_app_number] => 09/616538 [patent_app_country] => US [patent_app_date] => 2000-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 3551 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/501/06501108.pdf [firstpage_image] =>[orig_patent_app_number] => 09616538 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1583042 [patent_doc_number] => 06424031 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-23 [patent_title] => 'Stackable package with heat sink' [patent_app_type] => B1 [patent_app_number] => 09/566680 [patent_app_country] => US [patent_app_date] => 2000-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 4320 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/424/06424031.pdf [firstpage_image] =>[orig_patent_app_number] => 09566680 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1188889 [patent_doc_number] => 06734120 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-05-11 [patent_title] => 'Method of photoresist ash residue removal' [patent_app_type] => B1 [patent_app_number] => 09/505695 [patent_app_country] => US [patent_app_date] => 2000-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1750 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/734/06734120.pdf [firstpage_image] =>[orig_patent_app_number] => 09505695 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1545284 [patent_doc_number] => 06444552 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Method of reducing the conductivity of a semiconductor and devices made thereby' [patent_app_type] => B1 [patent_app_number] => 09/354248 [patent_app_country] => US [patent_app_date] => 1999-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 29 [patent_no_of_words] => 4447 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/444/06444552.pdf [firstpage_image] =>[orig_patent_app_number] => 09354248 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1299766 [patent_doc_number] => 06624061 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-23 [patent_title] => 'Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film' [patent_app_type] => B2 [patent_app_number] => 09/311999 [patent_app_country] => US [patent_app_date] => 1999-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 8743 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 266 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/624/06624061.pdf [firstpage_image] =>[orig_patent_app_number] => 09311999 [rel_patent_id] =>[rel_patent_doc_number] =>)