Search

Theodore C. Parsons

Examiner (ID: 12791, Phone: (571)270-1475 , Office: P/2494 )

Most Active Art Unit
2494
Art Unit(s)
2494
Total Applications
531
Issued Applications
401
Pending Applications
57
Abandoned Applications
103

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7654793 [patent_doc_number] => 20110304062 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-15 [patent_title] => 'CHIP PACKAGE STRUCTURE, CHIP PACKAGE MOLD CHASE AND CHIP PACKAGE PROCESS' [patent_app_type] => utility [patent_app_number] => 12/883432 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3498 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0304/20110304062.pdf [firstpage_image] =>[orig_patent_app_number] => 12883432 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883432
Chip package structure Sep 15, 2010 Issued
Array ( [id] => 6106167 [patent_doc_number] => 20110186989 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-04 [patent_title] => 'Semiconductor Device and Bump Formation Process' [patent_app_type] => utility [patent_app_number] => 12/883950 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5075 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0186/20110186989.pdf [firstpage_image] =>[orig_patent_app_number] => 12883950 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883950
Semiconductor Device and Bump Formation Process Sep 15, 2010 Abandoned
Array ( [id] => 8037213 [patent_doc_number] => 20120068342 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-22 [patent_title] => 'ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING' [patent_app_type] => utility [patent_app_number] => 12/883552 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2741 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0068/20120068342.pdf [firstpage_image] =>[orig_patent_app_number] => 12883552 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883552
ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING Sep 15, 2010 Abandoned
Array ( [id] => 8037225 [patent_doc_number] => 20120068345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-22 [patent_title] => 'LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS' [patent_app_type] => utility [patent_app_number] => 12/883362 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2825 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0068/20120068345.pdf [firstpage_image] =>[orig_patent_app_number] => 12883362 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883362
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS Sep 15, 2010 Abandoned
Array ( [id] => 10145103 [patent_doc_number] => 09177917 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-03 [patent_title] => 'Semiconductor constructions' [patent_app_type] => utility [patent_app_number] => 12/860745 [patent_app_country] => US [patent_app_date] => 2010-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 3899 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12860745 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/860745
Semiconductor constructions Aug 19, 2010 Issued
Array ( [id] => 6067882 [patent_doc_number] => 20110042819 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-24 [patent_title] => 'CHIP PACKAGE AND METHOD FOR FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/860823 [patent_app_country] => US [patent_app_date] => 2010-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4608 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20110042819.pdf [firstpage_image] =>[orig_patent_app_number] => 12860823 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/860823
Chip package and method for forming the same Aug 19, 2010 Issued
Array ( [id] => 8785026 [patent_doc_number] => 08431869 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-04-30 [patent_title] => 'Defrosting, defogging and de-icing structures' [patent_app_type] => utility [patent_app_number] => 12/792725 [patent_app_country] => US [patent_app_date] => 2010-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 6112 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12792725 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/792725
Defrosting, defogging and de-icing structures Jun 1, 2010 Issued
Array ( [id] => 9497208 [patent_doc_number] => 08736030 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-27 [patent_title] => 'Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/769024 [patent_app_country] => US [patent_app_date] => 2010-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3397 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12769024 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/769024
Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same Apr 27, 2010 Issued
Array ( [id] => 7571036 [patent_doc_number] => 20110266692 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-03 [patent_title] => 'LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 12/769361 [patent_app_country] => US [patent_app_date] => 2010-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 13052 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20110266692.pdf [firstpage_image] =>[orig_patent_app_number] => 12769361 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/769361
Layered chip package and method of manufacturing same Apr 27, 2010 Issued
Array ( [id] => 9876026 [patent_doc_number] => 08963298 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-24 [patent_title] => 'EMI shielding package structure and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/769053 [patent_app_country] => US [patent_app_date] => 2010-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3371 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12769053 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/769053
EMI shielding package structure and method for fabricating the same Apr 27, 2010 Issued
Array ( [id] => 7571035 [patent_doc_number] => 20110266691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-03 [patent_title] => 'Through-Substrate Vias with Improved Connections' [patent_app_type] => utility [patent_app_number] => 12/769251 [patent_app_country] => US [patent_app_date] => 2010-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2665 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20110266691.pdf [firstpage_image] =>[orig_patent_app_number] => 12769251 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/769251
Through-substrate vias with improved connections Apr 27, 2010 Issued
Array ( [id] => 7496857 [patent_doc_number] => 20110260297 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/767808 [patent_app_country] => US [patent_app_date] => 2010-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2725 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260297.pdf [firstpage_image] =>[orig_patent_app_number] => 12767808 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/767808
THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF Apr 26, 2010 Abandoned
Array ( [id] => 7496886 [patent_doc_number] => 20110260326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'STRUCTURES AND METHODS FOR AIR GAP INTEGRATION' [patent_app_type] => utility [patent_app_number] => 12/768267 [patent_app_country] => US [patent_app_date] => 2010-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 12341 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260326.pdf [firstpage_image] =>[orig_patent_app_number] => 12768267 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/768267
Structures and methods for air gap integration Apr 26, 2010 Issued
Array ( [id] => 6067885 [patent_doc_number] => 20110042822 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-24 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/766966 [patent_app_country] => US [patent_app_date] => 2010-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 6081 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20110042822.pdf [firstpage_image] =>[orig_patent_app_number] => 12766966 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/766966
Semiconductor device Apr 25, 2010 Issued
Array ( [id] => 7496863 [patent_doc_number] => 20110260303 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'Semiconductor Device and Method of Forming Openings in Thermally-Conductive Frame of FO-WLCSP to Dissipate Heat and Reduce Package Height' [patent_app_type] => utility [patent_app_number] => 12/766607 [patent_app_country] => US [patent_app_date] => 2010-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6276 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260303.pdf [firstpage_image] =>[orig_patent_app_number] => 12766607 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/766607
Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height Apr 22, 2010 Issued
Array ( [id] => 10544597 [patent_doc_number] => 09269732 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-23 [patent_title] => 'Chip package' [patent_app_type] => utility [patent_app_number] => 12/766362 [patent_app_country] => US [patent_app_date] => 2010-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3699 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12766362 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/766362
Chip package Apr 22, 2010 Issued
Array ( [id] => 7496877 [patent_doc_number] => 20110260317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION' [patent_app_type] => utility [patent_app_number] => 12/765250 [patent_app_country] => US [patent_app_date] => 2010-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3572 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260317.pdf [firstpage_image] =>[orig_patent_app_number] => 12765250 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/765250
Cu pillar bump with electrolytic metal sidewall protection Apr 21, 2010 Issued
Array ( [id] => 7506112 [patent_doc_number] => 20110253692 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-20 [patent_title] => 'Electrical heater for vehicle windshields and windows' [patent_app_type] => utility [patent_app_number] => 12/662488 [patent_app_country] => US [patent_app_date] => 2010-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3144 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0253/20110253692.pdf [firstpage_image] =>[orig_patent_app_number] => 12662488 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/662488
Electrical heater for vehicle windshields and windows Apr 19, 2010 Abandoned
Array ( [id] => 9153988 [patent_doc_number] => 08586894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-19 [patent_title] => 'Vehicle window panel' [patent_app_type] => utility [patent_app_number] => 12/750603 [patent_app_country] => US [patent_app_date] => 2010-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2186 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12750603 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/750603
Vehicle window panel Mar 29, 2010 Issued
Array ( [id] => 8630327 [patent_doc_number] => 08362399 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-29 [patent_title] => 'Windshield heater' [patent_app_type] => utility [patent_app_number] => 12/709917 [patent_app_country] => US [patent_app_date] => 2010-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2558 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12709917 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/709917
Windshield heater Feb 21, 2010 Issued
Menu