
Theodore C. Parsons
Examiner (ID: 12791, Phone: (571)270-1475 , Office: P/2494 )
| Most Active Art Unit | 2494 |
| Art Unit(s) | 2494 |
| Total Applications | 531 |
| Issued Applications | 401 |
| Pending Applications | 57 |
| Abandoned Applications | 103 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7654793
[patent_doc_number] => 20110304062
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[patent_kind] => A1
[patent_issue_date] => 2011-12-15
[patent_title] => 'CHIP PACKAGE STRUCTURE, CHIP PACKAGE MOLD CHASE AND CHIP PACKAGE PROCESS'
[patent_app_type] => utility
[patent_app_number] => 12/883432
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Array
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[patent_title] => 'Semiconductor Device and Bump Formation Process'
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Array
(
[id] => 8037213
[patent_doc_number] => 20120068342
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[patent_kind] => A1
[patent_issue_date] => 2012-03-22
[patent_title] => 'ELECTRICALLY CONDUCTIVE ADHESIVE FOR TEMPORARY BONDING'
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Array
(
[id] => 8037225
[patent_doc_number] => 20120068345
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-22
[patent_title] => 'LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS'
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Array
(
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Array
(
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[patent_title] => 'CHIP PACKAGE AND METHOD FOR FORMING THE SAME'
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Array
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[patent_app_type] => utility
[patent_app_number] => 12/792725
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Array
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[patent_kind] => B2
[patent_issue_date] => 2014-05-27
[patent_title] => 'Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same'
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[patent_app_number] => 12/769024
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Array
(
[id] => 7571036
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Array
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[patent_title] => 'EMI shielding package structure and method for fabricating the same'
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Array
(
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[patent_title] => 'Through-Substrate Vias with Improved Connections'
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Array
(
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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