
Theodore Morris
Examiner (ID: 11948)
| Most Active Art Unit | 1105 |
| Art Unit(s) | 1507, 1105, 1804, 1501, 1109, 1101, 2899 |
| Total Applications | 902 |
| Issued Applications | 721 |
| Pending Applications | 0 |
| Abandoned Applications | 181 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19392945
[patent_doc_number] => 20240282815
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-22
[patent_title] => Bonding and Isolation Techniques for Stacked Transistor Structures
[patent_app_type] => utility
[patent_app_number] => 18/519737
[patent_app_country] => US
[patent_app_date] => 2023-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 21249
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18519737
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/519737 | Bonding and Isolation Techniques for Stacked Transistor Structures | Nov 26, 2023 | Pending |
Array
(
[id] => 19038261
[patent_doc_number] => 20240088076
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-14
[patent_title] => SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
[patent_app_type] => utility
[patent_app_number] => 18/515781
[patent_app_country] => US
[patent_app_date] => 2023-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3589
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18515781
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/515781 | Image pickup unit having resin in via holes for an endoscope | Nov 20, 2023 | Issued |
Array
(
[id] => 19610935
[patent_doc_number] => 12159816
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-03
[patent_title] => Semiconductor device with lead between a plurality of encapsulated MOSFETs
[patent_app_type] => utility
[patent_app_number] => 18/492586
[patent_app_country] => US
[patent_app_date] => 2023-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 26
[patent_no_of_words] => 13875
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18492586
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/492586 | Semiconductor device with lead between a plurality of encapsulated MOSFETs | Oct 22, 2023 | Issued |
Array
(
[id] => 18959114
[patent_doc_number] => 20240047441
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-08
[patent_title] => PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/490855
[patent_app_country] => US
[patent_app_date] => 2023-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8748
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18490855
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/490855 | PACKAGE STRUCTURE | Oct 19, 2023 | Pending |
Array
(
[id] => 18943473
[patent_doc_number] => 20240038612
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-01
[patent_title] => PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT
[patent_app_type] => utility
[patent_app_number] => 18/380276
[patent_app_country] => US
[patent_app_date] => 2023-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12430
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18380276
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/380276 | Package with electrically insulated carrier and at least one step on encapsulant | Oct 15, 2023 | Issued |
Array
(
[id] => 18927139
[patent_doc_number] => 20240030143
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-25
[patent_title] => POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
[patent_app_type] => utility
[patent_app_number] => 18/377183
[patent_app_country] => US
[patent_app_date] => 2023-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6387
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18377183
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/377183 | Power delivery for embedded bridge die utilizing trench structures | Oct 4, 2023 | Issued |
Array
(
[id] => 19781705
[patent_doc_number] => 12230744
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-02-18
[patent_title] => Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa
[patent_app_type] => utility
[patent_app_number] => 18/370649
[patent_app_country] => US
[patent_app_date] => 2023-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 21398
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 227
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18370649
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/370649 | Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa | Sep 19, 2023 | Issued |
Array
(
[id] => 20793089
[patent_doc_number] => 12667023
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-06-23
[patent_title] => Package device including capacitor disposed on opposite side of die relative to substrate
[patent_app_type] => utility
[patent_app_number] => 18/467062
[patent_app_country] => US
[patent_app_date] => 2023-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 16
[patent_no_of_words] => 7020
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18467062
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/467062 | PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE | Sep 13, 2023 | Issued |
Array
(
[id] => 19040425
[patent_doc_number] => 20240090240
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-14
[patent_title] => INTEGRATED CIRCUIT DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/367704
[patent_app_country] => US
[patent_app_date] => 2023-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10007
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18367704
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/367704 | INTEGRATED CIRCUIT DEVICE | Sep 12, 2023 | Pending |
Array
(
[id] => 18851281
[patent_doc_number] => 20230413685
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-21
[patent_title] => METHOD OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM)
[patent_app_type] => utility
[patent_app_number] => 18/232576
[patent_app_country] => US
[patent_app_date] => 2023-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5121
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232576
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/232576 | METHOD OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM) | Aug 9, 2023 | Abandoned |
Array
(
[id] => 18810337
[patent_doc_number] => 20230384672
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-30
[patent_title] => Polymer Layer in Semiconductor Device and Method of Manufacture
[patent_app_type] => utility
[patent_app_number] => 18/446562
[patent_app_country] => US
[patent_app_date] => 2023-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13809
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18446562
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/446562 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Aug 8, 2023 | Issued |
Array
(
[id] => 18789411
[patent_doc_number] => 20230378073
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-23
[patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/363769
[patent_app_country] => US
[patent_app_date] => 2023-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9883
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363769
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/363769 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Aug 1, 2023 | Issued |
Array
(
[id] => 18812654
[patent_doc_number] => 20230386991
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-30
[patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/363766
[patent_app_country] => US
[patent_app_date] => 2023-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13008
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363766
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/363766 | Encircling a semiconductor device with stacked frames on a substrate | Aug 1, 2023 | Issued |
Array
(
[id] => 19007805
[patent_doc_number] => 20240071876
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-29
[patent_title] => SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 18/359098
[patent_app_country] => US
[patent_app_date] => 2023-07-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10710
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359098
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/359098 | SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD | Jul 25, 2023 | Pending |
Array
(
[id] => 19428220
[patent_doc_number] => 12087654
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-10
[patent_title] => Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region
[patent_app_type] => utility
[patent_app_number] => 18/358914
[patent_app_country] => US
[patent_app_date] => 2023-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 28
[patent_no_of_words] => 11115
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358914
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/358914 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Jul 24, 2023 | Issued |
Array
(
[id] => 20118422
[patent_doc_number] => 12368141
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-07-22
[patent_title] => IPD modules with flexible connection scheme in packaging
[patent_app_type] => utility
[patent_app_number] => 18/357457
[patent_app_country] => US
[patent_app_date] => 2023-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 34
[patent_no_of_words] => 2070
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357457
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/357457 | IPD modules with flexible connection scheme in packaging | Jul 23, 2023 | Issued |
Array
(
[id] => 19670878
[patent_doc_number] => 12183649
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-31
[patent_title] => IC package including multi-chip unit with bonded integrated heat spreader
[patent_app_type] => utility
[patent_app_number] => 18/222855
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 7420
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 334
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222855
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/222855 | IC package including multi-chip unit with bonded integrated heat spreader | Jul 16, 2023 | Issued |
Array
(
[id] => 19546509
[patent_doc_number] => 20240363545
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-31
[patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/352952
[patent_app_country] => US
[patent_app_date] => 2023-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3639
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352952
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/352952 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Jul 13, 2023 | Issued |
Array
(
[id] => 19460157
[patent_doc_number] => 12100664
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-24
[patent_title] => Semiconductor device with curved conductive lines and method of forming the same
[patent_app_type] => utility
[patent_app_number] => 18/352595
[patent_app_country] => US
[patent_app_date] => 2023-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 8881
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352595
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/352595 | Semiconductor device with curved conductive lines and method of forming the same | Jul 13, 2023 | Issued |
Array
(
[id] => 19124901
[patent_doc_number] => 11968909
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-23
[patent_title] => Method of manufacturing a magnetoresistive random access memory (MRAM)
[patent_app_type] => utility
[patent_app_number] => 18/219320
[patent_app_country] => US
[patent_app_date] => 2023-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 20
[patent_no_of_words] => 5113
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18219320
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/219320 | Method of manufacturing a magnetoresistive random access memory (MRAM) | Jul 6, 2023 | Issued |