Search

Theodore Morris

Examiner (ID: 11948)

Most Active Art Unit
1105
Art Unit(s)
1507, 1105, 1804, 1501, 1109, 1101, 2899
Total Applications
902
Issued Applications
721
Pending Applications
0
Abandoned Applications
181

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19392945 [patent_doc_number] => 20240282815 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => Bonding and Isolation Techniques for Stacked Transistor Structures [patent_app_type] => utility [patent_app_number] => 18/519737 [patent_app_country] => US [patent_app_date] => 2023-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 21249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18519737 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/519737
Bonding and Isolation Techniques for Stacked Transistor Structures Nov 26, 2023 Pending
Array ( [id] => 19038261 [patent_doc_number] => 20240088076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR APPARATUS, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS [patent_app_type] => utility [patent_app_number] => 18/515781 [patent_app_country] => US [patent_app_date] => 2023-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3589 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18515781 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/515781
Image pickup unit having resin in via holes for an endoscope Nov 20, 2023 Issued
Array ( [id] => 19610935 [patent_doc_number] => 12159816 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-03 [patent_title] => Semiconductor device with lead between a plurality of encapsulated MOSFETs [patent_app_type] => utility [patent_app_number] => 18/492586 [patent_app_country] => US [patent_app_date] => 2023-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 26 [patent_no_of_words] => 13875 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18492586 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/492586
Semiconductor device with lead between a plurality of encapsulated MOSFETs Oct 22, 2023 Issued
Array ( [id] => 18959114 [patent_doc_number] => 20240047441 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/490855 [patent_app_country] => US [patent_app_date] => 2023-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8748 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18490855 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/490855
PACKAGE STRUCTURE Oct 19, 2023 Pending
Array ( [id] => 18943473 [patent_doc_number] => 20240038612 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT [patent_app_type] => utility [patent_app_number] => 18/380276 [patent_app_country] => US [patent_app_date] => 2023-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12430 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18380276 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/380276
Package with electrically insulated carrier and at least one step on encapsulant Oct 15, 2023 Issued
Array ( [id] => 18927139 [patent_doc_number] => 20240030143 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES [patent_app_type] => utility [patent_app_number] => 18/377183 [patent_app_country] => US [patent_app_date] => 2023-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6387 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18377183 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/377183
Power delivery for embedded bridge die utilizing trench structures Oct 4, 2023 Issued
Array ( [id] => 19781705 [patent_doc_number] => 12230744 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-18 [patent_title] => Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa [patent_app_type] => utility [patent_app_number] => 18/370649 [patent_app_country] => US [patent_app_date] => 2023-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 21398 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18370649 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/370649
Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa Sep 19, 2023 Issued
Array ( [id] => 20793089 [patent_doc_number] => 12667023 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-23 [patent_title] => Package device including capacitor disposed on opposite side of die relative to substrate [patent_app_type] => utility [patent_app_number] => 18/467062 [patent_app_country] => US [patent_app_date] => 2023-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 7020 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18467062 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/467062
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE Sep 13, 2023 Issued
Array ( [id] => 19040425 [patent_doc_number] => 20240090240 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => INTEGRATED CIRCUIT DEVICE [patent_app_type] => utility [patent_app_number] => 18/367704 [patent_app_country] => US [patent_app_date] => 2023-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10007 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18367704 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/367704
INTEGRATED CIRCUIT DEVICE Sep 12, 2023 Pending
Array ( [id] => 18851281 [patent_doc_number] => 20230413685 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => METHOD OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM) [patent_app_type] => utility [patent_app_number] => 18/232576 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5121 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232576 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/232576
METHOD OF MANUFACTURING A MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM) Aug 9, 2023 Abandoned
Array ( [id] => 18810337 [patent_doc_number] => 20230384672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => Polymer Layer in Semiconductor Device and Method of Manufacture [patent_app_type] => utility [patent_app_number] => 18/446562 [patent_app_country] => US [patent_app_date] => 2023-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13809 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18446562 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/446562
Polymer material in a redistribution structure of a semiconductor package and method of manufacture Aug 8, 2023 Issued
Array ( [id] => 18789411 [patent_doc_number] => 20230378073 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/363769 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9883 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363769 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363769
Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof Aug 1, 2023 Issued
Array ( [id] => 18812654 [patent_doc_number] => 20230386991 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/363766 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13008 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363766 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363766
Encircling a semiconductor device with stacked frames on a substrate Aug 1, 2023 Issued
Array ( [id] => 19007805 [patent_doc_number] => 20240071876 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/359098 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10710 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359098 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359098
SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD Jul 25, 2023 Pending
Array ( [id] => 19428220 [patent_doc_number] => 12087654 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-10 [patent_title] => Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region [patent_app_type] => utility [patent_app_number] => 18/358914 [patent_app_country] => US [patent_app_date] => 2023-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 28 [patent_no_of_words] => 11115 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358914 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/358914
Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region Jul 24, 2023 Issued
Array ( [id] => 20118422 [patent_doc_number] => 12368141 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-22 [patent_title] => IPD modules with flexible connection scheme in packaging [patent_app_type] => utility [patent_app_number] => 18/357457 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 34 [patent_no_of_words] => 2070 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357457 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/357457
IPD modules with flexible connection scheme in packaging Jul 23, 2023 Issued
Array ( [id] => 19670878 [patent_doc_number] => 12183649 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-31 [patent_title] => IC package including multi-chip unit with bonded integrated heat spreader [patent_app_type] => utility [patent_app_number] => 18/222855 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 7420 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 334 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222855 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/222855
IC package including multi-chip unit with bonded integrated heat spreader Jul 16, 2023 Issued
Array ( [id] => 19546509 [patent_doc_number] => 20240363545 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/352952 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3639 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352952 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/352952
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Jul 13, 2023 Issued
Array ( [id] => 19460157 [patent_doc_number] => 12100664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-24 [patent_title] => Semiconductor device with curved conductive lines and method of forming the same [patent_app_type] => utility [patent_app_number] => 18/352595 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8881 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352595 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/352595
Semiconductor device with curved conductive lines and method of forming the same Jul 13, 2023 Issued
Array ( [id] => 19124901 [patent_doc_number] => 11968909 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-23 [patent_title] => Method of manufacturing a magnetoresistive random access memory (MRAM) [patent_app_type] => utility [patent_app_number] => 18/219320 [patent_app_country] => US [patent_app_date] => 2023-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 5113 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18219320 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/219320
Method of manufacturing a magnetoresistive random access memory (MRAM) Jul 6, 2023 Issued
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