| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3453191
[patent_doc_number] => 05451542
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-09-19
[patent_title] => 'Surface passivation process of compound semiconductor material using UV photosulfidation'
[patent_app_type] => 1
[patent_app_number] => 8/263107
[patent_app_country] => US
[patent_app_date] => 1994-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/05/451/05451542.pdf
[firstpage_image] =>[orig_patent_app_number] => 263107
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/263107 | Surface passivation process of compound semiconductor material using UV photosulfidation | Jun 20, 1994 | Issued |
| 08/260213 | THIN SILICON OXIDE FILM WITH HIGH DIELECTRIC BREAKDOWN AND HOT CARRIER RESISTANCE | Jun 13, 1994 | Abandoned |
Array
(
[id] => 3685805
[patent_doc_number] => 05663098
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-02
[patent_title] => 'Method for deposition of a conductor in integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/258911
[patent_app_country] => US
[patent_app_date] => 1994-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_words_short_claim] => 144
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/663/05663098.pdf
[firstpage_image] =>[orig_patent_app_number] => 258911
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/258911 | Method for deposition of a conductor in integrated circuits | Jun 12, 1994 | Issued |
Array
(
[id] => 3117385
[patent_doc_number] => 05380671
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-01-10
[patent_title] => 'Method of making non-trenched buried contact for VLSI devices'
[patent_app_type] => 1
[patent_app_number] => 8/258717
[patent_app_country] => US
[patent_app_date] => 1994-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1653
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/380/05380671.pdf
[firstpage_image] =>[orig_patent_app_number] => 258717
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/258717 | Method of making non-trenched buried contact for VLSI devices | Jun 12, 1994 | Issued |
Array
(
[id] => 3561389
[patent_doc_number] => 05525551
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Method for forming insulating film in semiconductor device using a TEOS or HMDS pre-treatment'
[patent_app_type] => 1
[patent_app_number] => 8/255727
[patent_app_country] => US
[patent_app_date] => 1994-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 21
[patent_no_of_words] => 4288
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[pdf_file] => patents/05/525/05525551.pdf
[firstpage_image] =>[orig_patent_app_number] => 255727
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/255727 | Method for forming insulating film in semiconductor device using a TEOS or HMDS pre-treatment | Jun 6, 1994 | Issued |
Array
(
[id] => 3731121
[patent_doc_number] => 05665640
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor'
[patent_app_type] => 1
[patent_app_number] => 8/253393
[patent_app_country] => US
[patent_app_date] => 1994-06-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 15726
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[pdf_file] => patents/05/665/05665640.pdf
[firstpage_image] =>[orig_patent_app_number] => 253393
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/253393 | Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | Jun 2, 1994 | Issued |
Array
(
[id] => 3534509
[patent_doc_number] => 05544773
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-13
[patent_title] => 'Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method'
[patent_app_type] => 1
[patent_app_number] => 8/252928
[patent_app_country] => US
[patent_app_date] => 1994-06-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/544/05544773.pdf
[firstpage_image] =>[orig_patent_app_number] => 252928
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/252928 | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method | Jun 1, 1994 | Issued |
| 08/250983 | RELIABILITY OF METAL LEADS IN HIGH SPEED LSI SEMICONDUCTORS USING DUMMY LEADS | May 30, 1994 | Abandoned |
Array
(
[id] => 3405723
[patent_doc_number] => 05460693
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-24
[patent_title] => 'Dry microlithography process'
[patent_app_type] => 1
[patent_app_number] => 8/250691
[patent_app_country] => US
[patent_app_date] => 1994-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 15
[patent_no_of_words] => 3003
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 149
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/460/05460693.pdf
[firstpage_image] =>[orig_patent_app_number] => 250691
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/250691 | Dry microlithography process | May 30, 1994 | Issued |
| 08/250985 | CONSTRUCTION THAT PREVENTS THE UNDERCUT OF INTERCONNECT LINES IN PLASMA METAL ETCH SYSTEMS | May 30, 1994 | Abandoned |
Array
(
[id] => 3424615
[patent_doc_number] => 05422288
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-06
[patent_title] => 'Method of doping a JFET region in a MOS-gated semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/246307
[patent_app_country] => US
[patent_app_date] => 1994-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 1749
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/422/05422288.pdf
[firstpage_image] =>[orig_patent_app_number] => 246307
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/246307 | Method of doping a JFET region in a MOS-gated semiconductor device | May 18, 1994 | Issued |
Array
(
[id] => 3426637
[patent_doc_number] => 05403752
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-04
[patent_title] => 'Method for manufacturing a pyrodetector apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/242243
[patent_app_country] => US
[patent_app_date] => 1994-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/403/05403752.pdf
[firstpage_image] =>[orig_patent_app_number] => 242243
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/242243 | Method for manufacturing a pyrodetector apparatus | May 12, 1994 | Issued |
Array
(
[id] => 3112258
[patent_doc_number] => 05464794
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-07
[patent_title] => 'Method of forming contact openings having concavo-concave shape'
[patent_app_type] => 1
[patent_app_number] => 8/241005
[patent_app_country] => US
[patent_app_date] => 1994-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/464/05464794.pdf
[firstpage_image] =>[orig_patent_app_number] => 241005
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/241005 | Method of forming contact openings having concavo-concave shape | May 10, 1994 | Issued |
| 08/241277 | METHOD OF MAKING SUBTRACTIVE RIM PHASE SHIFTING MASKS | May 10, 1994 | Abandoned |
Array
(
[id] => 3592408
[patent_doc_number] => 05488010
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-01-30
[patent_title] => 'Method of fabricating sidewall charge-coupled device with trench isolation'
[patent_app_type] => 1
[patent_app_number] => 8/241137
[patent_app_country] => US
[patent_app_date] => 1994-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/05/488/05488010.pdf
[firstpage_image] =>[orig_patent_app_number] => 241137
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/241137 | Method of fabricating sidewall charge-coupled device with trench isolation | May 9, 1994 | Issued |
Array
(
[id] => 3665711
[patent_doc_number] => 05599746
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-04
[patent_title] => 'Method to eliminate polycide peeling at wafer edge using extended scribe lines'
[patent_app_type] => 1
[patent_app_number] => 8/239229
[patent_app_country] => US
[patent_app_date] => 1994-05-06
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 239229
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/239229 | Method to eliminate polycide peeling at wafer edge using extended scribe lines | May 5, 1994 | Issued |
Array
(
[id] => 3411106
[patent_doc_number] => 05411913
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-02
[patent_title] => 'Simple planarized trench isolation and field oxide formation using poly-silicon'
[patent_app_type] => 1
[patent_app_number] => 8/236387
[patent_app_country] => US
[patent_app_date] => 1994-04-29
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[pdf_file] => patents/05/411/05411913.pdf
[firstpage_image] =>[orig_patent_app_number] => 236387
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/236387 | Simple planarized trench isolation and field oxide formation using poly-silicon | Apr 28, 1994 | Issued |
Array
(
[id] => 3574484
[patent_doc_number] => 05523258
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-04
[patent_title] => 'Method for avoiding lithographic rounding effects for semiconductor fabrication'
[patent_app_type] => 1
[patent_app_number] => 8/235509
[patent_app_country] => US
[patent_app_date] => 1994-04-29
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[pdf_file] => patents/05/523/05523258.pdf
[firstpage_image] =>[orig_patent_app_number] => 235509
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/235509 | Method for avoiding lithographic rounding effects for semiconductor fabrication | Apr 28, 1994 | Issued |
Array
(
[id] => 3553232
[patent_doc_number] => 05518967
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Process for producing a semiconductor device capable of planarizing a metal film surface thereon'
[patent_app_type] => 1
[patent_app_number] => 8/234017
[patent_app_country] => US
[patent_app_date] => 1994-04-28
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[pdf_file] => patents/05/518/05518967.pdf
[firstpage_image] =>[orig_patent_app_number] => 234017
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/234017 | Process for producing a semiconductor device capable of planarizing a metal film surface thereon | Apr 27, 1994 | Issued |
Array
(
[id] => 3495759
[patent_doc_number] => 05532174
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-02
[patent_title] => 'Wafer level integrated circuit testing with a sacrificial metal layer'
[patent_app_type] => 1
[patent_app_number] => 8/232963
[patent_app_country] => US
[patent_app_date] => 1994-04-22
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[pdf_file] => patents/05/532/05532174.pdf
[firstpage_image] =>[orig_patent_app_number] => 232963
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/232963 | Wafer level integrated circuit testing with a sacrificial metal layer | Apr 21, 1994 | Issued |