
Thomas G. Bilodeau
Examiner (ID: 16656)
| Most Active Art Unit | 1107 |
| Art Unit(s) | 1107, 2812 |
| Total Applications | 354 |
| Issued Applications | 289 |
| Pending Applications | 4 |
| Abandoned Applications | 61 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3768888
[patent_doc_number] => 05733816
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-31
[patent_title] => 'Method for depositing a tungsten layer on silicon'
[patent_app_type] => 1
[patent_app_number] => 8/572164
[patent_app_country] => US
[patent_app_date] => 1995-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 3029
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/733/05733816.pdf
[firstpage_image] =>[orig_patent_app_number] => 572164
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/572164 | Method for depositing a tungsten layer on silicon | Dec 12, 1995 | Issued |
Array
(
[id] => 3657816
[patent_doc_number] => 05627102
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-06
[patent_title] => 'Method for making metal interconnection with chlorine plasma etch'
[patent_app_type] => 1
[patent_app_number] => 8/569319
[patent_app_country] => US
[patent_app_date] => 1995-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 42
[patent_no_of_words] => 14886
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/627/05627102.pdf
[firstpage_image] =>[orig_patent_app_number] => 569319
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569319 | Method for making metal interconnection with chlorine plasma etch | Dec 7, 1995 | Issued |
Array
(
[id] => 3627377
[patent_doc_number] => 05686359
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-11
[patent_title] => 'Titanium silicide process'
[patent_app_type] => 1
[patent_app_number] => 8/569025
[patent_app_country] => US
[patent_app_date] => 1995-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2261
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 220
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/686/05686359.pdf
[firstpage_image] =>[orig_patent_app_number] => 569025
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569025 | Titanium silicide process | Dec 6, 1995 | Issued |
Array
(
[id] => 3855869
[patent_doc_number] => 05705432
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-06
[patent_title] => 'Process for providing clean lift-off of sputtered thin film layers'
[patent_app_type] => 1
[patent_app_number] => 8/566197
[patent_app_country] => US
[patent_app_date] => 1995-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 3319
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 245
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/705/05705432.pdf
[firstpage_image] =>[orig_patent_app_number] => 566197
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/566197 | Process for providing clean lift-off of sputtered thin film layers | Nov 30, 1995 | Issued |
Array
(
[id] => 3620097
[patent_doc_number] => 05688717
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-18
[patent_title] => 'Construction that prevents the undercut of interconnect lines in plasma metal etch systems'
[patent_app_type] => 1
[patent_app_number] => 8/565308
[patent_app_country] => US
[patent_app_date] => 1995-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1507
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/688/05688717.pdf
[firstpage_image] =>[orig_patent_app_number] => 565308
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/565308 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Nov 29, 1995 | Issued |
| 08/561772 | METHOD FOR FORMING A WIRING METAL LAYER IN A SEMICONDUCTOR DEVICE | Nov 21, 1995 | Abandoned |
Array
(
[id] => 3838152
[patent_doc_number] => 05766271
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-16
[patent_title] => 'Process for producing solid electrolyte capacitor'
[patent_app_type] => 1
[patent_app_number] => 8/562063
[patent_app_country] => US
[patent_app_date] => 1995-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 18
[patent_no_of_words] => 6851
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/766/05766271.pdf
[firstpage_image] =>[orig_patent_app_number] => 562063
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/562063 | Process for producing solid electrolyte capacitor | Nov 21, 1995 | Issued |
Array
(
[id] => 3785713
[patent_doc_number] => 05736422
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-07
[patent_title] => 'Method for depositing a platinum layer on a silicon wafer'
[patent_app_type] => 1
[patent_app_number] => 8/562371
[patent_app_country] => US
[patent_app_date] => 1995-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 4468
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/736/05736422.pdf
[firstpage_image] =>[orig_patent_app_number] => 562371
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/562371 | Method for depositing a platinum layer on a silicon wafer | Nov 21, 1995 | Issued |
Array
(
[id] => 3694098
[patent_doc_number] => 05650353
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-22
[patent_title] => 'Method for production of SOI substrate'
[patent_app_type] => 1
[patent_app_number] => 8/561166
[patent_app_country] => US
[patent_app_date] => 1995-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5210
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 194
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/650/05650353.pdf
[firstpage_image] =>[orig_patent_app_number] => 561166
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/561166 | Method for production of SOI substrate | Nov 20, 1995 | Issued |
Array
(
[id] => 3655891
[patent_doc_number] => 05667536
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Process for making a tantalum capacitor chip'
[patent_app_type] => 1
[patent_app_number] => 8/557483
[patent_app_country] => US
[patent_app_date] => 1995-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 3897
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/667/05667536.pdf
[firstpage_image] =>[orig_patent_app_number] => 557483
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/557483 | Process for making a tantalum capacitor chip | Nov 13, 1995 | Issued |
Array
(
[id] => 3725415
[patent_doc_number] => 05700717
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Method of reducing contact resistance for semiconductor manufacturing processes using tungsten plugs'
[patent_app_type] => 1
[patent_app_number] => 8/557659
[patent_app_country] => US
[patent_app_date] => 1995-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 1600
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/700/05700717.pdf
[firstpage_image] =>[orig_patent_app_number] => 557659
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/557659 | Method of reducing contact resistance for semiconductor manufacturing processes using tungsten plugs | Nov 12, 1995 | Issued |
Array
(
[id] => 3656736
[patent_doc_number] => 05658829
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-19
[patent_title] => 'Semiconductor processing method of forming an electrically conductive contact plug'
[patent_app_type] => 1
[patent_app_number] => 8/551829
[patent_app_country] => US
[patent_app_date] => 1995-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 2125
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/658/05658829.pdf
[firstpage_image] =>[orig_patent_app_number] => 551829
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/551829 | Semiconductor processing method of forming an electrically conductive contact plug | Nov 6, 1995 | Issued |
Array
(
[id] => 3681968
[patent_doc_number] => 05633199
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Process for fabricating a metallized interconnect structure in a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/556787
[patent_app_country] => US
[patent_app_date] => 1995-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2640
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633199.pdf
[firstpage_image] =>[orig_patent_app_number] => 556787
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/556787 | Process for fabricating a metallized interconnect structure in a semiconductor device | Nov 1, 1995 | Issued |
Array
(
[id] => 3586086
[patent_doc_number] => 05552340
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-03
[patent_title] => 'Nitridation of titanium, for use with tungsten filled contact holes'
[patent_app_type] => 1
[patent_app_number] => 8/549262
[patent_app_country] => US
[patent_app_date] => 1995-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2715
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 253
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/552/05552340.pdf
[firstpage_image] =>[orig_patent_app_number] => 549262
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/549262 | Nitridation of titanium, for use with tungsten filled contact holes | Oct 26, 1995 | Issued |
Array
(
[id] => 3658041
[patent_doc_number] => 05591672
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-07
[patent_title] => 'Annealing of titanium - titanium nitride in contact hole'
[patent_app_type] => 1
[patent_app_number] => 8/549263
[patent_app_country] => US
[patent_app_date] => 1995-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2644
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 250
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/591/05591672.pdf
[firstpage_image] =>[orig_patent_app_number] => 549263
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/549263 | Annealing of titanium - titanium nitride in contact hole | Oct 26, 1995 | Issued |
| 08/547505 | PROCESS FOR FORMATION OF CONTACT CONDUCTIVE LAYER IN A SEMICONDUCTOR DEVICE | Oct 23, 1995 | Abandoned |
Array
(
[id] => 3690908
[patent_doc_number] => 05604154
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-02-18
[patent_title] => 'Method of manufacturing coulamb blockade element using thermal oxidation'
[patent_app_type] => 1
[patent_app_number] => 8/546529
[patent_app_country] => US
[patent_app_date] => 1995-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 59
[patent_no_of_words] => 13853
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/604/05604154.pdf
[firstpage_image] =>[orig_patent_app_number] => 546529
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/546529 | Method of manufacturing coulamb blockade element using thermal oxidation | Oct 19, 1995 | Issued |
Array
(
[id] => 3586125
[patent_doc_number] => 05552343
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-03
[patent_title] => 'Method for tapered contact formation'
[patent_app_type] => 1
[patent_app_number] => 8/545385
[patent_app_country] => US
[patent_app_date] => 1995-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 1388
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 151
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/552/05552343.pdf
[firstpage_image] =>[orig_patent_app_number] => 545385
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/545385 | Method for tapered contact formation | Oct 18, 1995 | Issued |
Array
(
[id] => 3660589
[patent_doc_number] => 05656542
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-12
[patent_title] => 'Method for manufacturing wiring in groove'
[patent_app_type] => 1
[patent_app_number] => 8/544453
[patent_app_country] => US
[patent_app_date] => 1995-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 17
[patent_no_of_words] => 2683
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 23
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/656/05656542.pdf
[firstpage_image] =>[orig_patent_app_number] => 544453
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/544453 | Method for manufacturing wiring in groove | Oct 17, 1995 | Issued |
Array
(
[id] => 3875126
[patent_doc_number] => 05747361
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-05
[patent_title] => 'Stabilization of the interface between aluminum and titanium nitride'
[patent_app_type] => 1
[patent_app_number] => 8/543497
[patent_app_country] => US
[patent_app_date] => 1995-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 11666
[patent_no_of_claims] => 12
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/747/05747361.pdf
[firstpage_image] =>[orig_patent_app_number] => 543497
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/543497 | Stabilization of the interface between aluminum and titanium nitride | Oct 15, 1995 | Issued |