
Thomas G. Black
Supervisory Patent Examiner (ID: 5061, Phone: (571)272-6956 , Office: P/3661 )
| Most Active Art Unit | 2304 |
| Art Unit(s) | 3663, 2771, 3661, 2307, 2304, 2171 |
| Total Applications | 686 |
| Issued Applications | 577 |
| Pending Applications | 10 |
| Abandoned Applications | 99 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3686774
[patent_doc_number] => 05643802
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-01
[patent_title] => 'Method of producing a semiconductor device by gang bonding followed by point bonding'
[patent_app_type] => 1
[patent_app_number] => 8/634443
[patent_app_country] => US
[patent_app_date] => 1996-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 3275
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/643/05643802.pdf
[firstpage_image] =>[orig_patent_app_number] => 634443
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/634443 | Method of producing a semiconductor device by gang bonding followed by point bonding | Apr 17, 1996 | Issued |
Array
(
[id] => 3723054
[patent_doc_number] => 05672547
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-30
[patent_title] => 'Method for bonding a heat sink to a die paddle'
[patent_app_type] => 1
[patent_app_number] => 8/594497
[patent_app_country] => US
[patent_app_date] => 1996-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 3554
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/672/05672547.pdf
[firstpage_image] =>[orig_patent_app_number] => 594497
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/594497 | Method for bonding a heat sink to a die paddle | Jan 30, 1996 | Issued |
Array
(
[id] => 3696807
[patent_doc_number] => 05677203
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-14
[patent_title] => 'Method for providing known good bare semiconductor die'
[patent_app_type] => 1
[patent_app_number] => 8/556877
[patent_app_country] => US
[patent_app_date] => 1995-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 4252
[patent_no_of_claims] => 16
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[patent_words_short_claim] => 166
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/677/05677203.pdf
[firstpage_image] =>[orig_patent_app_number] => 556877
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/556877 | Method for providing known good bare semiconductor die | Nov 1, 1995 | Issued |
Array
(
[id] => 3656708
[patent_doc_number] => 05658827
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-19
[patent_title] => 'Method for forming solder balls on a substrate'
[patent_app_type] => 1
[patent_app_number] => 8/558577
[patent_app_country] => US
[patent_app_date] => 1995-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 16
[patent_no_of_words] => 4431
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 201
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/658/05658827.pdf
[firstpage_image] =>[orig_patent_app_number] => 558577
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/558577 | Method for forming solder balls on a substrate | Oct 30, 1995 | Issued |
Array
(
[id] => 3587489
[patent_doc_number] => 05550090
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-27
[patent_title] => 'Method for fabricating a monolithic semiconductor device with integrated surface micromachined structures'
[patent_app_type] => 1
[patent_app_number] => 8/523581
[patent_app_country] => US
[patent_app_date] => 1995-09-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 2938
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/550/05550090.pdf
[firstpage_image] =>[orig_patent_app_number] => 523581
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/523581 | Method for fabricating a monolithic semiconductor device with integrated surface micromachined structures | Sep 4, 1995 | Issued |
Array
(
[id] => 3686764
[patent_doc_number] => 05643801
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-01
[patent_title] => 'Laser processing method and alignment'
[patent_app_type] => 1
[patent_app_number] => 8/511466
[patent_app_country] => US
[patent_app_date] => 1995-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 26
[patent_no_of_words] => 7250
[patent_no_of_claims] => 4
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[patent_words_short_claim] => 131
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/643/05643801.pdf
[firstpage_image] =>[orig_patent_app_number] => 511466
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/511466 | Laser processing method and alignment | Aug 3, 1995 | Issued |
Array
(
[id] => 3597024
[patent_doc_number] => 05578224
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-26
[patent_title] => 'Method of making micromachined device with ground plane under sensor'
[patent_app_type] => 1
[patent_app_number] => 8/486894
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1401
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/578/05578224.pdf
[firstpage_image] =>[orig_patent_app_number] => 486894
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/486894 | Method of making micromachined device with ground plane under sensor | Jun 6, 1995 | Issued |
Array
(
[id] => 3660308
[patent_doc_number] => 05656524
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-12
[patent_title] => 'Method of forming a polysilicon resistor using an oxide, nitride stack'
[patent_app_type] => 1
[patent_app_number] => 8/478301
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 11
[patent_no_of_words] => 4586
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/656/05656524.pdf
[firstpage_image] =>[orig_patent_app_number] => 478301
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/478301 | Method of forming a polysilicon resistor using an oxide, nitride stack | Jun 6, 1995 | Issued |
Array
(
[id] => 3517597
[patent_doc_number] => 05506171
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-04-09
[patent_title] => 'Method of clean up of a patterned metal layer'
[patent_app_type] => 1
[patent_app_number] => 8/485201
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2412
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/506/05506171.pdf
[firstpage_image] =>[orig_patent_app_number] => 485201
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/485201 | Method of clean up of a patterned metal layer | Jun 6, 1995 | Issued |
Array
(
[id] => 3700297
[patent_doc_number] => 05646069
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-08
[patent_title] => 'Fabrication process for Al.sub.x In.sub.1-x As/Ga.sub.y In.sub.1-y As power HFET ohmic contacts'
[patent_app_type] => 1
[patent_app_number] => 8/472165
[patent_app_country] => US
[patent_app_date] => 1995-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3909
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/646/05646069.pdf
[firstpage_image] =>[orig_patent_app_number] => 472165
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/472165 | Fabrication process for Al.sub.x In.sub.1-x As/Ga.sub.y In.sub.1-y As power HFET ohmic contacts | Jun 6, 1995 | Issued |
Array
(
[id] => 3643394
[patent_doc_number] => 05639385
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-17
[patent_title] => 'Method of fabricating a wafer probe card for testing an integrated circuit die'
[patent_app_type] => 1
[patent_app_number] => 8/470741
[patent_app_country] => US
[patent_app_date] => 1995-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 18549
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 239
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/639/05639385.pdf
[firstpage_image] =>[orig_patent_app_number] => 470741
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/470741 | Method of fabricating a wafer probe card for testing an integrated circuit die | Jun 5, 1995 | Issued |
Array
(
[id] => 3509657
[patent_doc_number] => 05587337
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-24
[patent_title] => 'Semiconductor process for forming bump electrodes with tapered sidewalls'
[patent_app_type] => 1
[patent_app_number] => 8/444513
[patent_app_country] => US
[patent_app_date] => 1995-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 20
[patent_no_of_words] => 4035
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/587/05587337.pdf
[firstpage_image] =>[orig_patent_app_number] => 444513
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/444513 | Semiconductor process for forming bump electrodes with tapered sidewalls | May 18, 1995 | Issued |
Array
(
[id] => 3682026
[patent_doc_number] => 05633203
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-05-27
[patent_title] => 'Method of making a miniaturized electronic imaging chip from a standard imaging chip'
[patent_app_type] => 1
[patent_app_number] => 8/435997
[patent_app_country] => US
[patent_app_date] => 1995-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2081
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 211
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/633/05633203.pdf
[firstpage_image] =>[orig_patent_app_number] => 435997
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/435997 | Method of making a miniaturized electronic imaging chip from a standard imaging chip | May 4, 1995 | Issued |
| 08/414841 | INTEGRATED MULTICHIP MEMORY MODULE, STRUCTURE AND FABRICATION | Mar 30, 1995 | Abandoned |
Array
(
[id] => 3731311
[patent_doc_number] => 05665653
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Method for encapsulating an electrochemical sensor'
[patent_app_type] => 1
[patent_app_number] => 8/412705
[patent_app_country] => US
[patent_app_date] => 1995-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 19
[patent_no_of_words] => 5103
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[pdf_file] => patents/05/665/05665653.pdf
[firstpage_image] =>[orig_patent_app_number] => 412705
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/412705 | Method for encapsulating an electrochemical sensor | Mar 28, 1995 | Issued |
Array
(
[id] => 3625060
[patent_doc_number] => 05620924
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-15
[patent_title] => 'Method of preventing deterioration of film quality of transparent conductive film'
[patent_app_type] => 1
[patent_app_number] => 8/407957
[patent_app_country] => US
[patent_app_date] => 1995-03-22
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[pdf_file] => patents/05/620/05620924.pdf
[firstpage_image] =>[orig_patent_app_number] => 407957
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/407957 | Method of preventing deterioration of film quality of transparent conductive film | Mar 21, 1995 | Issued |
Array
(
[id] => 3619559
[patent_doc_number] => 05614421
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-25
[patent_title] => 'Method of fabricating junction termination extension structure for high-voltage diode devices'
[patent_app_type] => 1
[patent_app_number] => 8/364611
[patent_app_country] => US
[patent_app_date] => 1994-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2220
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/614/05614421.pdf
[firstpage_image] =>[orig_patent_app_number] => 364611
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/364611 | Method of fabricating junction termination extension structure for high-voltage diode devices | Dec 26, 1994 | Issued |
Array
(
[id] => 3547167
[patent_doc_number] => 05573634
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-12
[patent_title] => 'Method for forming contact holes of a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/362145
[patent_app_country] => US
[patent_app_date] => 1994-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2057
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[pdf_file] => patents/05/573/05573634.pdf
[firstpage_image] =>[orig_patent_app_number] => 362145
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/362145 | Method for forming contact holes of a semiconductor device | Dec 21, 1994 | Issued |
Array
(
[id] => 3489220
[patent_doc_number] => 05560837
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-01
[patent_title] => 'Method of making ink-jet component'
[patent_app_type] => 1
[patent_app_number] => 8/336405
[patent_app_country] => US
[patent_app_date] => 1994-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/05/560/05560837.pdf
[firstpage_image] =>[orig_patent_app_number] => 336405
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/336405 | Method of making ink-jet component | Nov 7, 1994 | Issued |
| 08/330212 | METHOD FOR REMOVING CERAMIC MATERIAL FROM CASTINGS USING CAUSTIC MEDIUM WITH OXYGEN GETTER | Oct 23, 1994 | Abandoned |