
Thomas M. Sember
Examiner (ID: 15117, Phone: (571)272-2381 , Office: P/2875 )
| Most Active Art Unit | 2875 |
| Art Unit(s) | 2885, 3621, 2215, 2875, 3406 |
| Total Applications | 2990 |
| Issued Applications | 2480 |
| Pending Applications | 151 |
| Abandoned Applications | 381 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5963500
[patent_doc_number] => 20110147923
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-23
[patent_title] => 'Surface Mounting Integrated Circuit Components'
[patent_app_type] => utility
[patent_app_number] => 12/643074
[patent_app_country] => US
[patent_app_date] => 2009-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0147/20110147923.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/643074 | Surface Mounting Integrated Circuit Components | Dec 20, 2009 | Abandoned |
Array
(
[id] => 8470454
[patent_doc_number] => 08299633
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-30
[patent_title] => 'Semiconductor chip device with solder diffusion protection'
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[patent_app_date] => 2009-12-21
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Array
(
[id] => 6495031
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[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME'
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[patent_app_number] => 12/642081
[patent_app_country] => US
[patent_app_date] => 2009-12-18
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Array
(
[id] => 8690571
[patent_doc_number] => 08390100
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-03-05
[patent_title] => 'Conductive oxide electrodes'
[patent_app_type] => utility
[patent_app_number] => 12/653854
[patent_app_country] => US
[patent_app_date] => 2009-12-18
[patent_effective_date] => 0000-00-00
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Array
(
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Array
(
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Array
(
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[patent_doc_number] => 07897983
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[patent_title] => 'Light emitting diode assembly and light emitting diode display device'
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[pdf_file] => patents/07/897/07897983.pdf
[firstpage_image] =>[orig_patent_app_number] => 12613662
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/613662 | Light emitting diode assembly and light emitting diode display device | Nov 5, 2009 | Issued |
Array
(
[id] => 6489702
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[patent_issue_date] => 2010-01-14
[patent_title] => 'Packaging structure, method for manufacturing the same, and method for using the same'
[patent_app_type] => utility
[patent_app_number] => 12/585465
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[patent_app_date] => 2009-09-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/585465 | Packaging structure, method for manufacturing the same, and method for using the same | Sep 15, 2009 | Abandoned |
Array
(
[id] => 6591745
[patent_doc_number] => 20100001390
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[patent_issue_date] => 2010-01-07
[patent_title] => 'SYSTEM IN PACKAGE MODULE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/558361 | SYSTEM IN PACKAGE MODULE | Sep 10, 2009 | Abandoned |
Array
(
[id] => 7545897
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[patent_issue_date] => 2011-11-08
[patent_title] => 'Implementation of a metal barrier in an integrated electronic circuit'
[patent_app_type] => utility
[patent_app_number] => 12/537997
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Array
(
[id] => 5410133
[patent_doc_number] => 20090124032
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[patent_title] => 'Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same'
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[patent_app_number] => 12/314168
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/314168 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same | Dec 4, 2008 | Issued |
Array
(
[id] => 5323242
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[patent_title] => 'Methods of laser surface modification of ceramic packages for underfill spread control and structures formed thereby'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/288933 | Methods of laser surface modification of ceramic packages for underfill spread control and structures formed thereby | Oct 23, 2008 | Abandoned |
Array
(
[id] => 5319937
[patent_doc_number] => 20090057927
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[patent_issue_date] => 2009-03-05
[patent_title] => 'METHOD FOR FORMING INTERLAYER INSULATING FILM IN SEMICONDUCTOR DEVICE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/197335 | Method for forming interlayer insulating film in semiconductor device | Aug 24, 2008 | Issued |
Array
(
[id] => 8215000
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Array
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[patent_title] => 'Method of fabricating a stacked type chip package structure'
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Array
(
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[patent_title] => 'STRUCTURE FOR PREVENTING PAD PEELING'
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Array
(
[id] => 8551067
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/185616 | Integrated circuit package system with concave terminal | Aug 3, 2008 | Issued |