Thomas M. Sember

Array ( [id] => 4752680 [patent_doc_number] => 20080160755 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Method of Forming Interconnection of Semiconductor Device' [patent_app_type] => utility [patent_app_number] => 11/929920 [patent_app_country] => US [patent_app_date] => 2007-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2319 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160755.pdf [firstpage_image] =>[orig_patent_app_number] => 11929920 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4901823 [patent_doc_number] => 20080111235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-15 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/978370 [patent_app_country] => US [patent_app_date] => 2007-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6347 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0111/20080111235.pdf [firstpage_image] =>[orig_patent_app_number] => 11978370 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5293730 [patent_doc_number] => 20090008656 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-08 [patent_title] => 'Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/976340 [patent_app_country] => US [patent_app_date] => 2007-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3004 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20090008656.pdf [firstpage_image] =>[orig_patent_app_number] => 11976340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4890788 [patent_doc_number] => 20080099885 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-01 [patent_title] => 'SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/877520 [patent_app_country] => US [patent_app_date] => 2007-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4788 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20080099885.pdf [firstpage_image] =>[orig_patent_app_number] => 11877520 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4582497 [patent_doc_number] => 07851267 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-14 [patent_title] => 'Power semiconductor module method' [patent_app_type] => utility [patent_app_number] => 11/874550 [patent_app_country] => US [patent_app_date] => 2007-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 5959 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/851/07851267.pdf [firstpage_image] =>[orig_patent_app_number] => 11874550 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5584559 [patent_doc_number] => 20090103761 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-23 [patent_title] => 'REMOVABLE MICROPHONE' [patent_app_type] => utility [patent_app_number] => 11/873591 [patent_app_country] => US [patent_app_date] => 2007-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1248 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0103/20090103761.pdf [firstpage_image] =>[orig_patent_app_number] => 11873591 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4523132 [patent_doc_number] => 07951666 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-31 [patent_title] => 'Deep trench capacitor and method' [patent_app_type] => utility [patent_app_number] => 11/872970 [patent_app_country] => US [patent_app_date] => 2007-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 7282 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 297 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/951/07951666.pdf [firstpage_image] =>[orig_patent_app_number] => 11872970 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4743421 [patent_doc_number] => 20080088022 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'IMPLEMENTATION OF A METAL BARRIER IN AN INTEGRATED ELECTRONIC CIRCUIT' [patent_app_type] => utility [patent_app_number] => 11/871860 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4287 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088022.pdf [firstpage_image] =>[orig_patent_app_number] => 11871860 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7713459 [patent_doc_number] => 08093702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-10 [patent_title] => 'Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices' [patent_app_type] => utility [patent_app_number] => 11/871340 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 24 [patent_no_of_words] => 4606 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/093/08093702.pdf [firstpage_image] =>[orig_patent_app_number] => 11871340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4743370 [patent_doc_number] => 20080087971 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Method for manufacturing capacitive sensor, and capacitive sensor' [patent_app_type] => utility [patent_app_number] => 11/907330 [patent_app_country] => US [patent_app_date] => 2007-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3754 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20080087971.pdf [firstpage_image] =>[orig_patent_app_number] => 11907330 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4825969 [patent_doc_number] => 20080124891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-29 [patent_title] => 'Method for Preventing Wafer Edge Peeling in Metal Wiring Process' [patent_app_type] => utility [patent_app_number] => 11/865700 [patent_app_country] => US [patent_app_date] => 2007-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3169 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20080124891.pdf [firstpage_image] =>[orig_patent_app_number] => 11865700 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5428642 [patent_doc_number] => 20090087952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-02 [patent_title] => 'Void free soldering semiconductor chip attachment method for wafer scale chip size' [patent_app_type] => utility [patent_app_number] => 11/865310 [patent_app_country] => US [patent_app_date] => 2007-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3525 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20090087952.pdf [firstpage_image] =>[orig_patent_app_number] => 11865310 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8690578 [patent_doc_number] => 08390107 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-05 [patent_title] => 'Semiconductor device and methods of manufacturing semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/863290 [patent_app_country] => US [patent_app_date] => 2007-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 31 [patent_no_of_words] => 7200 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11863290 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5425797 [patent_doc_number] => 20090085107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-02 [patent_title] => 'Trench MOSFET with thick bottom oxide tub' [patent_app_type] => utility [patent_app_number] => 11/904840 [patent_app_country] => US [patent_app_date] => 2007-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 3110 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0085/20090085107.pdf [firstpage_image] =>[orig_patent_app_number] => 11904840 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4944074 [patent_doc_number] => 20080081399 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-03 [patent_title] => 'Manufacturing Method of Semiconductor Apparatus' [patent_app_type] => utility [patent_app_number] => 11/863120 [patent_app_country] => US [patent_app_date] => 2007-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5159 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20080081399.pdf [firstpage_image] =>[orig_patent_app_number] => 11863120 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4941823 [patent_doc_number] => 20080079146 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-03 [patent_title] => 'Semiconductor-embedded substrate and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/902620 [patent_app_country] => US [patent_app_date] => 2007-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10618 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20080079146.pdf [firstpage_image] =>[orig_patent_app_number] => 11902620 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8018173 [patent_doc_number] => 08138591 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-20 [patent_title] => 'Integrated circuit package system with stacked die' [patent_app_type] => utility [patent_app_number] => 11/860460 [patent_app_country] => US [patent_app_date] => 2007-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 4520 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/138/08138591.pdf [firstpage_image] =>[orig_patent_app_number] => 11860460 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5505743 [patent_doc_number] => 20090078950 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-26 [patent_title] => 'Package structure with replaceable element for light emitting diode' [patent_app_type] => utility [patent_app_number] => 11/902370 [patent_app_country] => US [patent_app_date] => 2007-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2561 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0078/20090078950.pdf [firstpage_image] =>[orig_patent_app_number] => 11902370 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4876715 [patent_doc_number] => 20080150098 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'Multi-chip package' [patent_app_type] => utility [patent_app_number] => 11/898950 [patent_app_country] => US [patent_app_date] => 2007-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2605 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150098.pdf [firstpage_image] =>[orig_patent_app_number] => 11898950 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4770866 [patent_doc_number] => 20080056524 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'Microphone package' [patent_app_type] => utility [patent_app_number] => 11/899321 [patent_app_country] => US [patent_app_date] => 2007-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5024 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20080056524.pdf [firstpage_image] =>[orig_patent_app_number] => 11899321 [rel_patent_id] =>[rel_patent_doc_number] =>)