Thomas Randazzo

Array ( [id] => 6221959 [patent_doc_number] => 20020003296 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-10 [patent_title] => 'Assembly of plurality of semiconductor devices' [patent_app_type] => new [patent_app_number] => 09/901185 [patent_app_country] => US [patent_app_date] => 2001-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4185 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20020003296.pdf [firstpage_image] =>[orig_patent_app_number] => 09901185 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1590898 [patent_doc_number] => 06483181 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-11-19 [patent_title] => 'Multi-chip package' [patent_app_type] => B2 [patent_app_number] => 09/837255 [patent_app_country] => US [patent_app_date] => 2001-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2578 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 264 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/483/06483181.pdf [firstpage_image] =>[orig_patent_app_number] => 09837255 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1561919 [patent_doc_number] => 06437449 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-20 [patent_title] => 'Making semiconductor devices having stacked dies with biased back surfaces' [patent_app_type] => B1 [patent_app_number] => 09/828396 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/437/06437449.pdf [firstpage_image] =>[orig_patent_app_number] => 09828396 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1422703 [patent_doc_number] => 06518661 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-11 [patent_title] => 'Apparatus for metal stack thermal management in semiconductor devices' [patent_app_type] => B1 [patent_app_number] => 09/826576 [patent_app_country] => US [patent_app_date] => 2001-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1961 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518661.pdf [firstpage_image] =>[orig_patent_app_number] => 09826576 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6366290 [patent_doc_number] => 20020117741 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-29 [patent_title] => 'HIGH BANDWIDTH 3D MEMORY PACKAGING TECHNIQUE' [patent_app_type] => new [patent_app_number] => 09/796055 [patent_app_country] => US [patent_app_date] => 2001-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1765 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20020117741.pdf [firstpage_image] =>[orig_patent_app_number] => 09796055 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1502337 [patent_doc_number] => 06486536 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-26 [patent_title] => 'U-shape tape for BOC FBGA package to improve moldability' [patent_app_type] => B1 [patent_app_number] => 09/650125 [patent_app_country] => US [patent_app_date] => 2000-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3188 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/486/06486536.pdf [firstpage_image] =>[orig_patent_app_number] => 09650125 [rel_patent_id] =>[rel_patent_doc_number] =>)