
Tu Tu V Ho
Examiner (ID: 15910, Phone: (571)272-1778 , Office: P/2818 )
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 2804 |
| Issued Applications | 2592 |
| Pending Applications | 124 |
| Abandoned Applications | 142 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11398121
[patent_doc_number] => 20170018658
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-01-19
[patent_title] => 'SOLID-SOURCE DIFFUSED JUNCTION FOR FIN-BASED ELECTRONICS'
[patent_app_type] => utility
[patent_app_number] => 15/121879
[patent_app_country] => US
[patent_app_date] => 2014-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7483
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15121879
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/121879 | Solid-source diffused junction for fin-based electronics | Jul 13, 2014 | Issued |
Array
(
[id] => 10053615
[patent_doc_number] => 09093501
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Interconnection wires of semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 14/322330
[patent_app_country] => US
[patent_app_date] => 2014-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 21
[patent_no_of_words] => 6145
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14322330
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/322330 | Interconnection wires of semiconductor devices | Jul 1, 2014 | Issued |
Array
(
[id] => 10916443
[patent_doc_number] => 20140319462
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'BUFFER LAYER OMEGA GATE'
[patent_app_type] => utility
[patent_app_number] => 14/322017
[patent_app_country] => US
[patent_app_date] => 2014-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 7527
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14322017
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/322017 | Buffer layer omega gate | Jul 1, 2014 | Issued |
Array
(
[id] => 11765198
[patent_doc_number] => 09373649
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-06-21
[patent_title] => 'Array substrate and method for manufacturing the same, and display device'
[patent_app_type] => utility
[patent_app_number] => 14/422342
[patent_app_country] => US
[patent_app_date] => 2014-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 8637
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14422342
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/422342 | Array substrate and method for manufacturing the same, and display device | Jun 29, 2014 | Issued |
Array
(
[id] => 10010771
[patent_doc_number] => 09054302
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-06-09
[patent_title] => 'Perpendicular spin transfer torque memory (STTM) device with enhanced stability and method to form same'
[patent_app_type] => utility
[patent_app_number] => 14/313690
[patent_app_country] => US
[patent_app_date] => 2014-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 7739
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14313690
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/313690 | Perpendicular spin transfer torque memory (STTM) device with enhanced stability and method to form same | Jun 23, 2014 | Issued |
Array
(
[id] => 10787642
[patent_doc_number] => 20160133798
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-05-12
[patent_title] => 'OPTOELECTRONIC COMPONENT INCLUDING A CONVERSION ELEMENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT INCLUDING A CONVERSION ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 14/897343
[patent_app_country] => US
[patent_app_date] => 2014-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 7020
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14897343
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/897343 | Optoelectronic component including a conversion element and method of producing an optoelectronic component including a conversion element | Jun 22, 2014 | Issued |
Array
(
[id] => 10106895
[patent_doc_number] => 09142678
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-09-22
[patent_title] => 'Semiconductor device having fin structure and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 14/308378
[patent_app_country] => US
[patent_app_date] => 2014-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 12
[patent_no_of_words] => 4517
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14308378
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/308378 | Semiconductor device having fin structure and method of manufacturing the same | Jun 17, 2014 | Issued |
Array
(
[id] => 10916579
[patent_doc_number] => 20140319597
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'Methods And Systems For Gate Dimension Control In Multi-Gate Structures For Semiconductor Devices'
[patent_app_type] => utility
[patent_app_number] => 14/302839
[patent_app_country] => US
[patent_app_date] => 2014-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5803
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14302839
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/302839 | Methods and systems for gate dimension control in multi-gate structures for semiconductor devices | Jun 11, 2014 | Issued |
Array
(
[id] => 11043572
[patent_doc_number] => 20160240528
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-08-18
[patent_title] => 'IGBT WITH BUILT-IN DIODE AND MANUFACTURING METHOD THEREFOR'
[patent_app_type] => utility
[patent_app_number] => 14/901622
[patent_app_country] => US
[patent_app_date] => 2014-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5191
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14901622
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/901622 | IGBT with built-in diode and manufacturing method therefor | Jun 8, 2014 | Issued |
Array
(
[id] => 11043652
[patent_doc_number] => 20160240608
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-08-18
[patent_title] => 'FIELD-STOP REVERSE CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR AND MANUFACTURING METHOD THEREFOR'
[patent_app_type] => utility
[patent_app_number] => 14/901606
[patent_app_country] => US
[patent_app_date] => 2014-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3983
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14901606
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/901606 | Field-stop reverse conducting insulated gate bipolar transistor and manufacturing method therefor | Jun 5, 2014 | Issued |
Array
(
[id] => 10993453
[patent_doc_number] => 20160190400
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-30
[patent_title] => 'LIGHT-EMITTING DEVICE PACKAGE, MANUFACTURING METHOD THEREOF, AND VEHICLE LAMP AND BACKLIGHT UNIT INCLUDING SAME'
[patent_app_type] => utility
[patent_app_number] => 14/891304
[patent_app_country] => US
[patent_app_date] => 2014-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 11674
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14891304
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/891304 | Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same | May 12, 2014 | Issued |
Array
(
[id] => 11207945
[patent_doc_number] => 09437577
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-09-06
[patent_title] => 'Package on package structure with pillar bump pins and related method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/273553
[patent_app_country] => US
[patent_app_date] => 2014-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1532
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273553
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273553 | Package on package structure with pillar bump pins and related method thereof | May 8, 2014 | Issued |
Array
(
[id] => 10439120
[patent_doc_number] => 20150324131
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-11-12
[patent_title] => 'SYSTEM AND METHOD FOR MEMORY ALLOCATION IN A MULTICLASS MEMORY SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 14/273751
[patent_app_country] => US
[patent_app_date] => 2014-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 8082
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273751
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273751 | System and method for memory allocation in a multiclass memory system | May 8, 2014 | Issued |
Array
(
[id] => 10111682
[patent_doc_number] => 09147100
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-09-29
[patent_title] => 'Method for enhancing surface characteristics of a fingerprint sensor and structure made of the same'
[patent_app_type] => utility
[patent_app_number] => 14/273743
[patent_app_country] => US
[patent_app_date] => 2014-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 2472
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273743
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273743 | Method for enhancing surface characteristics of a fingerprint sensor and structure made of the same | May 8, 2014 | Issued |
Array
(
[id] => 10440575
[patent_doc_number] => 20150325587
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-11-12
[patent_title] => '3D STACKED IC DEVICE WITH STEPPED SUBSTACK INTERLAYER CONNECTORS'
[patent_app_type] => utility
[patent_app_number] => 14/273206
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 32
[patent_figures_cnt] => 32
[patent_no_of_words] => 8306
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273206
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273206 | 3D stacked IC device with stepped substack interlayer connectors | May 7, 2014 | Issued |
Array
(
[id] => 10343562
[patent_doc_number] => 20150228567
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-08-13
[patent_title] => 'PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/273306
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3183
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273306
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273306 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME | May 7, 2014 | Abandoned |
Array
(
[id] => 10112404
[patent_doc_number] => 09147824
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-09-29
[patent_title] => 'Reactive contacts for 2D layered metal dichalcogenides'
[patent_app_type] => utility
[patent_app_number] => 14/272889
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 10
[patent_no_of_words] => 4685
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14272889
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/272889 | Reactive contacts for 2D layered metal dichalcogenides | May 7, 2014 | Issued |
Array
(
[id] => 10402788
[patent_doc_number] => 20150287797
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-10-08
[patent_title] => 'HIGH-VOLTAGE METAL-OXIDE SEMICONDUCTOR TRANSISTOR AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/273538
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4027
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273538
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273538 | High-voltage metal-oxide semiconductor transistor and method of fabricating the same | May 7, 2014 | Issued |
Array
(
[id] => 10035323
[patent_doc_number] => 09076645
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-07-07
[patent_title] => 'Method of fabricating an interlayer structure of increased elasticity modulus'
[patent_app_type] => utility
[patent_app_number] => 14/272554
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 19
[patent_no_of_words] => 9298
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14272554
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/272554 | Method of fabricating an interlayer structure of increased elasticity modulus | May 7, 2014 | Issued |
Array
(
[id] => 10112253
[patent_doc_number] => 09147672
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-09-29
[patent_title] => 'Three-dimensional multiple chip packages including multiple chip stacks'
[patent_app_type] => utility
[patent_app_number] => 14/273171
[patent_app_country] => US
[patent_app_date] => 2014-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 22
[patent_no_of_words] => 6184
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14273171
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/273171 | Three-dimensional multiple chip packages including multiple chip stacks | May 7, 2014 | Issued |