Search

Usman A. Khan

Examiner (ID: 19051)

Most Active Art Unit
2662
Art Unit(s)
2622, 2637, 2662, 2697, 2698, 2696
Total Applications
1126
Issued Applications
808
Pending Applications
85
Abandoned Applications
252

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19823121 [patent_doc_number] => 20250081328 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-06 [patent_title] => CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES [patent_app_type] => utility [patent_app_number] => 18/285540 [patent_app_country] => US [patent_app_date] => 2022-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4537 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18285540 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/285540
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES Apr 7, 2022 Pending
Array ( [id] => 20434146 [patent_doc_number] => 12504797 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-23 [patent_title] => Thermal management systems for electronic devices and related methods [patent_app_type] => utility [patent_app_number] => 17/712010 [patent_app_country] => US [patent_app_date] => 2022-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 16 [patent_no_of_words] => 5517 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17712010 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/712010
Thermal management systems for electronic devices and related methods Mar 31, 2022 Issued
Array ( [id] => 17738033 [patent_doc_number] => 20220223495 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-14 [patent_title] => READILY ASSEMBLED/DISASSEMBLED COOLING ASSEMBLY FOR IMMERSION COOLED SEMICONDUCTOR CHIP PACKAGE [patent_app_type] => utility [patent_app_number] => 17/711354 [patent_app_country] => US [patent_app_date] => 2022-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8076 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17711354 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/711354
Readily assembled/disassembled cooling assembly for immersion cooled semiconductor chip package Mar 31, 2022 Issued
Array ( [id] => 19029937 [patent_doc_number] => 11929301 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-12 [patent_title] => Package and electronic device [patent_app_type] => utility [patent_app_number] => 17/700717 [patent_app_country] => US [patent_app_date] => 2022-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5336 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 246 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17700717 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/700717
Package and electronic device Mar 21, 2022 Issued
Array ( [id] => 18857339 [patent_doc_number] => 11854934 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Package with heat dissipating substrate [patent_app_type] => utility [patent_app_number] => 17/700720 [patent_app_country] => US [patent_app_date] => 2022-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6286 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17700720 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/700720
Package with heat dissipating substrate Mar 21, 2022 Issued
Array ( [id] => 19018036 [patent_doc_number] => 11924998 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-05 [patent_title] => Hybrid immersion cooling system for rack-mounted electronic assemblies [patent_app_type] => utility [patent_app_number] => 17/701422 [patent_app_country] => US [patent_app_date] => 2022-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 4569 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 336 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17701422 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/701422
Hybrid immersion cooling system for rack-mounted electronic assemblies Mar 21, 2022 Issued
Array ( [id] => 18251941 [patent_doc_number] => 20230078980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP [patent_app_type] => utility [patent_app_number] => 17/696989 [patent_app_country] => US [patent_app_date] => 2022-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5289 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17696989 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/696989
Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip Mar 16, 2022 Issued
Array ( [id] => 20637798 [patent_doc_number] => 12598692 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-07 [patent_title] => Locking tensioner cooling assembly for pluggable electronic component [patent_app_type] => utility [patent_app_number] => 17/697909 [patent_app_country] => US [patent_app_date] => 2022-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 3520 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17697909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/697909
Locking tensioner cooling assembly for pluggable electronic component Mar 16, 2022 Issued
Array ( [id] => 20360162 [patent_doc_number] => 12476167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Semiconductor chip package thermo-mechanical cooling assembly [patent_app_type] => utility [patent_app_number] => 17/696694 [patent_app_country] => US [patent_app_date] => 2022-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 3539 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17696694 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/696694
Semiconductor chip package thermo-mechanical cooling assembly Mar 15, 2022 Issued
Array ( [id] => 18631801 [patent_doc_number] => 20230290706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR [patent_app_type] => utility [patent_app_number] => 17/693003 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12859 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17693003 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/693003
VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR Mar 10, 2022 Pending
Array ( [id] => 17662682 [patent_doc_number] => 20220183147 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR CHIP [patent_app_type] => utility [patent_app_number] => 17/683979 [patent_app_country] => US [patent_app_date] => 2022-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5478 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683979 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/683979
Circuit board having a cooling area above and below a semiconductor chip Feb 28, 2022 Issued
Array ( [id] => 18099743 [patent_doc_number] => 20220418084 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => HEAT DISSIPATION STRUCTURE HAVING HOUSING MADE OF HIGH THERMAL RESISTANCE MATERIAL AND ELECTRONIC APPARATUS HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 17/680341 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2995 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17680341 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/680341
Heat dissipation structure having housing made of high thermal resistance material and electronic apparatus having the same Feb 24, 2022 Issued
Array ( [id] => 18999139 [patent_doc_number] => 11915995 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-27 [patent_title] => Power converter [patent_app_type] => utility [patent_app_number] => 17/677357 [patent_app_country] => US [patent_app_date] => 2022-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 7063 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17677357 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/677357
Power converter Feb 21, 2022 Issued
Array ( [id] => 19048282 [patent_doc_number] => 11937413 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Power electronics module and method for fabricating a power electronics module [patent_app_type] => utility [patent_app_number] => 17/675446 [patent_app_country] => US [patent_app_date] => 2022-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 6148 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 274 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17675446 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/675446
Power electronics module and method for fabricating a power electronics module Feb 17, 2022 Issued
Array ( [id] => 17835523 [patent_doc_number] => 20220272828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => Heat Removal Architecture for Stack-Type Component Carrier With Embedded Component [patent_app_type] => utility [patent_app_number] => 17/650405 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9909 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650405 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/650405
Heat removal architecture for stack-type component carrier with embedded component Feb 8, 2022 Issued
Array ( [id] => 17833648 [patent_doc_number] => 20220270952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => POWER DEVICE, POWER DEVICE ASSEMBLY, AND RELATED APPARATUS [patent_app_type] => utility [patent_app_number] => 17/668158 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13271 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17668158 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/668158
Power device, power device assembly, and related apparatus Feb 8, 2022 Issued
Array ( [id] => 17797603 [patent_doc_number] => 20220256695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-11 [patent_title] => CIRCUIT BOARD [patent_app_type] => utility [patent_app_number] => 17/665651 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5378 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665651 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/665651
CIRCUIT BOARD Feb 6, 2022 Abandoned
Array ( [id] => 20691791 [patent_doc_number] => 12621961 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-05 [patent_title] => Electronic device and product [patent_app_type] => utility [patent_app_number] => 18/261994 [patent_app_country] => US [patent_app_date] => 2022-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 64 [patent_no_of_words] => 0 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18261994 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/261994
Electronic device and product Jan 18, 2022 Issued
Array ( [id] => 19010051 [patent_doc_number] => 20240074122 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => Power Semiconductor Device and Method of Manufacturing the Same, and Power Conversion Device [patent_app_type] => utility [patent_app_number] => 18/258037 [patent_app_country] => US [patent_app_date] => 2022-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8742 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18258037 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/258037
Power semiconductor device and method of manufacturing the same, and power conversion device Jan 13, 2022 Issued
Array ( [id] => 17764799 [patent_doc_number] => 20220238412 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-28 [patent_title] => ELASTIC THERMAL CONNECTION STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/572974 [patent_app_country] => US [patent_app_date] => 2022-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5803 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572974 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/572974
ELASTIC THERMAL CONNECTION STRUCTURE Jan 10, 2022 Abandoned
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