Search

Viren A. Thakur

Examiner (ID: 7657, Phone: (571)272-6694 , Office: P/1792 )

Most Active Art Unit
1792
Art Unit(s)
1794, 1792, 1782, 1761
Total Applications
1003
Issued Applications
117
Pending Applications
125
Abandoned Applications
778

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18209943 [patent_doc_number] => 20230056204 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 17/441182 [patent_app_country] => US [patent_app_date] => 2021-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5436 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17441182 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/441182
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME Jun 29, 2021 Abandoned
Array ( [id] => 18097396 [patent_doc_number] => 20220415737 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/358001 [patent_app_country] => US [patent_app_date] => 2021-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17358001 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/358001
Semiconductor device and manufacturing method thereof Jun 24, 2021 Issued
Array ( [id] => 18767014 [patent_doc_number] => 11817426 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/337594 [patent_app_country] => US [patent_app_date] => 2021-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 46 [patent_no_of_words] => 14278 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17337594 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/337594
Package and method of fabricating the same Jun 2, 2021 Issued
Array ( [id] => 18857332 [patent_doc_number] => 11854927 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semiconductor package and method of forming same [patent_app_type] => utility [patent_app_number] => 17/333399 [patent_app_country] => US [patent_app_date] => 2021-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 22 [patent_no_of_words] => 11074 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17333399 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/333399
Semiconductor package and method of forming same May 27, 2021 Issued
Array ( [id] => 17085556 [patent_doc_number] => 20210280563 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, PACKAGE AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/328154 [patent_app_country] => US [patent_app_date] => 2021-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5412 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17328154 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/328154
SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, PACKAGE AND FABRICATION METHOD THEREOF May 23, 2021 Abandoned
Array ( [id] => 18913065 [patent_doc_number] => 11876052 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Semiconductor die bonding structure [patent_app_type] => utility [patent_app_number] => 17/324973 [patent_app_country] => US [patent_app_date] => 2021-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 31 [patent_no_of_words] => 9629 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17324973 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/324973
Semiconductor die bonding structure May 18, 2021 Issued
Array ( [id] => 20404453 [patent_doc_number] => 12494434 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Semiconductor packages and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/320190 [patent_app_country] => US [patent_app_date] => 2021-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 3233 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17320190 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/320190
Semiconductor packages and method of manufacturing the same May 12, 2021 Issued
Array ( [id] => 17993518 [patent_doc_number] => 20220359555 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => BONDED ASSEMBLY OF A MEMORY DIE AND A LOGIC DIE INCLUDING LATERALLY SHIFTED BIT-LINE BONDING PADS AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/315938 [patent_app_country] => US [patent_app_date] => 2021-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9984 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 250 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17315938 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/315938
Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same May 9, 2021 Issued
Array ( [id] => 17738102 [patent_doc_number] => 20220223564 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-14 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/314713 [patent_app_country] => US [patent_app_date] => 2021-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19041 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17314713 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/314713
Semiconductor package and method of manufacturing semiconductor package May 6, 2021 Issued
Array ( [id] => 17993286 [patent_doc_number] => 20220359323 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/314071 [patent_app_country] => US [patent_app_date] => 2021-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7615 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17314071 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/314071
SEMICONDUCTOR PACKAGE May 6, 2021 Pending
Array ( [id] => 18424231 [patent_doc_number] => 20230178695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => RADIATION-EMITTING SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR COMPONENT [patent_app_type] => utility [patent_app_number] => 17/923772 [patent_app_country] => US [patent_app_date] => 2021-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5347 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17923772 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/923772
RADIATION-EMITTING SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING SEMICONDUCTOR COMPONENT May 4, 2021 Abandoned
Array ( [id] => 17752789 [patent_doc_number] => 20220230994 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-21 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING VERTICAL INTERCONNECTOR [patent_app_type] => utility [patent_app_number] => 17/308718 [patent_app_country] => US [patent_app_date] => 2021-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6860 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17308718 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/308718
Semiconductor package including vertical interconnector May 4, 2021 Issued
Array ( [id] => 17463758 [patent_doc_number] => 20220077064 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-10 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/307037 [patent_app_country] => US [patent_app_date] => 2021-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11012 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17307037 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/307037
Semiconductor package and method of manufacturing the same May 3, 2021 Issued
Array ( [id] => 19627163 [patent_doc_number] => 12166012 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Flip-chip stacking structures and methods for forming the same [patent_app_type] => utility [patent_app_number] => 17/243687 [patent_app_country] => US [patent_app_date] => 2021-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7351 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 319 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17243687 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/243687
Flip-chip stacking structures and methods for forming the same Apr 28, 2021 Issued
Array ( [id] => 19524080 [patent_doc_number] => 12125820 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Through-dielectric vias for direct connection and method forming same [patent_app_type] => utility [patent_app_number] => 17/229283 [patent_app_country] => US [patent_app_date] => 2021-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 7768 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17229283 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/229283
Through-dielectric vias for direct connection and method forming same Apr 12, 2021 Issued
Array ( [id] => 17971521 [patent_doc_number] => 11489072 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-01 [patent_title] => Mirror device structure for power MOSFET and method of manufacture [patent_app_type] => utility [patent_app_number] => 17/224171 [patent_app_country] => US [patent_app_date] => 2021-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 6968 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17224171 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/224171
Mirror device structure for power MOSFET and method of manufacture Apr 6, 2021 Issued
Array ( [id] => 17917624 [patent_doc_number] => 20220320020 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/218137 [patent_app_country] => US [patent_app_date] => 2021-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9039 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17218137 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/218137
Package structure and method of forming the same Mar 29, 2021 Issued
Array ( [id] => 18767012 [patent_doc_number] => 11817424 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/212332 [patent_app_country] => US [patent_app_date] => 2021-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 22 [patent_no_of_words] => 11840 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 292 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17212332 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/212332
Semiconductor package Mar 24, 2021 Issued
Array ( [id] => 16951774 [patent_doc_number] => 20210210466 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-08 [patent_title] => SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/206257 [patent_app_country] => US [patent_app_date] => 2021-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8520 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17206257 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/206257
Semiconductor integrated circuit device and semiconductor package structure Mar 18, 2021 Issued
Array ( [id] => 20360217 [patent_doc_number] => 12476223 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Semiconductor package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/206098 [patent_app_country] => US [patent_app_date] => 2021-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 41 [patent_no_of_words] => 14562 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17206098 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/206098
Semiconductor package and method of manufacturing the same Mar 17, 2021 Issued
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