Search

Vu A. Vu

Examiner (ID: 11603)

Most Active Art Unit
2828
Art Unit(s)
2823, 2897, 2828
Total Applications
1405
Issued Applications
1214
Pending Applications
128
Abandoned Applications
96

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17463816 [patent_doc_number] => 20220077122 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-10 [patent_title] => METHOD FOR MANUFACTURING DISPLAY DEVICE AND SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/530155 [patent_app_country] => US [patent_app_date] => 2021-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11286 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17530155 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/530155
Method for manufacturing display device and substrate for manufacturing display device Nov 17, 2021 Issued
Array ( [id] => 17463677 [patent_doc_number] => 20220076983 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-10 [patent_title] => PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/526534 [patent_app_country] => US [patent_app_date] => 2021-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12396 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -35 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17526534 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/526534
Parallel assembly of discrete components onto a substrate Nov 14, 2021 Issued
Array ( [id] => 18081059 [patent_doc_number] => 20220406671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-22 [patent_title] => DIE CORNER REMOVAL FOR MOLDING COMPOUND CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/523955 [patent_app_country] => US [patent_app_date] => 2021-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10387 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523955 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/523955
Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same Nov 10, 2021 Issued
Array ( [id] => 19314476 [patent_doc_number] => 12040302 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-16 [patent_title] => Device package having a lateral power transistor with segmented chip pad [patent_app_type] => utility [patent_app_number] => 17/523119 [patent_app_country] => US [patent_app_date] => 2021-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 7348 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523119 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/523119
Device package having a lateral power transistor with segmented chip pad Nov 9, 2021 Issued
Array ( [id] => 18394886 [patent_doc_number] => 20230163107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => OPTICAL PROJECTION DEVICE HAVING A GRID STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/523023 [patent_app_country] => US [patent_app_date] => 2021-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6115 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523023 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/523023
Optical projection device having a grid structure Nov 9, 2021 Issued
Array ( [id] => 17660724 [patent_doc_number] => 20220181189 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/520599 [patent_app_country] => US [patent_app_date] => 2021-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7778 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17520599 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/520599
Manufacturing method of semiconductor package Nov 4, 2021 Issued
Array ( [id] => 17615389 [patent_doc_number] => 20220157669 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/453551 [patent_app_country] => US [patent_app_date] => 2021-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24766 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453551 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/453551
Wafer manufacturing method and laminated device chip manufacturing method Nov 3, 2021 Issued
Array ( [id] => 17615379 [patent_doc_number] => 20220157659 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/453543 [patent_app_country] => US [patent_app_date] => 2021-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24672 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453543 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/453543
Wafer manufacturing method and laminated device chip manufacturing method Nov 3, 2021 Issued
Array ( [id] => 17615388 [patent_doc_number] => 20220157668 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/453547 [patent_app_country] => US [patent_app_date] => 2021-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24672 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453547 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/453547
Wafer manufacturing method and laminated device chip manufacturing method Nov 3, 2021 Issued
Array ( [id] => 19487312 [patent_doc_number] => 12107037 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-01 [patent_title] => Semiconductor devices and methods of manufacturing electronic devices [patent_app_type] => utility [patent_app_number] => 17/517829 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 21 [patent_no_of_words] => 7939 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517829 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/517829
Semiconductor devices and methods of manufacturing electronic devices Nov 2, 2021 Issued
Array ( [id] => 17431683 [patent_doc_number] => 20220059392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-24 [patent_title] => THERMOCOMPRESSION BONDING METHOD FOR WORKPIECE [patent_app_type] => utility [patent_app_number] => 17/453365 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12183 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453365 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/453365
Thermocompression bonding method for workpiece Nov 2, 2021 Issued
Array ( [id] => 17615378 [patent_doc_number] => 20220157658 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/453411 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24882 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453411 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/453411
Wafer manufacturing method and laminated device chip manufacturing method Nov 2, 2021 Issued
Array ( [id] => 18983502 [patent_doc_number] => 11908689 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-20 [patent_title] => Method for fabricating GaN chip and GaN chip [patent_app_type] => utility [patent_app_number] => 18/268949 [patent_app_country] => US [patent_app_date] => 2021-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 5931 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18268949 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/268949
Method for fabricating GaN chip and GaN chip Oct 28, 2021 Issued
Array ( [id] => 18688338 [patent_doc_number] => 11784081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-10 [patent_title] => Micro device transfer apparatus and method [patent_app_type] => utility [patent_app_number] => 17/515159 [patent_app_country] => US [patent_app_date] => 2021-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 11377 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17515159 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/515159
Micro device transfer apparatus and method Oct 28, 2021 Issued
Array ( [id] => 19153772 [patent_doc_number] => 11978695 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-07 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/513282 [patent_app_country] => US [patent_app_date] => 2021-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 21 [patent_no_of_words] => 11759 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17513282 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/513282
Semiconductor package and method of fabricating the same Oct 27, 2021 Issued
Array ( [id] => 17660800 [patent_doc_number] => 20220181265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/510528 [patent_app_country] => US [patent_app_date] => 2021-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7286 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17510528 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/510528
Semiconductor devices and methods of manufacturing semiconductor devices Oct 25, 2021 Issued
Array ( [id] => 18895396 [patent_doc_number] => 20240010881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => ADHESIVE TAPE AND PROCESSING METHOD [patent_app_type] => utility [patent_app_number] => 18/035911 [patent_app_country] => US [patent_app_date] => 2021-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8199 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18035911 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/035911
ADHESIVE TAPE AND PROCESSING METHOD Oct 19, 2021 Abandoned
Array ( [id] => 18287403 [patent_doc_number] => 20230102875 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/500911 [patent_app_country] => US [patent_app_date] => 2021-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3537 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17500911 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/500911
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Oct 12, 2021 Abandoned
Array ( [id] => 18857444 [patent_doc_number] => 11855040 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Ion implantation with annealing for substrate cutting [patent_app_type] => utility [patent_app_number] => 17/497050 [patent_app_country] => US [patent_app_date] => 2021-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 80 [patent_figures_cnt] => 118 [patent_no_of_words] => 16821 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497050 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/497050
Ion implantation with annealing for substrate cutting Oct 7, 2021 Issued
Array ( [id] => 19589879 [patent_doc_number] => 20240387436 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => HERMETIC PACKAGE DEVICE, AND DEVICE MODULE [patent_app_type] => utility [patent_app_number] => 18/578681 [patent_app_country] => US [patent_app_date] => 2021-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5904 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18578681 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/578681
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE Oct 4, 2021 Pending
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