
Vu A. Vu
Examiner (ID: 11603)
| Most Active Art Unit | 2828 |
| Art Unit(s) | 2823, 2897, 2828 |
| Total Applications | 1405 |
| Issued Applications | 1214 |
| Pending Applications | 128 |
| Abandoned Applications | 96 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 17463816
[patent_doc_number] => 20220077122
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-10
[patent_title] => METHOD FOR MANUFACTURING DISPLAY DEVICE AND SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/530155
[patent_app_country] => US
[patent_app_date] => 2021-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11286
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17530155
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/530155 | Method for manufacturing display device and substrate for manufacturing display device | Nov 17, 2021 | Issued |
Array
(
[id] => 17463677
[patent_doc_number] => 20220076983
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-10
[patent_title] => PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 17/526534
[patent_app_country] => US
[patent_app_date] => 2021-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12396
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -35
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17526534
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/526534 | Parallel assembly of discrete components onto a substrate | Nov 14, 2021 | Issued |
Array
(
[id] => 18081059
[patent_doc_number] => 20220406671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-22
[patent_title] => DIE CORNER REMOVAL FOR MOLDING COMPOUND CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/523955
[patent_app_country] => US
[patent_app_date] => 2021-11-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10387
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523955
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/523955 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Nov 10, 2021 | Issued |
Array
(
[id] => 19314476
[patent_doc_number] => 12040302
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-16
[patent_title] => Device package having a lateral power transistor with segmented chip pad
[patent_app_type] => utility
[patent_app_number] => 17/523119
[patent_app_country] => US
[patent_app_date] => 2021-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 7348
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 168
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523119
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/523119 | Device package having a lateral power transistor with segmented chip pad | Nov 9, 2021 | Issued |
Array
(
[id] => 18394886
[patent_doc_number] => 20230163107
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-25
[patent_title] => OPTICAL PROJECTION DEVICE HAVING A GRID STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/523023
[patent_app_country] => US
[patent_app_date] => 2021-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6115
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523023
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/523023 | Optical projection device having a grid structure | Nov 9, 2021 | Issued |
Array
(
[id] => 17660724
[patent_doc_number] => 20220181189
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-06-09
[patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/520599
[patent_app_country] => US
[patent_app_date] => 2021-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7778
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17520599
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/520599 | Manufacturing method of semiconductor package | Nov 4, 2021 | Issued |
Array
(
[id] => 17615389
[patent_doc_number] => 20220157669
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-19
[patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 17/453551
[patent_app_country] => US
[patent_app_date] => 2021-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 24766
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -7
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453551
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453551 | Wafer manufacturing method and laminated device chip manufacturing method | Nov 3, 2021 | Issued |
Array
(
[id] => 17615379
[patent_doc_number] => 20220157659
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-19
[patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 17/453543
[patent_app_country] => US
[patent_app_date] => 2021-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 24672
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453543
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453543 | Wafer manufacturing method and laminated device chip manufacturing method | Nov 3, 2021 | Issued |
Array
(
[id] => 17615388
[patent_doc_number] => 20220157668
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-19
[patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 17/453547
[patent_app_country] => US
[patent_app_date] => 2021-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 24672
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453547
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453547 | Wafer manufacturing method and laminated device chip manufacturing method | Nov 3, 2021 | Issued |
Array
(
[id] => 19487312
[patent_doc_number] => 12107037
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-01
[patent_title] => Semiconductor devices and methods of manufacturing electronic devices
[patent_app_type] => utility
[patent_app_number] => 17/517829
[patent_app_country] => US
[patent_app_date] => 2021-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 21
[patent_no_of_words] => 7939
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517829
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/517829 | Semiconductor devices and methods of manufacturing electronic devices | Nov 2, 2021 | Issued |
Array
(
[id] => 17431683
[patent_doc_number] => 20220059392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-02-24
[patent_title] => THERMOCOMPRESSION BONDING METHOD FOR WORKPIECE
[patent_app_type] => utility
[patent_app_number] => 17/453365
[patent_app_country] => US
[patent_app_date] => 2021-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12183
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453365
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453365 | Thermocompression bonding method for workpiece | Nov 2, 2021 | Issued |
Array
(
[id] => 17615378
[patent_doc_number] => 20220157658
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-19
[patent_title] => WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 17/453411
[patent_app_country] => US
[patent_app_date] => 2021-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 24882
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -8
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453411
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453411 | Wafer manufacturing method and laminated device chip manufacturing method | Nov 2, 2021 | Issued |
Array
(
[id] => 18983502
[patent_doc_number] => 11908689
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-20
[patent_title] => Method for fabricating GaN chip and GaN chip
[patent_app_type] => utility
[patent_app_number] => 18/268949
[patent_app_country] => US
[patent_app_date] => 2021-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 5931
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18268949
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/268949 | Method for fabricating GaN chip and GaN chip | Oct 28, 2021 | Issued |
Array
(
[id] => 18688338
[patent_doc_number] => 11784081
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-10
[patent_title] => Micro device transfer apparatus and method
[patent_app_type] => utility
[patent_app_number] => 17/515159
[patent_app_country] => US
[patent_app_date] => 2021-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 11377
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17515159
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/515159 | Micro device transfer apparatus and method | Oct 28, 2021 | Issued |
Array
(
[id] => 19153772
[patent_doc_number] => 11978695
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-07
[patent_title] => Semiconductor package and method of fabricating the same
[patent_app_type] => utility
[patent_app_number] => 17/513282
[patent_app_country] => US
[patent_app_date] => 2021-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 21
[patent_no_of_words] => 11759
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17513282
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/513282 | Semiconductor package and method of fabricating the same | Oct 27, 2021 | Issued |
Array
(
[id] => 17660800
[patent_doc_number] => 20220181265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-06-09
[patent_title] => SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
[patent_app_type] => utility
[patent_app_number] => 17/510528
[patent_app_country] => US
[patent_app_date] => 2021-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7286
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17510528
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/510528 | Semiconductor devices and methods of manufacturing semiconductor devices | Oct 25, 2021 | Issued |
Array
(
[id] => 18895396
[patent_doc_number] => 20240010881
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-11
[patent_title] => ADHESIVE TAPE AND PROCESSING METHOD
[patent_app_type] => utility
[patent_app_number] => 18/035911
[patent_app_country] => US
[patent_app_date] => 2021-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8199
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -12
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18035911
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/035911 | ADHESIVE TAPE AND PROCESSING METHOD | Oct 19, 2021 | Abandoned |
Array
(
[id] => 18287403
[patent_doc_number] => 20230102875
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-30
[patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/500911
[patent_app_country] => US
[patent_app_date] => 2021-10-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3537
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17500911
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/500911 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Oct 12, 2021 | Abandoned |
Array
(
[id] => 18857444
[patent_doc_number] => 11855040
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-12-26
[patent_title] => Ion implantation with annealing for substrate cutting
[patent_app_type] => utility
[patent_app_number] => 17/497050
[patent_app_country] => US
[patent_app_date] => 2021-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 80
[patent_figures_cnt] => 118
[patent_no_of_words] => 16821
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497050
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/497050 | Ion implantation with annealing for substrate cutting | Oct 7, 2021 | Issued |
Array
(
[id] => 19589879
[patent_doc_number] => 20240387436
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-21
[patent_title] => HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
[patent_app_type] => utility
[patent_app_number] => 18/578681
[patent_app_country] => US
[patent_app_date] => 2021-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5904
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18578681
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/578681 | HERMETIC PACKAGE DEVICE, AND DEVICE MODULE | Oct 4, 2021 | Pending |