Search

Wen Tai Lin

Examiner (ID: 13019)

Most Active Art Unit
2454
Art Unit(s)
2154, 2783, 2454
Total Applications
849
Issued Applications
644
Pending Applications
28
Abandoned Applications
179

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18821215 [patent_doc_number] => 20230395556 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/452108 [patent_app_country] => US [patent_app_date] => 2023-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8820 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18452108 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/452108
PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURING METHOD Aug 17, 2023 Pending
Array ( [id] => 18812607 [patent_doc_number] => 20230386944 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/232520 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9719 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232520 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/232520
Semiconductor package including test line structure Aug 9, 2023 Issued
Array ( [id] => 19007811 [patent_doc_number] => 20240071882 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/366098 [patent_app_country] => US [patent_app_date] => 2023-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10328 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18366098 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/366098
SEMICONDUCTOR PACKAGE Aug 6, 2023 Pending
Array ( [id] => 19452817 [patent_doc_number] => 20240312947 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-19 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/364893 [patent_app_country] => US [patent_app_date] => 2023-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6467 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18364893 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/364893
SEMICONDUCTOR DEVICE Aug 2, 2023 Pending
Array ( [id] => 19964914 [patent_doc_number] => 12334434 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-17 [patent_title] => Package structure and method of forming the same [patent_app_type] => utility [patent_app_number] => 18/363763 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 5650 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363763 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363763
Package structure and method of forming the same Aug 1, 2023 Issued
Array ( [id] => 20484274 [patent_doc_number] => 12532755 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Semiconductor device and method of manufacturing [patent_app_type] => utility [patent_app_number] => 18/362153 [patent_app_country] => US [patent_app_date] => 2023-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 16 [patent_no_of_words] => 5650 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18362153 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/362153
Semiconductor device and method of manufacturing Jul 30, 2023 Issued
Array ( [id] => 19749513 [patent_doc_number] => 20250038078 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-30 [patent_title] => BONDING STRUCTURE AND PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/227892 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9883 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18227892 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/227892
BONDING STRUCTURE AND PACKAGE STRUCTURE Jul 27, 2023 Pending
Array ( [id] => 20244180 [patent_doc_number] => 12424511 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-23 [patent_title] => High efficiency heat dissipation using discrete thermal interface material films [patent_app_type] => utility [patent_app_number] => 18/360484 [patent_app_country] => US [patent_app_date] => 2023-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 3486 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 234 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18360484 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/360484
High efficiency heat dissipation using discrete thermal interface material films Jul 26, 2023 Issued
Array ( [id] => 18943468 [patent_doc_number] => 20240038607 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => INTEGRATED CIRCUIT PACKAGE [patent_app_type] => utility [patent_app_number] => 18/226409 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2097 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18226409 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/226409
INTEGRATED CIRCUIT PACKAGE Jul 25, 2023 Pending
Array ( [id] => 18927114 [patent_doc_number] => 20240030118 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/224948 [patent_app_country] => US [patent_app_date] => 2023-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7597 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18224948 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/224948
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Jul 20, 2023 Pending
Array ( [id] => 19712668 [patent_doc_number] => 20250022810 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-16 [patent_title] => SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/349412 [patent_app_country] => US [patent_app_date] => 2023-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11438 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18349412 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/349412
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS FOR MAKING THE SAME Jul 9, 2023 Pending
Array ( [id] => 20346091 [patent_doc_number] => 12469826 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Semiconductor module [patent_app_type] => utility [patent_app_number] => 18/348770 [patent_app_country] => US [patent_app_date] => 2023-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3502 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 374 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18348770 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/348770
Semiconductor module Jul 6, 2023 Issued
Array ( [id] => 18943504 [patent_doc_number] => 20240038643 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/216094 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9521 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18216094 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/216094
SEMICONDUCTOR DEVICE Jun 28, 2023 Pending
Array ( [id] => 19720330 [patent_doc_number] => 12205873 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-21 [patent_title] => Electronic component package [patent_app_type] => utility [patent_app_number] => 18/210291 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 9269 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210291 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/210291
Electronic component package Jun 14, 2023 Issued
Array ( [id] => 18848857 [patent_doc_number] => 20230411261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => EXPOSED BONDING PAD OF CHIP PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/335291 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3355 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18335291 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/335291
Exposed bonding pad of chip package and manufacturing method thereof Jun 14, 2023 Issued
Array ( [id] => 19007774 [patent_doc_number] => 20240071845 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 18/209286 [patent_app_country] => US [patent_app_date] => 2023-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8667 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18209286 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/209286
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME Jun 12, 2023 Pending
Array ( [id] => 18661540 [patent_doc_number] => 20230307554 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => Power Diode and Method of Manufacturing a Power Diode [patent_app_type] => utility [patent_app_number] => 18/204721 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5552 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18204721 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/204721
Power diode and method of manufacturing a power diode May 31, 2023 Issued
Array ( [id] => 18653051 [patent_doc_number] => 20230298891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING [patent_app_type] => utility [patent_app_number] => 18/322863 [patent_app_country] => US [patent_app_date] => 2023-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4283 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322863 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/322863
INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING May 23, 2023 Pending
Array ( [id] => 19935098 [patent_doc_number] => 12308306 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-20 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/201145 [patent_app_country] => US [patent_app_date] => 2023-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18201145 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/201145
Semiconductor device package and method of manufacturing the same May 22, 2023 Issued
Array ( [id] => 19733800 [patent_doc_number] => 12211802 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Package structure and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/318729 [patent_app_country] => US [patent_app_date] => 2023-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 33 [patent_no_of_words] => 10143 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318729 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/318729
Package structure and method of fabricating the same May 16, 2023 Issued
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