
Whitney Moore
Examiner (ID: 19293, Phone: (571)270-3338 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2826, 4148, 3646 |
| Total Applications | 1392 |
| Issued Applications | 1180 |
| Pending Applications | 84 |
| Abandoned Applications | 144 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4639496
[patent_doc_number] => 08017523
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-09-13
[patent_title] => 'Deposition of doped copper seed layers having improved reliability'
[patent_app_type] => utility
[patent_app_number] => 12/122118
[patent_app_country] => US
[patent_app_date] => 2008-05-16
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/017/08017523.pdf
[firstpage_image] =>[orig_patent_app_number] => 12122118
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/122118 | Deposition of doped copper seed layers having improved reliability | May 15, 2008 | Issued |
Array
(
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[patent_doc_number] => 07745896
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Image sensor and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/122434 | Image sensor and method of manufacturing the same | May 15, 2008 | Issued |
Array
(
[id] => 143101
[patent_doc_number] => 07692241
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Semiconductor device'
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[patent_app_date] => 2008-05-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/153217 | Semiconductor device | May 14, 2008 | Issued |
Array
(
[id] => 7530776
[patent_doc_number] => 07842999
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[patent_kind] => B2
[patent_issue_date] => 2010-11-30
[patent_title] => 'Semiconductor memory device and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/121364 | Semiconductor memory device and method of manufacturing the same | May 14, 2008 | Issued |
Array
(
[id] => 4775909
[patent_doc_number] => 20080283907
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-20
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
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[patent_app_date] => 2008-05-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/121203 | Semiconductor device and method of manufacturing the same | May 14, 2008 | Issued |
Array
(
[id] => 5327884
[patent_doc_number] => 20090108361
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-30
[patent_title] => 'TENSILE STRAIN SOURCE USING SILICON/GERMANIUM IN GLOBALLY STRAINED SILICON'
[patent_app_type] => utility
[patent_app_number] => 12/112288
[patent_app_country] => US
[patent_app_date] => 2008-04-30
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12112288
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/112288 | Tensile strain source using silicon/germanium in globally strained silicon | Apr 29, 2008 | Issued |
Array
(
[id] => 5555541
[patent_doc_number] => 20090267118
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[patent_issue_date] => 2009-10-29
[patent_title] => 'METHOD FOR FORMING CARBON SILICON ALLOY (CSA) AND STRUCTURES THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/111377
[patent_app_country] => US
[patent_app_date] => 2008-04-29
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[pdf_file] => publications/A1/0267/20090267118.pdf
[firstpage_image] =>[orig_patent_app_number] => 12111377
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/111377 | METHOD FOR FORMING CARBON SILICON ALLOY (CSA) AND STRUCTURES THEREOF | Apr 28, 2008 | Abandoned |
Array
(
[id] => 225223
[patent_doc_number] => 07605408
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2009-10-20
[patent_title] => 'Apparatus, method and system for reconfigurable circuitry'
[patent_app_type] => utility
[patent_app_number] => 12/150308
[patent_app_country] => US
[patent_app_date] => 2008-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[firstpage_image] =>[orig_patent_app_number] => 12150308
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/150308 | Apparatus, method and system for reconfigurable circuitry | Apr 24, 2008 | Issued |
Array
(
[id] => 122660
[patent_doc_number] => 07709857
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-04
[patent_title] => 'Light emitting diode package'
[patent_app_type] => utility
[patent_app_number] => 12/149008
[patent_app_country] => US
[patent_app_date] => 2008-04-24
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[firstpage_image] =>[orig_patent_app_number] => 12149008
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/149008 | Light emitting diode package | Apr 23, 2008 | Issued |
Array
(
[id] => 4710074
[patent_doc_number] => 20080298600
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[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'AUTOMATED REAL SPEECH HEARING INSTRUMENT ADJUSTMENT SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/106893
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[patent_app_date] => 2008-04-21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/106893 | AUTOMATED REAL SPEECH HEARING INSTRUMENT ADJUSTMENT SYSTEM | Apr 20, 2008 | Abandoned |
Array
(
[id] => 177831
[patent_doc_number] => 07655539
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-02
[patent_title] => 'Dice by grind for back surface metallized dies'
[patent_app_type] => utility
[patent_app_number] => 12/103878
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[patent_app_date] => 2008-04-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/103878 | Dice by grind for back surface metallized dies | Apr 15, 2008 | Issued |
Array
(
[id] => 5419712
[patent_doc_number] => 20090146166
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[patent_issue_date] => 2009-06-11
[patent_title] => 'Structure Applying Optical Limit Guide Layer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/060878 | Structure Applying Optical Limit Guide Layer | Apr 1, 2008 | Abandoned |
Array
(
[id] => 5542812
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[patent_issue_date] => 2009-06-18
[patent_title] => 'Integrated Circuit Package for High-Speed Signals'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/060387 | Integrated circuit package for high-speed signals | Mar 31, 2008 | Issued |
Array
(
[id] => 5471684
[patent_doc_number] => 20090244850
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[patent_issue_date] => 2009-10-01
[patent_title] => 'THERMAL INTERFACE MATERIAL FOR COMBINED REFLOW'
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Array
(
[id] => 43477
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[patent_title] => 'Composition for forming passivation layer and organic thin film transistor comprising the passivation layer'
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Array
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[patent_title] => 'LINKED CHIP ATTACH AND UNDERFILL'
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Array
(
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Array
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Array
(
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Array
(
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