
William A. Powell
Examiner (ID: 12339)
| Most Active Art Unit | 1765 |
| Art Unit(s) | 1307, 1109, 1301, 1304, 1303, 1765, 1106, 1104, 1763, 1502, 3202 |
| Total Applications | 3597 |
| Issued Applications | 3357 |
| Pending Applications | 97 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1550565
[patent_doc_number] => 06399512
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-04
[patent_title] => 'Method of making metallization and contact structures in an integrated circuit comprising an etch stop layer'
[patent_app_type] => B1
[patent_app_number] => 09/593968
[patent_app_country] => US
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Array
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[patent_issue_date] => 2000-12-26
[patent_title] => 'Apparatus for performing jet vapor reduction of the thickness of process layers'
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Array
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[patent_issue_date] => 2002-04-23
[patent_title] => 'Method for eliminating anti-reflective coating in semiconductors'
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[patent_app_number] => 09/588117
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Array
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[patent_issue_date] => 2002-07-30
[patent_title] => 'Reduction of surface roughness during chemical mechanical planarization(CMP)'
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Array
(
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[patent_title] => 'Method for anisotropic plasma etching using non-chlorofluorocarbon, fluorine-based chemistry'
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Array
(
[id] => 4323145
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[patent_issue_date] => 2001-11-06
[patent_title] => 'Method for production of interposer for mounting semiconductor element'
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Array
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[patent_issue_date] => 2002-08-20
[patent_title] => 'Method to reduce polish initiation time in a polish process'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/578157 | Method to reduce polish initiation time in a polish process | May 22, 2000 | Issued |
Array
(
[id] => 4381833
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[patent_issue_date] => 2001-09-25
[patent_title] => 'Dual slurry particle sizes for reducing microscratching of wafers'
[patent_app_type] => 1
[patent_app_number] => 9/576750
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Array
(
[id] => 4250740
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[patent_issue_date] => 2001-03-27
[patent_title] => 'Reverse linear chemical mechanical polisher with loadable housing'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/576064 | Reverse linear chemical mechanical polisher with loadable housing | May 21, 2000 | Issued |
Array
(
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[patent_issue_date] => 2002-03-19
[patent_title] => 'Decapsulation techniques for multi-chip (MCP) devices'
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Array
(
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[patent_title] => 'Feedback control of polish buff time as a function of scratch count'
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Array
(
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Array
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Array
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[patent_title] => 'Method of forming patterned nickel and doped nickel films via microcontact printing and uses thereof'
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Array
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Array
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Array
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Array
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