Search

William M. Pierce

Examiner (ID: 18691, Phone: (571)272-4414 , Office: P/3711 )

Most Active Art Unit
3711
Art Unit(s)
3711, 3304
Total Applications
2380
Issued Applications
1405
Pending Applications
120
Abandoned Applications
862

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18864711 [patent_doc_number] => 20230419148 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => QUANTUM CHIP AND METHOD FOR PREPARING THE SAME [patent_app_type] => utility [patent_app_number] => 18/233732 [patent_app_country] => US [patent_app_date] => 2023-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11427 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18233732 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/233732
QUANTUM CHIP AND METHOD FOR PREPARING THE SAME Aug 13, 2023 Pending
Array ( [id] => 19781586 [patent_doc_number] => 12230624 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-18 [patent_title] => Integrated circuit with mixed row heights [patent_app_type] => utility [patent_app_number] => 18/232759 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 17978 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 269 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232759 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/232759
Integrated circuit with mixed row heights Aug 9, 2023 Issued
Array ( [id] => 19696491 [patent_doc_number] => 20250015036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/447466 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2060 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18447466 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/447466
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF Aug 9, 2023 Pending
Array ( [id] => 19007825 [patent_doc_number] => 20240071896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/361482 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7344 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361482 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/361482
SEMICONDUCTOR PACKAGE Jul 27, 2023 Pending
Array ( [id] => 18776389 [patent_doc_number] => 20230371227 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 18/361384 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11930 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361384 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/361384
Memory device Jul 27, 2023 Issued
Array ( [id] => 19742919 [patent_doc_number] => 12219781 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-04 [patent_title] => Semiconductor structure with embedded memory device [patent_app_type] => utility [patent_app_number] => 18/359377 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 19 [patent_no_of_words] => 11693 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359377 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359377
Semiconductor structure with embedded memory device Jul 25, 2023 Issued
Array ( [id] => 19244549 [patent_doc_number] => 12015004 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Hybrid device assemblies and method of fabrication [patent_app_type] => utility [patent_app_number] => 18/359425 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 5320 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359425 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359425
Hybrid device assemblies and method of fabrication Jul 25, 2023 Issued
Array ( [id] => 18812523 [patent_doc_number] => 20230386860 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING SAME [patent_app_type] => utility [patent_app_number] => 18/225064 [patent_app_country] => US [patent_app_date] => 2023-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9301 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -28 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18225064 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/225064
Molded direct contact interconnect substrate and methods of making same Jul 20, 2023 Issued
Array ( [id] => 19007824 [patent_doc_number] => 20240071895 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/353279 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11266 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353279 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/353279
SEMICONDUCTOR PACKAGE Jul 16, 2023 Pending
Array ( [id] => 19335554 [patent_doc_number] => 20240249984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-25 [patent_title] => System and Method for Die Crack Detection in Wafer-to-Wafer Bonding [patent_app_type] => utility [patent_app_number] => 18/222057 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3687 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222057 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/222057
System and Method for Die Crack Detection in Wafer-to-Wafer Bonding Jul 13, 2023 Pending
Array ( [id] => 19054867 [patent_doc_number] => 20240096836 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-21 [patent_title] => CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/221510 [patent_app_country] => US [patent_app_date] => 2023-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3774 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18221510 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/221510
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Jul 12, 2023 Pending
Array ( [id] => 19176219 [patent_doc_number] => 20240162193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/213852 [patent_app_country] => US [patent_app_date] => 2023-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8101 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213852 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/213852
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Jun 24, 2023 Pending
Array ( [id] => 19627139 [patent_doc_number] => 12165988 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Semiconductor devices and methods of manufacturing semiconductor devices [patent_app_type] => utility [patent_app_number] => 18/210808 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 7409 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210808 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/210808
Semiconductor devices and methods of manufacturing semiconductor devices Jun 15, 2023 Issued
Array ( [id] => 19384635 [patent_doc_number] => 20240274505 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/330233 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3740 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18330233 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/330233
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Jun 5, 2023 Pending
Array ( [id] => 18679922 [patent_doc_number] => 20230317580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/329721 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7474 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18329721 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/329721
Semiconductor package structure Jun 5, 2023 Issued
Array ( [id] => 19392785 [patent_doc_number] => 20240282655 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/327097 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4712 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327097 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327097
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF May 31, 2023 Pending
Array ( [id] => 18663304 [patent_doc_number] => 20230309331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => PHOTOELECTRIC CONVERSION ELEMENT AND SOLID-STATE IMAGING DEVICE [patent_app_type] => utility [patent_app_number] => 18/201134 [patent_app_country] => US [patent_app_date] => 2023-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17523 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18201134 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/201134
Photoelectric conversion element and solid-state imaging device May 22, 2023 Issued
Array ( [id] => 18696513 [patent_doc_number] => 20230326953 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING DEVICE [patent_app_type] => utility [patent_app_number] => 18/197254 [patent_app_country] => US [patent_app_date] => 2023-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 35623 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18197254 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/197254
Imaging element, stacked imaging element, and solid-state imaging device May 14, 2023 Issued
Array ( [id] => 19138075 [patent_doc_number] => 11973051 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Molded direct contact interconnect structure without capture pads and method for the same [patent_app_type] => utility [patent_app_number] => 18/195090 [patent_app_country] => US [patent_app_date] => 2023-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 45 [patent_no_of_words] => 12527 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195090 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/195090
Molded direct contact interconnect structure without capture pads and method for the same May 8, 2023 Issued
Array ( [id] => 19639646 [patent_doc_number] => 12170261 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-17 [patent_title] => Molded direct contact interconnect structure without capture pads and method for the same [patent_app_type] => utility [patent_app_number] => 18/195304 [patent_app_country] => US [patent_app_date] => 2023-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 45 [patent_no_of_words] => 12556 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195304 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/195304
Molded direct contact interconnect structure without capture pads and method for the same May 8, 2023 Issued
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