Search

William Wong

Examiner (ID: 7558, Phone: (571)270-1399 , Office: P/2141 )

Most Active Art Unit
2141
Art Unit(s)
2144, 2178, 2176, 2179, 2172, 2141
Total Applications
459
Issued Applications
121
Pending Applications
53
Abandoned Applications
293

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6264345 [patent_doc_number] => 20100252939 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-10-07 [patent_title] => 'CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE' [patent_app_type] => utility [patent_app_number] => 12/721785 [patent_app_country] => US [patent_app_date] => 2010-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2952 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0252/20100252939.pdf [firstpage_image] =>[orig_patent_app_number] => 12721785 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/721785
Chip module and method for producing a chip module having plains of extensions for chip and substrate Mar 10, 2010 Issued
Array ( [id] => 6376034 [patent_doc_number] => 20100301472 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-02 [patent_title] => 'ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/721741 [patent_app_country] => US [patent_app_date] => 2010-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5460 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0301/20100301472.pdf [firstpage_image] =>[orig_patent_app_number] => 12721741 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/721741
Electronic component and method of connecting with multi-profile bumps Mar 10, 2010 Issued
Array ( [id] => 9047332 [patent_doc_number] => 08541886 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-24 [patent_title] => 'Integrated circuit packaging system with via and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 12/720667 [patent_app_country] => US [patent_app_date] => 2010-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 7497 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12720667 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/720667
Integrated circuit packaging system with via and method of manufacture thereof Mar 8, 2010 Issued
Array ( [id] => 6393467 [patent_doc_number] => 20100164107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-01 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING MULTILAYERED INTERCONNECTION STRUCTURE FORMED BY USING Cu DAMASCENE METHOD, AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/719653 [patent_app_country] => US [patent_app_date] => 2010-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6386 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20100164107.pdf [firstpage_image] =>[orig_patent_app_number] => 12719653 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/719653
SEMICONDUCTOR DEVICE HAVING MULTILAYERED INTERCONNECTION STRUCTURE FORMED BY USING Cu DAMASCENE METHOD, AND METHOD OF FABRICATING THE SAME Mar 7, 2010 Abandoned
Array ( [id] => 6478979 [patent_doc_number] => 20100213589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-08-26 [patent_title] => 'MULTI-CHIP PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/704517 [patent_app_country] => US [patent_app_date] => 2010-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 8403 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0213/20100213589.pdf [firstpage_image] =>[orig_patent_app_number] => 12704517 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/704517
MULTI-CHIP PACKAGE Feb 10, 2010 Abandoned
Array ( [id] => 6438883 [patent_doc_number] => 20100144139 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-10 [patent_title] => 'Methods For Fabricating Semiconductor Components With Conductive Interconnects Having Planar Surfaces' [patent_app_type] => utility [patent_app_number] => 12/703520 [patent_app_country] => US [patent_app_date] => 2010-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 12621 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0144/20100144139.pdf [firstpage_image] =>[orig_patent_app_number] => 12703520 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/703520
Methods for fabricating semiconductor components with conductive interconnects having planar surfaces Feb 9, 2010 Issued
Array ( [id] => 9245753 [patent_doc_number] => 08610035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-12-17 [patent_title] => 'Drawer type cooking device' [patent_app_type] => utility [patent_app_number] => 12/700318 [patent_app_country] => US [patent_app_date] => 2010-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 6095 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12700318 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/700318
Drawer type cooking device Feb 3, 2010 Issued
Array ( [id] => 6193130 [patent_doc_number] => 20110024884 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-03 [patent_title] => 'Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors' [patent_app_type] => utility [patent_app_number] => 12/693446 [patent_app_country] => US [patent_app_date] => 2010-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7181 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0024/20110024884.pdf [firstpage_image] =>[orig_patent_app_number] => 12693446 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/693446
Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors Jan 25, 2010 Issued
Array ( [id] => 8772893 [patent_doc_number] => 08426851 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-04-23 [patent_title] => 'Thin film transistor and display device' [patent_app_type] => utility [patent_app_number] => 12/654658 [patent_app_country] => US [patent_app_date] => 2009-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 31 [patent_no_of_words] => 7427 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12654658 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/654658
Thin film transistor and display device Dec 28, 2009 Issued
Array ( [id] => 9355737 [patent_doc_number] => 08674270 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-03-18 [patent_title] => 'Cooking appliance with programmable recipe system' [patent_app_type] => utility [patent_app_number] => 12/641427 [patent_app_country] => US [patent_app_date] => 2009-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3611 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12641427 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/641427
Cooking appliance with programmable recipe system Dec 17, 2009 Issued
Array ( [id] => 6293040 [patent_doc_number] => 20100159644 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-24 [patent_title] => 'LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM' [patent_app_type] => utility [patent_app_number] => 12/642445 [patent_app_country] => US [patent_app_date] => 2009-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4665 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20100159644.pdf [firstpage_image] =>[orig_patent_app_number] => 12642445 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/642445
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM Dec 17, 2009 Abandoned
Array ( [id] => 6349151 [patent_doc_number] => 20100071941 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-25 [patent_title] => 'DIELECTRIC SPACERS FOR METAL INTERCONNECTS AND METHOD TO FORM THE SAME' [patent_app_type] => utility [patent_app_number] => 12/630771 [patent_app_country] => US [patent_app_date] => 2009-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4838 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20100071941.pdf [firstpage_image] =>[orig_patent_app_number] => 12630771 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/630771
Dielectric spacers for metal interconnects and method to form the same Dec 2, 2009 Issued
Array ( [id] => 8533242 [patent_doc_number] => 08309396 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'System and method for 3D integrated circuit stacking' [patent_app_type] => utility [patent_app_number] => 12/616920 [patent_app_country] => US [patent_app_date] => 2009-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 2069 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12616920 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/616920
System and method for 3D integrated circuit stacking Nov 11, 2009 Issued
Array ( [id] => 7801573 [patent_doc_number] => 08129847 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-06 [patent_title] => 'Interconnect and method for mounting an electronic device to a substrate' [patent_app_type] => utility [patent_app_number] => 12/615321 [patent_app_country] => US [patent_app_date] => 2009-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 1512 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/129/08129847.pdf [firstpage_image] =>[orig_patent_app_number] => 12615321 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/615321
Interconnect and method for mounting an electronic device to a substrate Nov 9, 2009 Issued
Array ( [id] => 6272301 [patent_doc_number] => 20100117241 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-13 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME' [patent_app_type] => utility [patent_app_number] => 12/615449 [patent_app_country] => US [patent_app_date] => 2009-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 15532 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20100117241.pdf [firstpage_image] =>[orig_patent_app_number] => 12615449 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/615449
Semiconductor device having stacked multiple substrates and method for producing same Nov 9, 2009 Issued
Array ( [id] => 9350606 [patent_doc_number] => 08669498 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-03-11 [patent_title] => 'Cooker' [patent_app_type] => utility [patent_app_number] => 12/585695 [patent_app_country] => US [patent_app_date] => 2009-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6816 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12585695 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/585695
Cooker Sep 21, 2009 Issued
Array ( [id] => 10870163 [patent_doc_number] => 08895358 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-25 [patent_title] => 'Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP' [patent_app_type] => utility [patent_app_number] => 12/557763 [patent_app_country] => US [patent_app_date] => 2009-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 5321 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12557763 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/557763
Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP Sep 10, 2009 Issued
Array ( [id] => 6231338 [patent_doc_number] => 20100264534 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-10-21 [patent_title] => 'CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/542154 [patent_app_country] => US [patent_app_date] => 2009-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4106 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0264/20100264534.pdf [firstpage_image] =>[orig_patent_app_number] => 12542154 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/542154
Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure Aug 16, 2009 Issued
Array ( [id] => 8435425 [patent_doc_number] => 08283193 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-09 [patent_title] => 'Integrated circuit system with sealring and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 12/541373 [patent_app_country] => US [patent_app_date] => 2009-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 5377 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12541373 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/541373
Integrated circuit system with sealring and method of manufacture thereof Aug 13, 2009 Issued
Array ( [id] => 4624200 [patent_doc_number] => 08003496 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-23 [patent_title] => 'Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die' [patent_app_type] => utility [patent_app_number] => 12/541334 [patent_app_country] => US [patent_app_date] => 2009-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 4026 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/003/08003496.pdf [firstpage_image] =>[orig_patent_app_number] => 12541334 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/541334
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Aug 13, 2009 Issued
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