Willis Little
Examiner (ID: 13674)
Most Active Art Unit | 3203 |
Art Unit(s) | 2899, 3643, 2107, 2403, 2406, 3203, 3616, 2401, 2103 |
Total Applications | 2327 |
Issued Applications | 2182 |
Pending Applications | 48 |
Abandoned Applications | 97 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 9266693
[patent_doc_number] => 20140021609
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-23
[patent_title] => 'WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/920315
[patent_app_country] => US
[patent_app_date] => 2013-06-18
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13920315
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/920315 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Jun 17, 2013 | Abandoned |
Array
(
[id] => 9978036
[patent_doc_number] => 09024348
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-05-05
[patent_title] => 'Light-emitting device including LED chip and a case having resin and glass fiber'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2013-06-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/921050 | Light-emitting device including LED chip and a case having resin and glass fiber | Jun 17, 2013 | Issued |
Array
(
[id] => 9844044
[patent_doc_number] => 08945959
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[patent_issue_date] => 2015-02-03
[patent_title] => 'LED with thin package struture and method for manufacturing the same'
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[patent_app_number] => 13/919721
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[patent_app_date] => 2013-06-17
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/919721 | LED with thin package struture and method for manufacturing the same | Jun 16, 2013 | Issued |
Array
(
[id] => 9188776
[patent_doc_number] => 20130328091
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-12-12
[patent_title] => 'LIGHT REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR, AND SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING THE LIGHT REFLECTING MEMBER'
[patent_app_type] => utility
[patent_app_number] => 13/909450
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[patent_app_date] => 2013-06-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/909450 | LIGHT REFLECTING MEMBER FOR OPTICAL SEMICONDUCTOR, AND SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING THE LIGHT REFLECTING MEMBER | Jun 3, 2013 | Abandoned |
Array
(
[id] => 9161535
[patent_doc_number] => 20130309812
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[patent_kind] => A1
[patent_issue_date] => 2013-11-21
[patent_title] => 'INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/887093
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/887093 | Integrated chip package structure using ceramic substrate and method of manufacturing the same | May 2, 2013 | Issued |
Array
(
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[patent_doc_number] => 20130228938
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[patent_title] => 'HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM'
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Array
(
[id] => 9000408
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[patent_issue_date] => 2013-08-29
[patent_title] => 'HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 13/865499
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Array
(
[id] => 9003823
[patent_doc_number] => 20130224947
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[patent_kind] => A1
[patent_issue_date] => 2013-08-29
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/862268
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[patent_app_date] => 2013-04-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/862268 | Semiconductor device and manufacturing method thereof | Apr 11, 2013 | Issued |
Array
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[id] => 11904507
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/390611 | Semiconductor device structure | Apr 4, 2013 | Issued |
Array
(
[id] => 11615676
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/777673 | Semiconductor device | Mar 24, 2013 | Issued |
Array
(
[id] => 11615535
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Array
(
[id] => 8987128
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[patent_issue_date] => 2013-08-22
[patent_title] => 'Semiconductor Device and Method of Forming Bond-on-Lead Interconnection for Mounting Semiconductor Die in FO-WLCSP'
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Array
(
[id] => 9003771
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[patent_title] => 'MICRO-ELECTRO-MECHANICAL SYSTEM TILTABLE LENS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/842564 | Micro-electro-mechanical system tiltable lens | Mar 14, 2013 | Issued |
Array
(
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/763798 | Transistor with heat sink joined to only part of one electrode | Feb 10, 2013 | Issued |
Array
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Array
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Array
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