Willis Little
Examiner (ID: 13674)
Most Active Art Unit | 3203 |
Art Unit(s) | 2899, 3643, 2107, 2403, 2406, 3203, 3616, 2401, 2103 |
Total Applications | 2327 |
Issued Applications | 2182 |
Pending Applications | 48 |
Abandoned Applications | 97 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5622983
[patent_doc_number] => 20060261488
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same'
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[patent_app_number] => 11/492816
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[pdf_file] => publications/A1/0261/20060261488.pdf
[firstpage_image] =>[orig_patent_app_number] => 11492816
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/492816 | Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same | Jul 25, 2006 | Abandoned |
Array
(
[id] => 4619662
[patent_doc_number] => 07999383
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-16
[patent_title] => 'High speed, high density, low power die interconnect system'
[patent_app_type] => utility
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[patent_app_date] => 2006-07-21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/459081 | High speed, high density, low power die interconnect system | Jul 20, 2006 | Issued |
Array
(
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[patent_issue_date] => 2008-12-09
[patent_title] => 'Semiconductor devices having torsional stresses'
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[patent_app_number] => 11/458461
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[patent_app_date] => 2006-07-19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/458461 | Semiconductor devices having torsional stresses | Jul 18, 2006 | Issued |
Array
(
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[patent_issue_date] => 2010-05-11
[patent_title] => 'Pad structure design with reduced density'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/458501 | Pad structure design with reduced density | Jul 18, 2006 | Issued |
Array
(
[id] => 5098759
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[patent_title] => 'Semiconductor device and manufacturing method for the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/487421 | Semiconductor device having a bump formed over an electrode pad | Jul 16, 2006 | Issued |
Array
(
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[patent_issue_date] => 2009-10-06
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Array
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[pdf_file] => patents/07/217/07217616.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/481043 | Non-volatile memory cell and method of forming the same | Jul 5, 2006 | Issued |
Array
(
[id] => 4992243
[patent_doc_number] => 20070007587
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[patent_issue_date] => 2007-01-11
[patent_title] => 'Diode'
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[patent_app_number] => 11/428741
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/428741 | Diode | Jul 4, 2006 | Abandoned |
Array
(
[id] => 93122
[patent_doc_number] => 07732890
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-08
[patent_title] => 'Integrated circuit with high voltage junction structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/426941 | Integrated circuit with high voltage junction structure | Jun 27, 2006 | Issued |
Array
(
[id] => 5832243
[patent_doc_number] => 20060244073
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[patent_issue_date] => 2006-11-02
[patent_title] => 'FABRICATION OF AN EEPROM CELL WITH SiGe SOURCE/DRAIN REGIONS'
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[patent_app_number] => 11/426371
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/426371 | FABRICATION OF AN EEPROM CELL WITH SiGe SOURCE/DRAIN REGIONS | Jun 25, 2006 | Abandoned |
Array
(
[id] => 5642830
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/451422 | Semiconductor device and a method of manufacturing the same | Jun 12, 2006 | Issued |
Array
(
[id] => 5854622
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/450806 | Super lattice modification of overlying transistor | Jun 7, 2006 | Issued |
Array
(
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[patent_title] => 'METHOD AND DEVICE FOR CONCENTRATING LIGHT IN OPTOELECTRONIC DEVICES USING RESONANT CAVITY MODES'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/422351 | Method and device for concentrating light in optoelectronic devices using resonant cavity modes | Jun 5, 2006 | Issued |
Array
(
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[patent_title] => 'ISOLATING CHIP-TO-CHIP CONTACT'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/421671 | Semiconductor device fabricated using a metal microstructure control process | May 31, 2006 | Issued |
Array
(
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Array
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Array
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Array
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