Willis Little
Examiner (ID: 13674)
Most Active Art Unit | 3203 |
Art Unit(s) | 2899, 3643, 2107, 2403, 2406, 3203, 3616, 2401, 2103 |
Total Applications | 2327 |
Issued Applications | 2182 |
Pending Applications | 48 |
Abandoned Applications | 97 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 7348407
[patent_doc_number] => 20040012089
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-22
[patent_title] => 'Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications'
[patent_app_type] => new
[patent_app_number] => 10/346451
[patent_app_country] => US
[patent_app_date] => 2003-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20040012089.pdf
[firstpage_image] =>[orig_patent_app_number] => 10346451
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/346451 | Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications | Jan 16, 2003 | Issued |
Array
(
[id] => 1144879
[patent_doc_number] => 06777793
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-17
[patent_title] => 'Packaging substrate with electrostatic discharge protection'
[patent_app_type] => B2
[patent_app_number] => 10/289852
[patent_app_country] => US
[patent_app_date] => 2002-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/777/06777793.pdf
[firstpage_image] =>[orig_patent_app_number] => 10289852
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/289852 | Packaging substrate with electrostatic discharge protection | Nov 6, 2002 | Issued |
Array
(
[id] => 1066270
[patent_doc_number] => 06847096
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-01-25
[patent_title] => 'Semiconductor wafer having discharge structure to substrate'
[patent_app_type] => utility
[patent_app_number] => 10/286881
[patent_app_country] => US
[patent_app_date] => 2002-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1305
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[pdf_file] => patents/06/847/06847096.pdf
[firstpage_image] =>[orig_patent_app_number] => 10286881
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/286881 | Semiconductor wafer having discharge structure to substrate | Nov 3, 2002 | Issued |
Array
(
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[patent_doc_number] => 20030091673
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[patent_kind] => A1
[patent_issue_date] => 2003-05-15
[patent_title] => 'Packaging substrate with electrostatic discharge protection'
[patent_app_type] => new
[patent_app_number] => 10/282422
[patent_app_country] => US
[patent_app_date] => 2002-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 1199
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0091/20030091673.pdf
[firstpage_image] =>[orig_patent_app_number] => 10282422
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/282422 | Packaging substrate with electrostatic discharge protection | Oct 28, 2002 | Issued |
Array
(
[id] => 7368691
[patent_doc_number] => 20040026742
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-12
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/416261
[patent_app_country] => US
[patent_app_date] => 2003-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 6766
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[pdf_file] => publications/A1/0026/20040026742.pdf
[firstpage_image] =>[orig_patent_app_number] => 10416261
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/416261 | Semiconductor device | Sep 11, 2002 | Issued |
Array
(
[id] => 1120860
[patent_doc_number] => 06798026
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-09-28
[patent_title] => 'Conductor layer nitridation'
[patent_app_type] => B2
[patent_app_number] => 10/231758
[patent_app_country] => US
[patent_app_date] => 2002-08-29
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[pdf_file] => patents/06/798/06798026.pdf
[firstpage_image] =>[orig_patent_app_number] => 10231758
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/231758 | Conductor layer nitridation | Aug 28, 2002 | Issued |
Array
(
[id] => 616785
[patent_doc_number] => 07145198
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-12-05
[patent_title] => 'Compositions for thin-film capacitance device, high-dielectric constant insulating film, thin-film capacitance device, and thin-film multilayer capacitor'
[patent_app_type] => utility
[patent_app_number] => 10/487782
[patent_app_country] => US
[patent_app_date] => 2002-08-26
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[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 9284
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[pdf_file] => patents/07/145/07145198.pdf
[firstpage_image] =>[orig_patent_app_number] => 10487782
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/487782 | Compositions for thin-film capacitance device, high-dielectric constant insulating film, thin-film capacitance device, and thin-film multilayer capacitor | Aug 25, 2002 | Issued |
Array
(
[id] => 6718206
[patent_doc_number] => 20030051893
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-20
[patent_title] => 'Surface-mounting connector and semiconductor module using the same'
[patent_app_type] => new
[patent_app_number] => 10/222792
[patent_app_country] => US
[patent_app_date] => 2002-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 5387
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[pdf_file] => publications/A1/0051/20030051893.pdf
[firstpage_image] =>[orig_patent_app_number] => 10222792
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/222792 | Surface-mounting connector and semiconductor module using the same | Aug 18, 2002 | Abandoned |
Array
(
[id] => 7411961
[patent_doc_number] => 20040207083
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-21
[patent_title] => 'Low dielectric constant layers'
[patent_app_type] => new
[patent_app_number] => 10/482971
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[patent_app_date] => 2004-01-07
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[firstpage_image] =>[orig_patent_app_number] => 10482971
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/482971 | Low dielectric constant layers | Jul 14, 2002 | Issued |
Array
(
[id] => 1314566
[patent_doc_number] => 06614117
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-02
[patent_title] => 'Method for metallization of a semiconductor substrate and related structure'
[patent_app_type] => B1
[patent_app_number] => 10/163662
[patent_app_country] => US
[patent_app_date] => 2002-06-04
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[firstpage_image] =>[orig_patent_app_number] => 10163662
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/163662 | Method for metallization of a semiconductor substrate and related structure | Jun 3, 2002 | Issued |
Array
(
[id] => 6733425
[patent_doc_number] => 20030011060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-16
[patent_title] => 'Semiconductor die adapter and method of using'
[patent_app_type] => new
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[patent_app_country] => US
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[pdf_file] => publications/A1/0011/20030011060.pdf
[firstpage_image] =>[orig_patent_app_number] => 10159682
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/159682 | Semiconductor die adapter and method of using | May 30, 2002 | Issued |
Array
(
[id] => 6794773
[patent_doc_number] => 20030173646
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-09-18
[patent_title] => 'Non-volatile semiconductor memory structure and method of manufacture'
[patent_app_type] => new
[patent_app_number] => 10/099801
[patent_app_country] => US
[patent_app_date] => 2002-03-13
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[firstpage_image] =>[orig_patent_app_number] => 10099801
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/099801 | Non-volatile semiconductor memory structure | Mar 12, 2002 | Issued |
10/092812 | Stacked ferroelectric capacitor with dielectric layers and process for fabricating same | Mar 6, 2002 | Abandoned |
Array
(
[id] => 6708942
[patent_doc_number] => 20030168691
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[patent_title] => 'Variable capactor structure and method of manufacture'
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[firstpage_image] =>[orig_patent_app_number] => 10091942
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/091942 | Variable capactor structure | Mar 4, 2002 | Issued |
Array
(
[id] => 6300604
[patent_doc_number] => 20020093088
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[patent_title] => 'High density integrated circuits and the method of packaging the same'
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[firstpage_image] =>[orig_patent_app_number] => 10057448
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/057448 | High density integrated circuits and the method of packaging the same | Jan 24, 2002 | Abandoned |
Array
(
[id] => 928762
[patent_doc_number] => 07315072
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-01-01
[patent_title] => 'Semiconductor device capable of suppressing current concentration in pad and its manufacture method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/050171 | Semiconductor device capable of suppressing current concentration in pad and its manufacture method | Jan 17, 2002 | Issued |
Array
(
[id] => 1284885
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[patent_issue_date] => 2003-10-28
[patent_title] => 'Method for fabricating BOC semiconductor package'
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[firstpage_image] =>[orig_patent_app_number] => 10047903
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/047903 | Method for fabricating BOC semiconductor package | Jan 16, 2002 | Issued |
Array
(
[id] => 6108565
[patent_doc_number] => 20020171782
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[patent_title] => 'Array substrate for a liquid crystal display device and manufacturing method for the same'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/032062 | Liquid crystal display having a protective alignment film and fabricating method thereof | Dec 30, 2001 | Issued |
Array
(
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