Search

Willis Little

Examiner (ID: 13674)

Most Active Art Unit
3203
Art Unit(s)
2899, 3643, 2107, 2403, 2406, 3203, 3616, 2401, 2103
Total Applications
2327
Issued Applications
2182
Pending Applications
48
Abandoned Applications
97

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3918537 [patent_doc_number] => 06002181 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-14 [patent_title] => 'Structure of resin molded type semiconductor device with embedded thermal dissipator' [patent_app_type] => 1 [patent_app_number] => 8/551917 [patent_app_country] => US [patent_app_date] => 1995-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 5272 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/002/06002181.pdf [firstpage_image] =>[orig_patent_app_number] => 551917 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/551917
Structure of resin molded type semiconductor device with embedded thermal dissipator Oct 22, 1995 Issued
Array ( [id] => 4411945 [patent_doc_number] => 06172417 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-09 [patent_title] => 'Integrated semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/535677 [patent_app_country] => US [patent_app_date] => 1995-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3407 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/172/06172417.pdf [firstpage_image] =>[orig_patent_app_number] => 535677 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/535677
Integrated semiconductor devices Sep 26, 1995 Issued
Array ( [id] => 1553017 [patent_doc_number] => 06400011 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-04 [patent_title] => 'Semiconductor laser module' [patent_app_type] => B1 [patent_app_number] => 08/467052 [patent_app_country] => US [patent_app_date] => 1995-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1401 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/400/06400011.pdf [firstpage_image] =>[orig_patent_app_number] => 08467052 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/467052
Semiconductor laser module Jun 5, 1995 Issued
Array ( [id] => 1552823 [patent_doc_number] => 06399976 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-04 [patent_title] => 'Shrink-wrap collar for DRAM deep trenches' [patent_app_type] => B1 [patent_app_number] => 08/467353 [patent_app_country] => US [patent_app_date] => 1995-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 5626 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/399/06399976.pdf [firstpage_image] =>[orig_patent_app_number] => 08467353 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/467353
Shrink-wrap collar for DRAM deep trenches Jun 5, 1995 Issued
08/456542 ELECTRONIC STRUCTURE AND METHOD FOR MAKING SAME May 31, 1995 Abandoned
Array ( [id] => 4351114 [patent_doc_number] => 06285073 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Contact structure and method of formation' [patent_app_type] => 1 [patent_app_number] => 8/453689 [patent_app_country] => US [patent_app_date] => 1995-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 24 [patent_no_of_words] => 4974 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/285/06285073.pdf [firstpage_image] =>[orig_patent_app_number] => 453689 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/453689
Contact structure and method of formation May 29, 1995 Issued
Array ( [id] => 1404819 [patent_doc_number] => 06531783 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-11 [patent_title] => 'Method of via formation for multilevel interconnect integrated circuits' [patent_app_type] => B1 [patent_app_number] => 08/436133 [patent_app_country] => US [patent_app_date] => 1995-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 1741 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/531/06531783.pdf [firstpage_image] =>[orig_patent_app_number] => 08436133 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/436133
Method of via formation for multilevel interconnect integrated circuits May 7, 1995 Issued
Array ( [id] => 1497153 [patent_doc_number] => 06404051 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Semiconductor device having a protruding bump electrode' [patent_app_type] => B1 [patent_app_number] => 08/409933 [patent_app_country] => US [patent_app_date] => 1995-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3052 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/404/06404051.pdf [firstpage_image] =>[orig_patent_app_number] => 08409933 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/409933
Semiconductor device having a protruding bump electrode Mar 22, 1995 Issued
Array ( [id] => 4413973 [patent_doc_number] => 06300688 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-09 [patent_title] => 'Bond pad having vias usable with antifuse process technology' [patent_app_type] => 1 [patent_app_number] => 8/350865 [patent_app_country] => US [patent_app_date] => 1994-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2505 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/300/06300688.pdf [firstpage_image] =>[orig_patent_app_number] => 350865 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/350865
Bond pad having vias usable with antifuse process technology Dec 6, 1994 Issued
Array ( [id] => 4151735 [patent_doc_number] => 06064077 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-16 [patent_title] => 'Integrated circuit transistor' [patent_app_type] => 1 [patent_app_number] => 8/350504 [patent_app_country] => US [patent_app_date] => 1994-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 1297 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/064/06064077.pdf [firstpage_image] =>[orig_patent_app_number] => 350504 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/350504
Integrated circuit transistor Dec 5, 1994 Issued
Array ( [id] => 4301336 [patent_doc_number] => 06184575 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Ultra-thin composite package for integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/296671 [patent_app_country] => US [patent_app_date] => 1994-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3214 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184575.pdf [firstpage_image] =>[orig_patent_app_number] => 296671 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/296671
Ultra-thin composite package for integrated circuits Aug 25, 1994 Issued
Array ( [id] => 3918255 [patent_doc_number] => 06002164 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-14 [patent_title] => 'Semiconductor lead frame' [patent_app_type] => 1 [patent_app_number] => 8/296269 [patent_app_country] => US [patent_app_date] => 1994-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1859 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/002/06002164.pdf [firstpage_image] =>[orig_patent_app_number] => 296269 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/296269
Semiconductor lead frame Aug 24, 1994 Issued
Array ( [id] => 4333965 [patent_doc_number] => 06320258 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-20 [patent_title] => 'Semiconductor device having alternating electrically insulative coated leads' [patent_app_type] => 1 [patent_app_number] => 8/216772 [patent_app_country] => US [patent_app_date] => 1994-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2115 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/320/06320258.pdf [firstpage_image] =>[orig_patent_app_number] => 216772 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/216772
Semiconductor device having alternating electrically insulative coated leads Mar 22, 1994 Issued
Array ( [id] => 4212476 [patent_doc_number] => 06028348 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-22 [patent_title] => 'Low thermal impedance integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/159648 [patent_app_country] => US [patent_app_date] => 1993-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 4605 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/028/06028348.pdf [firstpage_image] =>[orig_patent_app_number] => 159648 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/159648
Low thermal impedance integrated circuit Nov 29, 1993 Issued
Array ( [id] => 3950611 [patent_doc_number] => 05990554 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Semiconductor package having isolated heatsink bonding pads' [patent_app_type] => 1 [patent_app_number] => 8/052857 [patent_app_country] => US [patent_app_date] => 1993-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2611 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/990/05990554.pdf [firstpage_image] =>[orig_patent_app_number] => 052857 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/052857
Semiconductor package having isolated heatsink bonding pads Apr 22, 1993 Issued
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