Willis Little
Examiner (ID: 13674)
Most Active Art Unit | 3203 |
Art Unit(s) | 2899, 3643, 2107, 2403, 2406, 3203, 3616, 2401, 2103 |
Total Applications | 2327 |
Issued Applications | 2182 |
Pending Applications | 48 |
Abandoned Applications | 97 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 3918537
[patent_doc_number] => 06002181
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-14
[patent_title] => 'Structure of resin molded type semiconductor device with embedded thermal dissipator'
[patent_app_type] => 1
[patent_app_number] => 8/551917
[patent_app_country] => US
[patent_app_date] => 1995-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 16
[patent_no_of_words] => 5272
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/002/06002181.pdf
[firstpage_image] =>[orig_patent_app_number] => 551917
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/551917 | Structure of resin molded type semiconductor device with embedded thermal dissipator | Oct 22, 1995 | Issued |
Array
(
[id] => 4411945
[patent_doc_number] => 06172417
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-09
[patent_title] => 'Integrated semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/535677
[patent_app_country] => US
[patent_app_date] => 1995-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3407
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/172/06172417.pdf
[firstpage_image] =>[orig_patent_app_number] => 535677
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/535677 | Integrated semiconductor devices | Sep 26, 1995 | Issued |
Array
(
[id] => 1553017
[patent_doc_number] => 06400011
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-04
[patent_title] => 'Semiconductor laser module'
[patent_app_type] => B1
[patent_app_number] => 08/467052
[patent_app_country] => US
[patent_app_date] => 1995-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1401
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 128
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/400/06400011.pdf
[firstpage_image] =>[orig_patent_app_number] => 08467052
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/467052 | Semiconductor laser module | Jun 5, 1995 | Issued |
Array
(
[id] => 1552823
[patent_doc_number] => 06399976
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-04
[patent_title] => 'Shrink-wrap collar for DRAM deep trenches'
[patent_app_type] => B1
[patent_app_number] => 08/467353
[patent_app_country] => US
[patent_app_date] => 1995-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 5626
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/399/06399976.pdf
[firstpage_image] =>[orig_patent_app_number] => 08467353
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/467353 | Shrink-wrap collar for DRAM deep trenches | Jun 5, 1995 | Issued |
08/456542 | ELECTRONIC STRUCTURE AND METHOD FOR MAKING SAME | May 31, 1995 | Abandoned |
Array
(
[id] => 4351114
[patent_doc_number] => 06285073
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Contact structure and method of formation'
[patent_app_type] => 1
[patent_app_number] => 8/453689
[patent_app_country] => US
[patent_app_date] => 1995-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 24
[patent_no_of_words] => 4974
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/285/06285073.pdf
[firstpage_image] =>[orig_patent_app_number] => 453689
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/453689 | Contact structure and method of formation | May 29, 1995 | Issued |
Array
(
[id] => 1404819
[patent_doc_number] => 06531783
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-11
[patent_title] => 'Method of via formation for multilevel interconnect integrated circuits'
[patent_app_type] => B1
[patent_app_number] => 08/436133
[patent_app_country] => US
[patent_app_date] => 1995-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 1741
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 155
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/531/06531783.pdf
[firstpage_image] =>[orig_patent_app_number] => 08436133
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/436133 | Method of via formation for multilevel interconnect integrated circuits | May 7, 1995 | Issued |
Array
(
[id] => 1497153
[patent_doc_number] => 06404051
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Semiconductor device having a protruding bump electrode'
[patent_app_type] => B1
[patent_app_number] => 08/409933
[patent_app_country] => US
[patent_app_date] => 1995-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3052
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/404/06404051.pdf
[firstpage_image] =>[orig_patent_app_number] => 08409933
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/409933 | Semiconductor device having a protruding bump electrode | Mar 22, 1995 | Issued |
Array
(
[id] => 4413973
[patent_doc_number] => 06300688
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-09
[patent_title] => 'Bond pad having vias usable with antifuse process technology'
[patent_app_type] => 1
[patent_app_number] => 8/350865
[patent_app_country] => US
[patent_app_date] => 1994-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2505
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/300/06300688.pdf
[firstpage_image] =>[orig_patent_app_number] => 350865
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/350865 | Bond pad having vias usable with antifuse process technology | Dec 6, 1994 | Issued |
Array
(
[id] => 4151735
[patent_doc_number] => 06064077
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-16
[patent_title] => 'Integrated circuit transistor'
[patent_app_type] => 1
[patent_app_number] => 8/350504
[patent_app_country] => US
[patent_app_date] => 1994-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1297
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/064/06064077.pdf
[firstpage_image] =>[orig_patent_app_number] => 350504
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/350504 | Integrated circuit transistor | Dec 5, 1994 | Issued |
Array
(
[id] => 4301336
[patent_doc_number] => 06184575
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-06
[patent_title] => 'Ultra-thin composite package for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 8/296671
[patent_app_country] => US
[patent_app_date] => 1994-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 10
[patent_no_of_words] => 3214
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/184/06184575.pdf
[firstpage_image] =>[orig_patent_app_number] => 296671
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/296671 | Ultra-thin composite package for integrated circuits | Aug 25, 1994 | Issued |
Array
(
[id] => 3918255
[patent_doc_number] => 06002164
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-14
[patent_title] => 'Semiconductor lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/296269
[patent_app_country] => US
[patent_app_date] => 1994-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 1859
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/002/06002164.pdf
[firstpage_image] =>[orig_patent_app_number] => 296269
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/296269 | Semiconductor lead frame | Aug 24, 1994 | Issued |
Array
(
[id] => 4333965
[patent_doc_number] => 06320258
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Semiconductor device having alternating electrically insulative coated leads'
[patent_app_type] => 1
[patent_app_number] => 8/216772
[patent_app_country] => US
[patent_app_date] => 1994-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2115
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/320/06320258.pdf
[firstpage_image] =>[orig_patent_app_number] => 216772
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/216772 | Semiconductor device having alternating electrically insulative coated leads | Mar 22, 1994 | Issued |
Array
(
[id] => 4212476
[patent_doc_number] => 06028348
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-22
[patent_title] => 'Low thermal impedance integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/159648
[patent_app_country] => US
[patent_app_date] => 1993-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 27
[patent_no_of_words] => 4605
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/028/06028348.pdf
[firstpage_image] =>[orig_patent_app_number] => 159648
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/159648 | Low thermal impedance integrated circuit | Nov 29, 1993 | Issued |
Array
(
[id] => 3950611
[patent_doc_number] => 05990554
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Semiconductor package having isolated heatsink bonding pads'
[patent_app_type] => 1
[patent_app_number] => 8/052857
[patent_app_country] => US
[patent_app_date] => 1993-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 2611
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/990/05990554.pdf
[firstpage_image] =>[orig_patent_app_number] => 052857
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/052857 | Semiconductor package having isolated heatsink bonding pads | Apr 22, 1993 | Issued |