Search

Wilner Jean Baptiste

Examiner (ID: 2332, Phone: (571)270-7394 , Office: P/2823 )

Most Active Art Unit
2899
Art Unit(s)
2899, 2823
Total Applications
1296
Issued Applications
1084
Pending Applications
84
Abandoned Applications
155

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19926245 [patent_doc_number] => 12300538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-13 [patent_title] => Fin field effect transistor (FinFET) device structure with protection layer and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/346573 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 3284 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346573 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/346573
Fin field effect transistor (FinFET) device structure with protection layer and method for forming the same Jul 2, 2023 Issued
Array ( [id] => 18882932 [patent_doc_number] => 20240006301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/345611 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13949 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18345611 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/345611
SEMICONDUCTOR PACKAGE Jun 29, 2023 Pending
Array ( [id] => 19926346 [patent_doc_number] => 12300640 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-13 [patent_title] => Semiconductor device and method of manufacturing thereof [patent_app_type] => utility [patent_app_number] => 18/213759 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 30 [patent_no_of_words] => 2481 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213759 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/213759
Semiconductor device and method of manufacturing thereof Jun 22, 2023 Issued
Array ( [id] => 18851155 [patent_doc_number] => 20230413559 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/209173 [patent_app_country] => US [patent_app_date] => 2023-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7694 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18209173 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/209173
Three dimensional memory and methods of forming the same Jun 12, 2023 Issued
Array ( [id] => 19781521 [patent_doc_number] => 12230559 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-18 [patent_title] => Semiconductor device and method of forming micro interconnect structures [patent_app_type] => utility [patent_app_number] => 18/329347 [patent_app_country] => US [patent_app_date] => 2023-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 22 [patent_no_of_words] => 5175 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18329347 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/329347
Semiconductor device and method of forming micro interconnect structures Jun 4, 2023 Issued
Array ( [id] => 19619229 [patent_doc_number] => 20240404909 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/327179 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5693 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327179 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327179
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME May 31, 2023 Pending
Array ( [id] => 19007935 [patent_doc_number] => 20240072006 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/326554 [patent_app_country] => US [patent_app_date] => 2023-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10390 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18326554 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/326554
SEMICONDUCTOR PACKAGE May 30, 2023 Pending
Array ( [id] => 19627211 [patent_doc_number] => 12166061 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Semiconductor device and method of manufacturing the same, and electronic apparatus [patent_app_type] => utility [patent_app_number] => 18/321439 [patent_app_country] => US [patent_app_date] => 2023-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 31 [patent_no_of_words] => 12337 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18321439 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/321439
Semiconductor device and method of manufacturing the same, and electronic apparatus May 21, 2023 Issued
Array ( [id] => 19269515 [patent_doc_number] => 20240213219 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/320455 [patent_app_country] => US [patent_app_date] => 2023-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8302 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18320455 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/320455
MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE May 18, 2023 Pending
Array ( [id] => 18631804 [patent_doc_number] => 20230290709 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => Semiconductor Package and Method for Fabricating a Semiconductor Package [patent_app_type] => utility [patent_app_number] => 18/197800 [patent_app_country] => US [patent_app_date] => 2023-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4501 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18197800 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/197800
Semiconductor package and method for fabricating a semiconductor package May 15, 2023 Issued
Array ( [id] => 19575272 [patent_doc_number] => 20240379564 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-14 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING [patent_app_type] => utility [patent_app_number] => 18/196070 [patent_app_country] => US [patent_app_date] => 2023-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6926 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18196070 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/196070
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING May 10, 2023 Pending
Array ( [id] => 18975280 [patent_doc_number] => 20240055372 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES [patent_app_type] => utility [patent_app_number] => 18/315689 [patent_app_country] => US [patent_app_date] => 2023-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12968 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18315689 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/315689
HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES May 10, 2023 Pending
Array ( [id] => 19559947 [patent_doc_number] => 20240371739 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-07 [patent_title] => ELECTRONIC PACKAGE [patent_app_type] => utility [patent_app_number] => 18/144162 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7392 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18144162 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/144162
ELECTRONIC PACKAGE May 4, 2023 Pending
Array ( [id] => 19146336 [patent_doc_number] => 20240145366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/141519 [patent_app_country] => US [patent_app_date] => 2023-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8065 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141519 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/141519
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE Apr 30, 2023 Pending
Array ( [id] => 19546437 [patent_doc_number] => 20240363473 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/309218 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10496 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18309218 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/309218
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES Apr 27, 2023 Pending
Array ( [id] => 20597927 [patent_doc_number] => 12581664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-17 [patent_title] => Semiconductor package and method of manufacturing same [patent_app_type] => utility [patent_app_number] => 18/140960 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 22 [patent_no_of_words] => 5687 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18140960 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/140960
Semiconductor package and method of manufacturing same Apr 27, 2023 Issued
Array ( [id] => 19116461 [patent_doc_number] => 20240128211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING [patent_app_type] => utility [patent_app_number] => 18/308032 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10997 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308032 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308032
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING Apr 26, 2023 Pending
Array ( [id] => 18570489 [patent_doc_number] => 20230260826 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUDING POWER DISTRIBUTION GRIDS [patent_app_type] => utility [patent_app_number] => 18/138110 [patent_app_country] => US [patent_app_date] => 2023-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 53960 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138110 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/138110
3D semiconductor device and structure including power distribution grids Apr 22, 2023 Issued
Array ( [id] => 18757613 [patent_doc_number] => 20230361076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => CHIP ARRANGEMENT [patent_app_type] => utility [patent_app_number] => 18/303177 [patent_app_country] => US [patent_app_date] => 2023-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3925 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18303177 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/303177
CHIP ARRANGEMENT Apr 18, 2023 Pending
Array ( [id] => 18959010 [patent_doc_number] => 20240047337 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/302884 [patent_app_country] => US [patent_app_date] => 2023-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8724 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302884 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/302884
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME Apr 18, 2023 Pending
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