
Xiaoliang Chen
Examiner (ID: 19495, Phone: (571)272-9079 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2848, 2847, 2835, 2841 |
| Total Applications | 1933 |
| Issued Applications | 1506 |
| Pending Applications | 9 |
| Abandoned Applications | 422 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 13979981
[patent_doc_number] => 10219373
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[patent_kind] => B2
[patent_issue_date] => 2019-02-26
[patent_title] => Selective deposition of thin film dielectrics using surface blocking chemistry
[patent_app_type] => utility
[patent_app_number] => 15/912388
[patent_app_country] => US
[patent_app_date] => 2018-03-05
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Array
(
[id] => 16538373
[patent_doc_number] => 10881001
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2020-12-29
[patent_title] => Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits
[patent_app_type] => utility
[patent_app_number] => 15/910740
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/910740 | Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits | Mar 1, 2018 | Issued |
Array
(
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[patent_issue_date] => 2019-05-07
[patent_title] => Capacitor and substrate module
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[patent_app_date] => 2018-02-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/906454 | Capacitor and substrate module | Feb 26, 2018 | Issued |
Array
(
[id] => 13755087
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[patent_issue_date] => 2019-01-01
[patent_title] => Method for manufacturing an electronic device and method for operating an electronic device
[patent_app_type] => utility
[patent_app_number] => 15/899437
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[patent_app_date] => 2018-02-20
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Array
(
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[patent_doc_number] => 20180233275
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[patent_issue_date] => 2018-08-16
[patent_title] => THREE-PHASE AC REACTOR CAPABLE OF REDUCING LEAKAGE OF MAGNETIC FLUX
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/895138 | Three-phase AC reactor capable of reducing leakage of magnetic flux | Feb 12, 2018 | Issued |
Array
(
[id] => 12806098
[patent_doc_number] => 20180160536
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-06-07
[patent_title] => COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTILAYERED PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF MULTILAYERED PRINTED WIRING BOARD
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/891903 | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | Feb 7, 2018 | Issued |
Array
(
[id] => 14252543
[patent_doc_number] => 10276478
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[patent_issue_date] => 2019-04-30
[patent_title] => Lead frame
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Array
(
[id] => 13396069
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[patent_issue_date] => 2018-08-30
[patent_title] => CAPACITOR AND SUBSTRATE MODULE
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/888422 | CAPACITOR AND SUBSTRATE MODULE | Feb 4, 2018 | Abandoned |
Array
(
[id] => 12783586
[patent_doc_number] => 20180153031
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[patent_kind] => A1
[patent_issue_date] => 2018-05-31
[patent_title] => MULTIFUNCTIONAL COMPONENTS FOR ELECTRONIC DEVICES AND RELATED METHODS OF PROVIDING THERMAL MANAGEMENT AND BOARD LEVEL SHIELDING
[patent_app_type] => utility
[patent_app_number] => 15/884584
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/884584 | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding | Jan 30, 2018 | Issued |
Array
(
[id] => 16632141
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Array
(
[id] => 18032055
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Array
(
[id] => 13363499
[patent_doc_number] => 20180233289
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[patent_title] => MULTILAYER CERAMIC CAPACITOR
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/880027 | Multilayer ceramic capacitor | Jan 24, 2018 | Issued |
Array
(
[id] => 13861923
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Array
(
[id] => 16821657
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[patent_title] => Wiring base plate, electronic device package, and electronic device
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Array
(
[id] => 13352987
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[patent_title] => Electrical Connection Method of Printed Circuit and Electrical Connection Structure of Printed Circuit
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Array
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[patent_title] => Multilayer printed circuit board capable of reducing transmission loss of high speed signals
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Array
(
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Array
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Array
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