
Xiaoliang Chen
Examiner (ID: 19495, Phone: (571)272-9079 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2848, 2847, 2835, 2841 |
| Total Applications | 1933 |
| Issued Applications | 1506 |
| Pending Applications | 9 |
| Abandoned Applications | 422 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18417525
[patent_doc_number] => 11672083
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[patent_kind] => B2
[patent_issue_date] => 2023-06-06
[patent_title] => Method of manufacturing composite circuit board
[patent_app_type] => utility
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Array
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[patent_doc_number] => 11785707
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[patent_kind] => B2
[patent_issue_date] => 2023-10-10
[patent_title] => Circuit board and manufacturing method thereof and electronic device
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Array
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[patent_issue_date] => 2024-05-21
[patent_title] => Circuit board structure and manufacturing method thereof
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Array
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[patent_issue_date] => 2025-05-27
[patent_title] => Package body, preparation method thereof, terminal, and electronic device
[patent_app_type] => utility
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Array
(
[id] => 17632479
[patent_doc_number] => 20220167494
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[patent_issue_date] => 2022-05-26
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Array
(
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[patent_doc_number] => 20220005788
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[patent_kind] => A1
[patent_issue_date] => 2022-01-06
[patent_title] => SYSTEMS AND METHODS FOR POWERING AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE
[patent_app_type] => utility
[patent_app_number] => 17/481519
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/481519 | SYSTEMS AND METHODS FOR POWERING AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE | Sep 21, 2021 | Abandoned |
Array
(
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[patent_doc_number] => 20220007501
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[patent_title] => SETTING THE IMPEDANCE OF SIGNAL TRACES OF A CIRCUIT BOARD USING A REFERENCE TRACE
[patent_app_type] => utility
[patent_app_number] => 17/480696
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/480696 | Setting the impedance of signal traces of a circuit board using a reference trace | Sep 20, 2021 | Issued |
Array
(
[id] => 18625582
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Array
(
[id] => 18373250
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Array
(
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[patent_title] => MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/471219 | Multilayer resin substrate and method of manufacturing multilayer resin substrate | Sep 9, 2021 | Issued |
Array
(
[id] => 17321249
[patent_doc_number] => 20210410299
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[patent_title] => CIRCUIT CARRIER, PACKAGE, AND METHOD FOR MANUFACTURING A PACKAGE
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Array
(
[id] => 18344226
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[patent_title] => Electromagnetic compatibility contact between metal castings and printed circuit boards
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/445331 | Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser | Aug 17, 2021 | Issued |
Array
(
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Array
(
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Array
(
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[patent_title] => Autoclavable electronics unit for an endoscope, method for producing an autoclavable electronics unit and endoscope
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Array
(
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Array
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Array
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