Xin Y. Zhong

Array ( [id] => 217470 [patent_doc_number] => 07612382 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-03 [patent_title] => 'Method for defeating reverse engineering of integrated circuits by optical means' [patent_app_type] => utility [patent_app_number] => 12/140714 [patent_app_country] => US [patent_app_date] => 2008-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 17 [patent_no_of_words] => 6890 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/612/07612382.pdf [firstpage_image] =>[orig_patent_app_number] => 12140714 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4817067 [patent_doc_number] => 20080224326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-18 [patent_title] => 'Chip structure with bumps and testing pads' [patent_app_type] => utility [patent_app_number] => 12/127794 [patent_app_country] => US [patent_app_date] => 2008-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4826 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20080224326.pdf [firstpage_image] =>[orig_patent_app_number] => 12127794 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4532715 [patent_doc_number] => 07923849 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-12 [patent_title] => 'Interconnections for flip-chip using lead-free solders and having reaction barrier layers' [patent_app_type] => utility [patent_app_number] => 12/113152 [patent_app_country] => US [patent_app_date] => 2008-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 5738 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/923/07923849.pdf [firstpage_image] =>[orig_patent_app_number] => 12113152 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4722971 [patent_doc_number] => 20080202792 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-28 [patent_title] => 'INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS' [patent_app_type] => utility [patent_app_number] => 12/113195 [patent_app_country] => US [patent_app_date] => 2008-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5730 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0202/20080202792.pdf [firstpage_image] =>[orig_patent_app_number] => 12113195 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 124133 [patent_doc_number] => 07705431 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-04-27 [patent_title] => 'Method of improving adhesion between two dielectric films' [patent_app_type] => utility [patent_app_number] => 12/060344 [patent_app_country] => US [patent_app_date] => 2008-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4228 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705431.pdf [firstpage_image] =>[orig_patent_app_number] => 12060344 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 32574 [patent_doc_number] => 07790614 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/030960 [patent_app_country] => US [patent_app_date] => 2008-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4925 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/790/07790614.pdf [firstpage_image] =>[orig_patent_app_number] => 12030960 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4915761 [patent_doc_number] => 20080096361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-24 [patent_title] => 'STRUCTURE FOR REALIZING INTEGRATED CIRCUIT HAVING SCHOTTKY DIODE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/963354 [patent_app_country] => US [patent_app_date] => 2007-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3253 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20080096361.pdf [firstpage_image] =>[orig_patent_app_number] => 11963354 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4749257 [patent_doc_number] => 20080157328 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 11/960760 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4460 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157328.pdf [firstpage_image] =>[orig_patent_app_number] => 11960760 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5327991 [patent_doc_number] => 20090108468 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-30 [patent_title] => 'STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/953134 [patent_app_country] => US [patent_app_date] => 2007-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4042 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20090108468.pdf [firstpage_image] =>[orig_patent_app_number] => 11953134 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4577861 [patent_doc_number] => 07833831 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-16 [patent_title] => 'Method of manufacturing an electronic component and an electronic device' [patent_app_type] => utility [patent_app_number] => 11/951693 [patent_app_country] => US [patent_app_date] => 2007-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 5324 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/833/07833831.pdf [firstpage_image] =>[orig_patent_app_number] => 11951693 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4829438 [patent_doc_number] => 20080128882 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/949523 [patent_app_country] => US [patent_app_date] => 2007-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6187 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20080128882.pdf [firstpage_image] =>[orig_patent_app_number] => 11949523 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5573071 [patent_doc_number] => 20090140432 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-04 [patent_title] => 'PAD STRUCTURE TO PROVIDE IMPROVED STRESS RELIEF' [patent_app_type] => utility [patent_app_number] => 11/947184 [patent_app_country] => US [patent_app_date] => 2007-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1830 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20090140432.pdf [firstpage_image] =>[orig_patent_app_number] => 11947184 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4782695 [patent_doc_number] => 20080136024 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-12 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/947393 [patent_app_country] => US [patent_app_date] => 2007-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5364 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0136/20080136024.pdf [firstpage_image] =>[orig_patent_app_number] => 11947393 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4433604 [patent_doc_number] => 07969016 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-06-28 [patent_title] => 'Self-aligned wafer or chip structure, and self-aligned stacked structure' [patent_app_type] => utility [patent_app_number] => 11/946814 [patent_app_country] => US [patent_app_date] => 2007-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 4861 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/969/07969016.pdf [firstpage_image] =>[orig_patent_app_number] => 11946814 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4499701 [patent_doc_number] => 07948092 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-24 [patent_title] => 'Electronic component and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/943203 [patent_app_country] => US [patent_app_date] => 2007-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 20 [patent_no_of_words] => 5084 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/948/07948092.pdf [firstpage_image] =>[orig_patent_app_number] => 11943203 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4749237 [patent_doc_number] => 20080157308 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Multi-Die Semiconductor Package Structure and Method for Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 11/942174 [patent_app_country] => US [patent_app_date] => 2007-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4872 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157308.pdf [firstpage_image] =>[orig_patent_app_number] => 11942174 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 112295 [patent_doc_number] => 07713783 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-11 [patent_title] => 'Electronic component package, electronic component using the package, and method for manufacturing electronic component package' [patent_app_type] => utility [patent_app_number] => 11/942203 [patent_app_country] => US [patent_app_date] => 2007-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 4451 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/713/07713783.pdf [firstpage_image] =>[orig_patent_app_number] => 11942203 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4489253 [patent_doc_number] => 07884487 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-08 [patent_title] => 'Rotation joint and semiconductor device having the same' [patent_app_type] => utility [patent_app_number] => 11/942483 [patent_app_country] => US [patent_app_date] => 2007-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3275 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/884/07884487.pdf [firstpage_image] =>[orig_patent_app_number] => 11942483 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5407402 [patent_doc_number] => 20090121300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-14 [patent_title] => 'MICROELECTRONIC IMAGER PACKAGES AND ASSOCIATED METHODS OF PACKAGING' [patent_app_type] => utility [patent_app_number] => 11/940184 [patent_app_country] => US [patent_app_date] => 2007-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2513 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20090121300.pdf [firstpage_image] =>[orig_patent_app_number] => 11940184 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4896974 [patent_doc_number] => 20080116587 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-22 [patent_title] => 'CONDUCTOR POLYMER COMPOSITE CARRIER WITH ISOPROPERTY CONDUCTIVE COLUMNS' [patent_app_type] => utility [patent_app_number] => 11/938254 [patent_app_country] => US [patent_app_date] => 2007-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 1827 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0116/20080116587.pdf [firstpage_image] =>[orig_patent_app_number] => 11938254 [rel_patent_id] =>[rel_patent_doc_number] =>)