Xin Y. Zhong

Array ( [id] => 5026312 [patent_doc_number] => 20070267758 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-22 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/539130 [patent_app_country] => US [patent_app_date] => 2006-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2148 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0267/20070267758.pdf [firstpage_image] =>[orig_patent_app_number] => 11539130 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5150683 [patent_doc_number] => 20070050743 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Vertical Twist Scheme for High Density DRAMs' [patent_app_type] => utility [patent_app_number] => 11/537797 [patent_app_country] => US [patent_app_date] => 2006-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8597 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20070050743.pdf [firstpage_image] =>[orig_patent_app_number] => 11537797 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 830438 [patent_doc_number] => 07399992 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-15 [patent_title] => 'Device for defeating reverse engineering of integrated circuits by optical means' [patent_app_type] => utility [patent_app_number] => 11/541997 [patent_app_country] => US [patent_app_date] => 2006-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 17 [patent_no_of_words] => 6896 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/399/07399992.pdf [firstpage_image] =>[orig_patent_app_number] => 11541997 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5168965 [patent_doc_number] => 20070069396 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-29 [patent_title] => 'Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/525903 [patent_app_country] => US [patent_app_date] => 2006-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6611 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0069/20070069396.pdf [firstpage_image] =>[orig_patent_app_number] => 11525903 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5228233 [patent_doc_number] => 20070290340 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-20 [patent_title] => 'CHIP STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/468304 [patent_app_country] => US [patent_app_date] => 2006-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2195 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20070290340.pdf [firstpage_image] =>[orig_patent_app_number] => 11468304 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4443814 [patent_doc_number] => 07928590 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-19 [patent_title] => 'Integrated circuit package with a heat dissipation device' [patent_app_type] => utility [patent_app_number] => 11/464784 [patent_app_country] => US [patent_app_date] => 2006-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 8448 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/928/07928590.pdf [firstpage_image] =>[orig_patent_app_number] => 11464784 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4648823 [patent_doc_number] => 20080036078 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'WIREBOND-LESS SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/464333 [patent_app_country] => US [patent_app_date] => 2006-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 6197 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036078.pdf [firstpage_image] =>[orig_patent_app_number] => 11464333 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4648820 [patent_doc_number] => 20080036075 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'Lightweight, Hermetically Sealed Package Having Auxiliary, Selectively Contoured, Low Mass, Pseudo Wall Insert For Surface-Mounting And Dissipating Heat From Electronic Circuit Components' [patent_app_type] => utility [patent_app_number] => 11/463383 [patent_app_country] => US [patent_app_date] => 2006-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3834 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036075.pdf [firstpage_image] =>[orig_patent_app_number] => 11463383 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5104470 [patent_doc_number] => 20070063345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-22 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/500263 [patent_app_country] => US [patent_app_date] => 2006-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3240 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20070063345.pdf [firstpage_image] =>[orig_patent_app_number] => 11500263 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4685730 [patent_doc_number] => 20080029911 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-07 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM' [patent_app_type] => utility [patent_app_number] => 11/462303 [patent_app_country] => US [patent_app_date] => 2006-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4236 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20080029911.pdf [firstpage_image] =>[orig_patent_app_number] => 11462303 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 191314 [patent_doc_number] => 07642627 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-05 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/461634 [patent_app_country] => US [patent_app_date] => 2006-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3503 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/642/07642627.pdf [firstpage_image] =>[orig_patent_app_number] => 11461634 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4654953 [patent_doc_number] => 20080023813 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Multi-die apparatus including moveable portions' [patent_app_type] => utility [patent_app_number] => 11/495363 [patent_app_country] => US [patent_app_date] => 2006-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8730 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023813.pdf [firstpage_image] =>[orig_patent_app_number] => 11495363 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 33548 [patent_doc_number] => 07791081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Radiation-emitting semiconductor chip' [patent_app_type] => utility [patent_app_number] => 11/494984 [patent_app_country] => US [patent_app_date] => 2006-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 7170 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/791/07791081.pdf [firstpage_image] =>[orig_patent_app_number] => 11494984 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5605693 [patent_doc_number] => 20060267209 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-30 [patent_title] => 'High-frequency semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/493526 [patent_app_country] => US [patent_app_date] => 2006-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9209 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0267/20060267209.pdf [firstpage_image] =>[orig_patent_app_number] => 11493526 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5240569 [patent_doc_number] => 20070019060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-25 [patent_title] => 'Substrate sheet, manufacturing method of circuit substrate, and ink jet head' [patent_app_type] => utility [patent_app_number] => 11/490204 [patent_app_country] => US [patent_app_date] => 2006-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7113 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0019/20070019060.pdf [firstpage_image] =>[orig_patent_app_number] => 11490204 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4795352 [patent_doc_number] => 20080006938 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'Method for bonding wafers to produce stacked integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/484544 [patent_app_country] => US [patent_app_date] => 2006-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8635 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20080006938.pdf [firstpage_image] =>[orig_patent_app_number] => 11484544 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 419105 [patent_doc_number] => 07276780 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-02 [patent_title] => 'Semiconductor device and chip-stack semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/455722 [patent_app_country] => US [patent_app_date] => 2006-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 27 [patent_no_of_words] => 8340 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/276/07276780.pdf [firstpage_image] =>[orig_patent_app_number] => 11455722 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5093038 [patent_doc_number] => 20070114647 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-24 [patent_title] => 'Carrier board structure with semiconductor chip embedded therein' [patent_app_type] => utility [patent_app_number] => 11/471424 [patent_app_country] => US [patent_app_date] => 2006-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3229 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0114/20070114647.pdf [firstpage_image] =>[orig_patent_app_number] => 11471424 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5228218 [patent_doc_number] => 20070290325 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-20 [patent_title] => 'Surface mounting structure and packaging method thereof' [patent_app_type] => utility [patent_app_number] => 11/453803 [patent_app_country] => US [patent_app_date] => 2006-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1432 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20070290325.pdf [firstpage_image] =>[orig_patent_app_number] => 11453803 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5239828 [patent_doc_number] => 20070018319 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-25 [patent_title] => 'Ball grid array package and substrate within' [patent_app_type] => utility [patent_app_number] => 11/453804 [patent_app_country] => US [patent_app_date] => 2006-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2051 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0018/20070018319.pdf [firstpage_image] =>[orig_patent_app_number] => 11453804 [rel_patent_id] =>[rel_patent_doc_number] =>)