
Xin Y. Zhong
Examiner (ID: 3007, Phone: (571)272-3798 , Office: P/2856 )
| Most Active Art Unit | 2855 |
| Art Unit(s) | 2855, 2856, 2861 |
| Total Applications | 702 |
| Issued Applications | 494 |
| Pending Applications | 93 |
| Abandoned Applications | 145 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7141599
[patent_doc_number] => 20050117267
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-02
[patent_title] => 'IC package substrate with over voltage protection function'
[patent_app_type] => utility
[patent_app_number] => 11/025330
[patent_app_country] => US
[patent_app_date] => 2004-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1500
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0117/20050117267.pdf
[firstpage_image] =>[orig_patent_app_number] => 11025330
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/025330 | IC package substrate with over voltage protection function | Dec 28, 2004 | Abandoned |
Array
(
[id] => 303950
[patent_doc_number] => 07535090
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-19
[patent_title] => 'LSI package provided with interface module'
[patent_app_type] => utility
[patent_app_number] => 11/015013
[patent_app_country] => US
[patent_app_date] => 2004-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 19
[patent_no_of_words] => 18303
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 199
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/535/07535090.pdf
[firstpage_image] =>[orig_patent_app_number] => 11015013
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/015013 | LSI package provided with interface module | Dec 19, 2004 | Issued |
Array
(
[id] => 7096137
[patent_doc_number] => 20050128595
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-16
[patent_title] => 'Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens'
[patent_app_type] => utility
[patent_app_number] => 11/013101
[patent_app_country] => US
[patent_app_date] => 2004-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 13339
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0128/20050128595.pdf
[firstpage_image] =>[orig_patent_app_number] => 11013101
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/013101 | Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens | Dec 14, 2004 | Issued |
Array
(
[id] => 469805
[patent_doc_number] => 07233067
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-06-19
[patent_title] => 'Manufacturing a bump electrode with roughened face'
[patent_app_type] => utility
[patent_app_number] => 10/988553
[patent_app_country] => US
[patent_app_date] => 2004-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2944
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/233/07233067.pdf
[firstpage_image] =>[orig_patent_app_number] => 10988553
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/988553 | Manufacturing a bump electrode with roughened face | Nov 15, 2004 | Issued |
Array
(
[id] => 7232381
[patent_doc_number] => 20050139391
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-30
[patent_title] => 'Circuit board with trace configuration for high-speed digital differential signaling'
[patent_app_type] => utility
[patent_app_number] => 10/977192
[patent_app_country] => US
[patent_app_date] => 2004-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3389
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0139/20050139391.pdf
[firstpage_image] =>[orig_patent_app_number] => 10977192
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/977192 | Circuit board with trace configuration for high-speed digital differential signaling | Oct 28, 2004 | Issued |
Array
(
[id] => 7048478
[patent_doc_number] => 20050184365
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'High density lead arrangement package structure'
[patent_app_type] => utility
[patent_app_number] => 10/959203
[patent_app_country] => US
[patent_app_date] => 2004-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1928
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0184/20050184365.pdf
[firstpage_image] =>[orig_patent_app_number] => 10959203
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/959203 | High density lead arrangement package structure | Oct 6, 2004 | Abandoned |
Array
(
[id] => 616350
[patent_doc_number] => 07144761
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-12-05
[patent_title] => 'Semiconductor device and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/958282
[patent_app_country] => US
[patent_app_date] => 2004-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 43
[patent_no_of_words] => 6181
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/144/07144761.pdf
[firstpage_image] =>[orig_patent_app_number] => 10958282
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/958282 | Semiconductor device and method for fabricating the same | Oct 5, 2004 | Issued |
Array
(
[id] => 672936
[patent_doc_number] => 07091538
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-15
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/954183
[patent_app_country] => US
[patent_app_date] => 2004-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 3967
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/091/07091538.pdf
[firstpage_image] =>[orig_patent_app_number] => 10954183
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/954183 | Semiconductor device and method for manufacturing the same | Sep 30, 2004 | Issued |
Array
(
[id] => 687841
[patent_doc_number] => 07078800
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-18
[patent_title] => 'Semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 10/957176
[patent_app_country] => US
[patent_app_date] => 2004-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 3502
[patent_no_of_claims] => 7
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[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/078/07078800.pdf
[firstpage_image] =>[orig_patent_app_number] => 10957176
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/957176 | Semiconductor package | Sep 29, 2004 | Issued |
Array
(
[id] => 6918185
[patent_doc_number] => 20050095746
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-05
[patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument'
[patent_app_type] => utility
[patent_app_number] => 10/941871
[patent_app_country] => US
[patent_app_date] => 2004-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4715
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0095/20050095746.pdf
[firstpage_image] =>[orig_patent_app_number] => 10941871
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/941871 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument | Sep 15, 2004 | Issued |
Array
(
[id] => 578353
[patent_doc_number] => 07459721
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-12-02
[patent_title] => 'Field effect type organic transistor and process for production thereof'
[patent_app_type] => utility
[patent_app_number] => 10/555374
[patent_app_country] => US
[patent_app_date] => 2004-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 5413
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/459/07459721.pdf
[firstpage_image] =>[orig_patent_app_number] => 10555374
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/555374 | Field effect type organic transistor and process for production thereof | Sep 15, 2004 | Issued |
Array
(
[id] => 45176
[patent_doc_number] => 07777319
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-17
[patent_title] => 'Three dimensional integrated circuits'
[patent_app_type] => utility
[patent_app_number] => 10/937828
[patent_app_country] => US
[patent_app_date] => 2004-09-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/777/07777319.pdf
[firstpage_image] =>[orig_patent_app_number] => 10937828
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/937828 | Three dimensional integrated circuits | Sep 9, 2004 | Issued |
Array
(
[id] => 686550
[patent_doc_number] => 07078266
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-18
[patent_title] => 'Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts'
[patent_app_type] => utility
[patent_app_number] => 10/933144
[patent_app_country] => US
[patent_app_date] => 2004-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 6585
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/078/07078266.pdf
[firstpage_image] =>[orig_patent_app_number] => 10933144
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/933144 | Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts | Sep 1, 2004 | Issued |
Array
(
[id] => 662646
[patent_doc_number] => 07101749
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-05
[patent_title] => 'Non-volatile semiconductor memory device'
[patent_app_type] => utility
[patent_app_number] => 10/933035
[patent_app_country] => US
[patent_app_date] => 2004-09-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3612
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/101/07101749.pdf
[firstpage_image] =>[orig_patent_app_number] => 10933035
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/933035 | Non-volatile semiconductor memory device | Aug 31, 2004 | Issued |
Array
(
[id] => 285895
[patent_doc_number] => 07550824
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Low k interconnect dielectric using surface transformation'
[patent_app_type] => utility
[patent_app_number] => 10/931593
[patent_app_country] => US
[patent_app_date] => 2004-08-31
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/550/07550824.pdf
[firstpage_image] =>[orig_patent_app_number] => 10931593
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/931593 | Low k interconnect dielectric using surface transformation | Aug 30, 2004 | Issued |
Array
(
[id] => 7120382
[patent_doc_number] => 20050012211
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-20
[patent_title] => 'Under-bump metallugical structure'
[patent_app_type] => utility
[patent_app_number] => 10/921369
[patent_app_country] => US
[patent_app_date] => 2004-08-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20050012211.pdf
[firstpage_image] =>[orig_patent_app_number] => 10921369
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/921369 | Under-bump metallugical structure | Aug 17, 2004 | Abandoned |
Array
(
[id] => 7058953
[patent_doc_number] => 20050001312
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Chip package with grease heat sink'
[patent_app_type] => utility
[patent_app_number] => 10/898618
[patent_app_country] => US
[patent_app_date] => 2004-07-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0001/20050001312.pdf
[firstpage_image] =>[orig_patent_app_number] => 10898618
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/898618 | Chip package with grease heat sink | Jul 21, 2004 | Abandoned |
Array
(
[id] => 7059793
[patent_doc_number] => 20050002153
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Semiconductor integrated circuit device, mounting board, and device and board assembly'
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[pdf_file] => publications/A1/0002/20050002153.pdf
[firstpage_image] =>[orig_patent_app_number] => 10893967
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/893967 | Semiconductor integrated circuit device, mounting board, and device and board assembly | Jul 19, 2004 | Abandoned |
Array
(
[id] => 651300
[patent_doc_number] => 07112878
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-26
[patent_title] => 'Die stacking scheme'
[patent_app_type] => utility
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[patent_app_country] => US
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[pdf_file] => patents/07/112/07112878.pdf
[firstpage_image] =>[orig_patent_app_number] => 10891792
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/891792 | Die stacking scheme | Jul 14, 2004 | Issued |
Array
(
[id] => 7120374
[patent_doc_number] => 20050012203
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-20
[patent_title] => 'Enhanced die-down ball grid array and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 10/891519
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20050012203.pdf
[firstpage_image] =>[orig_patent_app_number] => 10891519
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/891519 | Enhanced die-down ball grid array and method for making the same | Jul 14, 2004 | Issued |