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Young Toi Tse
Examiner (ID: 8831, Phone: (571)272-3051 , Office: P/2634 )
Most Active Art Unit | 2632 |
Art Unit(s) | 2637, 2634, 2614, 2632, 2603, 2611, 2734 |
Total Applications | 2482 |
Issued Applications | 2014 |
Pending Applications | 233 |
Abandoned Applications | 235 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
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[id] => 18122176
[patent_doc_number] => 11553586
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[patent_kind] => B2
[patent_issue_date] => 2023-01-10
[patent_title] => Wiring substrate and electronic device
[patent_app_type] => utility
[patent_app_number] => 17/112465
[patent_app_country] => US
[patent_app_date] => 2020-12-04
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Array
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[patent_doc_number] => 20230361549
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[patent_kind] => A1
[patent_issue_date] => 2023-11-09
[patent_title] => Cable Joint for Superconducting Cables and Related Techniques
[patent_app_type] => utility
[patent_app_number] => 17/777488
[patent_app_country] => US
[patent_app_date] => 2020-12-02
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Array
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[patent_doc_number] => 20210092832
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[patent_kind] => A1
[patent_issue_date] => 2021-03-25
[patent_title] => CIRCUIT MEMBER JOINT STRUCTURE AND CIRCUIT MEMBER JOINING METHOD
[patent_app_type] => utility
[patent_app_number] => 17/109182
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[patent_app_date] => 2020-12-02
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Array
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[patent_issue_date] => 2021-03-18
[patent_title] => Printed Wiring Board
[patent_app_type] => utility
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[patent_app_country] => US
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Array
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Array
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[patent_title] => METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
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Array
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Array
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[id] => 16875468
[patent_doc_number] => 20210168935
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[patent_title] => VERTICAL INTERCONNECTION STRUCTURE OF A MULTI-LAYER SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 17/092312
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/092312 | Vertical interconnection structure of a multi-layer substrate | Nov 7, 2020 | Issued |
Array
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Array
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Array
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Array
(
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Array
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Array
(
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Array
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Array
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