Search

Yu-hsi David Sun

Examiner (ID: 2413, Phone: (571)270-5773 , Office: P/2895 )

Most Active Art Unit
2895
Art Unit(s)
4183, 2895, 2817
Total Applications
1172
Issued Applications
906
Pending Applications
81
Abandoned Applications
211

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19886830 [patent_doc_number] => 12272557 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-08 [patent_title] => Semiconductor device and method [patent_app_type] => utility [patent_app_number] => 18/363563 [patent_app_country] => US [patent_app_date] => 2023-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 37 [patent_no_of_words] => 12207 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363563 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363563
Semiconductor device and method Jul 31, 2023 Issued
Array ( [id] => 19634583 [patent_doc_number] => 20240413032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-12 [patent_title] => INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/362128 [patent_app_country] => US [patent_app_date] => 2023-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5396 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18362128 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/362128
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE Jul 30, 2023 Pending
Array ( [id] => 19842696 [patent_doc_number] => 12255096 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-18 [patent_title] => Semiconductor device with reduced contact resistance and methods of forming the same [patent_app_type] => utility [patent_app_number] => 18/361592 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 28 [patent_no_of_words] => 11190 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361592 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/361592
Semiconductor device with reduced contact resistance and methods of forming the same Jul 27, 2023 Issued
Array ( [id] => 19619314 [patent_doc_number] => 20240404994 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => THERMALLY CONDUCTIVE SPACER [patent_app_type] => utility [patent_app_number] => 18/359645 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6080 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359645 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359645
THERMALLY CONDUCTIVE SPACER Jul 25, 2023 Pending
Array ( [id] => 18774460 [patent_doc_number] => 20230369291 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH DIE STACK STRUCTURES [patent_app_type] => utility [patent_app_number] => 18/225369 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7584 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18225369 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/225369
Semiconductor assemblies with systems and methods for managing high die stack structures Jul 23, 2023 Issued
Array ( [id] => 18774511 [patent_doc_number] => 20230369342 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => Semiconductor Device [patent_app_type] => utility [patent_app_number] => 18/224224 [patent_app_country] => US [patent_app_date] => 2023-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 29408 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18224224 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/224224
Semiconductor device Jul 19, 2023 Issued
Array ( [id] => 19146394 [patent_doc_number] => 20240145424 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES [patent_app_type] => utility [patent_app_number] => 18/355111 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9598 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355111 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/355111
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES Jul 18, 2023 Pending
Array ( [id] => 18757621 [patent_doc_number] => 20230361084 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/353343 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4739 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353343 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/353343
Semiconductor package and manufacturing method thereof Jul 16, 2023 Issued
Array ( [id] => 19733819 [patent_doc_number] => 12211821 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Package-on-package assembly with wire bond vias [patent_app_type] => utility [patent_app_number] => 18/221171 [patent_app_country] => US [patent_app_date] => 2023-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 68 [patent_no_of_words] => 17454 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18221171 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/221171
Package-on-package assembly with wire bond vias Jul 11, 2023 Issued
Array ( [id] => 19484227 [patent_doc_number] => 20240332269 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-03 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATION METHOD AND MEMORY SYSTEM [patent_app_type] => utility [patent_app_number] => 18/220768 [patent_app_country] => US [patent_app_date] => 2023-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7854 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18220768 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/220768
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATION METHOD AND MEMORY SYSTEM Jul 10, 2023 Pending
Array ( [id] => 18898619 [patent_doc_number] => 20240014104 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor [patent_app_type] => utility [patent_app_number] => 18/217044 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7138 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217044 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/217044
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor Jun 29, 2023 Pending
Array ( [id] => 18712895 [patent_doc_number] => 20230335528 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => BONDING WIRE FOR SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/211069 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18211069 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/211069
BONDING WIRE FOR SEMICONDUCTOR DEVICES Jun 15, 2023 Abandoned
Array ( [id] => 19720395 [patent_doc_number] => 12205940 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-21 [patent_title] => Semiconductor package structure and packaging method thereof [patent_app_type] => utility [patent_app_number] => 18/210516 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9200 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210516 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/210516
Semiconductor package structure and packaging method thereof Jun 14, 2023 Issued
Array ( [id] => 18698571 [patent_doc_number] => 20230329053 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => FLEXIBLE DISPLAY [patent_app_type] => utility [patent_app_number] => 18/209556 [patent_app_country] => US [patent_app_date] => 2023-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18209556 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/209556
Flexible display Jun 13, 2023 Issued
Array ( [id] => 18975303 [patent_doc_number] => 20240055395 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES [patent_app_type] => utility [patent_app_number] => 18/206201 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7364 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18206201 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/206201
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES Jun 5, 2023 Pending
Array ( [id] => 20113220 [patent_doc_number] => 12363975 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-15 [patent_title] => Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells [patent_app_type] => utility [patent_app_number] => 18/200153 [patent_app_country] => US [patent_app_date] => 2023-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 2125 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18200153 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/200153
Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells May 21, 2023 Issued
Array ( [id] => 19589903 [patent_doc_number] => 20240387460 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/320553 [patent_app_country] => US [patent_app_date] => 2023-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18320553 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/320553
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE May 18, 2023 Pending
Array ( [id] => 18848901 [patent_doc_number] => 20230411305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/315479 [patent_app_country] => US [patent_app_date] => 2023-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4434 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18315479 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/315479
METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE May 9, 2023 Pending
Array ( [id] => 18774531 [patent_doc_number] => 20230369362 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => CHIP PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/312552 [patent_app_country] => US [patent_app_date] => 2023-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4679 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18312552 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/312552
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF May 3, 2023 Pending
Array ( [id] => 20148457 [patent_doc_number] => 12382819 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-05 [patent_title] => Organic light emitting diode display device [patent_app_type] => utility [patent_app_number] => 18/301345 [patent_app_country] => US [patent_app_date] => 2023-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 0 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18301345 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/301345
Organic light emitting diode display device Apr 16, 2023 Issued
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