Search

Yu-hsi David Sun

Examiner (ID: 2413, Phone: (571)270-5773 , Office: P/2895 )

Most Active Art Unit
2895
Art Unit(s)
4183, 2895, 2817
Total Applications
1172
Issued Applications
906
Pending Applications
81
Abandoned Applications
211

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17901207 [patent_doc_number] => 20220310869 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-29 [patent_title] => OPTOELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/838929 [patent_app_country] => US [patent_app_date] => 2022-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4716 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17838929 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/838929
Optoelectronic device Jun 12, 2022 Issued
Array ( [id] => 17917573 [patent_doc_number] => 20220319969 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/838200 [patent_app_country] => US [patent_app_date] => 2022-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8376 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17838200 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/838200
Semiconductor devices and methods of manufacturing semiconductor devices Jun 10, 2022 Issued
Array ( [id] => 18456307 [patent_doc_number] => 20230197589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/806264 [patent_app_country] => US [patent_app_date] => 2022-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6342 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17806264 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/806264
Semiconductor structure and manufacturing method thereof Jun 8, 2022 Issued
Array ( [id] => 18253513 [patent_doc_number] => 20230080552 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => Organic Light-Emitting Diode Displays with Capillary-Flow-Inducing Structures [patent_app_type] => utility [patent_app_number] => 17/826416 [patent_app_country] => US [patent_app_date] => 2022-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7881 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17826416 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/826416
Organic light-emitting diode displays with capillary-flow-inducing structures May 26, 2022 Issued
Array ( [id] => 19796331 [patent_doc_number] => 12237301 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-25 [patent_title] => Through stack bridge bonding devices and associated methods [patent_app_type] => utility [patent_app_number] => 17/750225 [patent_app_country] => US [patent_app_date] => 2022-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 12086 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17750225 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/750225
Through stack bridge bonding devices and associated methods May 19, 2022 Issued
Array ( [id] => 19138103 [patent_doc_number] => 11973079 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Integration of multiple fin structures on a single substrate [patent_app_type] => utility [patent_app_number] => 17/748648 [patent_app_country] => US [patent_app_date] => 2022-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 62 [patent_no_of_words] => 17762 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17748648 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/748648
Integration of multiple fin structures on a single substrate May 18, 2022 Issued
Array ( [id] => 17833709 [patent_doc_number] => 20220271013 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 17/741799 [patent_app_country] => US [patent_app_date] => 2022-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5175 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17741799 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/741799
Stacked semiconductor dies for semiconductor device assemblies May 10, 2022 Issued
Array ( [id] => 17780292 [patent_doc_number] => 20220246642 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/726637 [patent_app_country] => US [patent_app_date] => 2022-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12514 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17726637 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/726637
Three dimensional semiconductor memory device and method for fabricating the same Apr 21, 2022 Issued
Array ( [id] => 20080935 [patent_doc_number] => 12355013 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => Emission height arrangements in light-emitting diode packages and related devices and methods [patent_app_type] => utility [patent_app_number] => 17/726072 [patent_app_country] => US [patent_app_date] => 2022-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 6203 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17726072 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/726072
Emission height arrangements in light-emitting diode packages and related devices and methods Apr 20, 2022 Issued
Array ( [id] => 18712856 [patent_doc_number] => 20230335489 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => INTEGRATED CIRCUITS (ICS) EMPLOYING MULTI-PATTERN METALLIZATION TO OPTIMIZE METAL INTERCONNECT SPACING FOR IMPROVED PERFORMANCE AND RELATED FABRICATION METHODS [patent_app_type] => utility [patent_app_number] => 17/659214 [patent_app_country] => US [patent_app_date] => 2022-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11038 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17659214 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/659214
Integrated circuits (ICs) employing multi-pattern metallization to optimize metal interconnect spacing for improved performance and related fabrication methods Apr 13, 2022 Issued
Array ( [id] => 17764811 [patent_doc_number] => 20220238424 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-28 [patent_title] => SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER [patent_app_type] => utility [patent_app_number] => 17/719246 [patent_app_country] => US [patent_app_date] => 2022-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8158 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17719246 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/719246
Semiconductor package with isolated heat spreader Apr 11, 2022 Issued
Array ( [id] => 18252647 [patent_doc_number] => 20230079686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/717619 [patent_app_country] => US [patent_app_date] => 2022-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6667 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17717619 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/717619
Semiconductor package and method for fabricating the same Apr 10, 2022 Issued
Array ( [id] => 18951038 [patent_doc_number] => 11894344 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-06 [patent_title] => Power enhanced stacked chip scale package solution with integrated die attach film [patent_app_type] => utility [patent_app_number] => 17/714979 [patent_app_country] => US [patent_app_date] => 2022-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 8875 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17714979 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/714979
Power enhanced stacked chip scale package solution with integrated die attach film Apr 5, 2022 Issued
Array ( [id] => 20119589 [patent_doc_number] => 12369327 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-22 [patent_title] => MFM device with an enhanced bottom electrode [patent_app_type] => utility [patent_app_number] => 17/705653 [patent_app_country] => US [patent_app_date] => 2022-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 24 [patent_no_of_words] => 6338 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17705653 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/705653
MFM device with an enhanced bottom electrode Mar 27, 2022 Issued
Array ( [id] => 18488486 [patent_doc_number] => 20230215834 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => BONDING WIRE FOR SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/924649 [patent_app_country] => US [patent_app_date] => 2022-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16751 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17924649 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/924649
Bonding wire for semiconductor devices Mar 22, 2022 Issued
Array ( [id] => 18540884 [patent_doc_number] => 20230245995 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => BONDING WIRE FOR SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/924657 [patent_app_country] => US [patent_app_date] => 2022-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18170 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 246 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17924657 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/924657
Bonding wire for semiconductor devices Mar 15, 2022 Issued
Array ( [id] => 19733770 [patent_doc_number] => 12211772 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Method of manufacturing semiconductor devices and corresponding semiconductor device [patent_app_type] => utility [patent_app_number] => 17/688013 [patent_app_country] => US [patent_app_date] => 2022-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 31 [patent_no_of_words] => 3868 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17688013 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/688013
Method of manufacturing semiconductor devices and corresponding semiconductor device Mar 6, 2022 Issued
Array ( [id] => 17676915 [patent_doc_number] => 20220190082 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-16 [patent_title] => DISPLAY APPARATUS AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/687183 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12568 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687183 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687183
DISPLAY APPARATUS AND ELECTRONIC DEVICE Mar 3, 2022 Abandoned
Array ( [id] => 17676737 [patent_doc_number] => 20220189904 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-16 [patent_title] => POWER SEMICONDUCTOR APPARATUS AND FABRICATION METHOD FOR THE SAME [patent_app_type] => utility [patent_app_number] => 17/685057 [patent_app_country] => US [patent_app_date] => 2022-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 35853 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17685057 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/685057
Power semiconductor apparatus and fabrication method for the same Mar 1, 2022 Issued
Array ( [id] => 18601820 [patent_doc_number] => 20230276625 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH-STOP STRUCTURES AND SELF-ALIGNED INSULATING SPACERS AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 17/682550 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 25010 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17682550 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/682550
Three-dimensional memory device containing etch-stop structures and self-aligned insulating spacers and method of making the same Feb 27, 2022 Issued
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