Case number IPR2018-00828
Avant Technology, Inc. v. ANZA TECHNOLOGY, INC. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Dec 13, 2018 | 9 | Notice of Refund Download | |
| Nov 8, 2018 | 8 | Petitioner's Request for Refund of Post-Institution Fees Download | |
| Oct 15, 2018 | 7 | Trial Instituted Document Download | |
| Jul 18, 2018 | 6 | Patent Owners Preliminary Response Download | |
| Apr 18, 2018 | 5 | Notice of Accord Filing Date Download | |
| Apr 16, 2018 | 3 | IPR2018-00828 Mandatory Notice Download | |
| Apr 16, 2018 | 4 | IPR2018-00828 Power of Attorney Download | |
| Mar 26, 2018 | 1004 | Curriculum Vitae of Anthony Coyle Download | |
| Mar 26, 2018 | 1005 | WO 1998/49121 (Shunji) Download | |
| Mar 26, 2018 | 1001 | U.S. Patent No. 7,124,927 (Reiber) Download | |
| Mar 26, 2018 | 1003 | Declaration of Anthony Coyle Download | |
| Mar 26, 2018 | 1018 | U.S. Patent No. 5,853,517 (Petefish) Download | |
| Mar 26, 2018 | 1026 | Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 18th IEEE/CMPT, - Solving Static Related Problems in Packaging, Marking and Test,- Wayne Tan & Arnold Steinman (December 4, 1995) Download | |
| Mar 26, 2018 | 1006 | U.S. Patent No. 6,274,524 (Shinji ) Download | |
| Mar 26, 2018 | 1016 | WO 1997/020654 (Azdasht) Download | |
| Mar 26, 2018 | 1019 | U.S. Patent No. 5,522,133 (Kawauchi) Download | |
| Mar 26, 2018 | 1013 | Solder Ball Bumping (SBB) - A Flexible Equipment for FC, CSP, BGA and Printed Circuit Boards - ITAP-1997 San Jose, CA (Kasulke) Download | |
| Mar 26, 2018 | 1025 | JEDEC JESD42: Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices (March 1994) Download | |
| Mar 26, 2018 | 1 | Petition for Inter Partes Review of U.S. Patent No, 7,124,927 Download | |
| Mar 26, 2018 | 1002 | Prosecution History of USP 7,124,927 Download | |
| Mar 26, 2018 | 1008 | U.S. Patent No. 6,270,989 (Yamamoto ) Download | |
| Mar 26, 2018 | 1022 | Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP - IMAPS - Boston (Oppert) Download | |
| Mar 26, 2018 | 1010 | Solder Ball Bumper SB2 - A Flexible manufacturing tool for 3-dimensional sensor and microsystem packages- IEMT-Europe 1998 (Kasulke) Download | |
| Mar 26, 2018 | 1011 | A Roadmap to Low Cost Bumping for DCA, COF, CSP and BGA IEMT-Europe 1998 (Zakel) Download | |
| Mar 26, 2018 | 1023 | MPEP 201.08 Continuation-In-Part Application Download | |
| Mar 26, 2018 | 1020 | U.S. Patent No. 6,354,479 (Reiber) Download | |
| Mar 26, 2018 | 1021 | Merriam -Webster Dictionary (1997) Definitions Download | |
| Mar 26, 2018 | 1009 | U.S. Patent No. 5,839,645 (Onitsuka) Download | |
| Mar 26, 2018 | 1014 | WO 1995/000279 (Azdasht) Download | |
| Mar 26, 2018 | 1027 | Semiconductor Technology Handbook (1985) Download | |
| Mar 26, 2018 | 1012 | A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au - IEMP/IMC-1998 Japan (Oppert) Download | |
| Mar 26, 2018 | 1028 | Action Closing Prosecution - Re-Examination of U.S. Patent No. 6,354,479 (September 24, 2013) Download | |
| Mar 26, 2018 | 1015 | U.S. Patent No. 5, 653,381 (Azdasht) Download | |
| Mar 26, 2018 | 1024 | JEDEC JEP108-B: Distributor Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices (April 1991) Download | |
| Mar 26, 2018 | 1007 | WO 1997/45867 (Yamamoto) Download | |
| Mar 26, 2018 | 2 | Power of Attorney - Avant Technology, Inc. Download | |
| Mar 26, 2018 | 1017 | U.S. Patent No. 5, 977,512 (Azdasht) Download |
