Date Field | Doc. No. | Party | Description |
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Mar 26, 2018 | 1028 | | Action Closing Prosecution - Re-Examination of U.S. Patent No. 6,354,479 (September 24, 2013) Download |
Mar 26, 2018 | 1027 | | Semiconductor Technology Handbook (1985) Download |
Mar 26, 2018 | 1026 | | Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 18th IEEE/CMPT, - Solving Static Related Problems in Packaging, Marking and Test,- Wayne Tan & Arnold Steinman (December 4, 1995) Download |
Mar 26, 2018 | 1025 | | JEDEC JESD42: Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices (March 1994) Download |
Mar 26, 2018 | 1024 | | JEDEC JEP108-B: Distributor Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices (April 1991) Download |
Mar 26, 2018 | 1023 | | MPEP 201.08 Continuation-In-Part Application Download |
Mar 26, 2018 | 1022 | | Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP - IMAPS - Boston (Oppert) Download |
Mar 26, 2018 | 1021 | | Merriam -Webster Dictionary (1997) Definitions Download |
Mar 26, 2018 | 1020 | | U.S. Patent No. 6,354,479 (Reiber) Download |
Mar 26, 2018 | 1019 | | U.S. Patent No. 5,522,133 (Kawauchi) Download |
Mar 26, 2018 | 1018 | | U.S. Patent No. 5,853,517 (Petefish) Download |
Mar 26, 2018 | 1017 | | U.S. Patent No. 5, 977,512 (Azdasht) Download |
Mar 26, 2018 | 1016 | | WO 1997/020654 (Azdasht) Download |
Mar 26, 2018 | 1015 | | U.S. Patent No. 5, 653,381 (Azdasht) Download |
Mar 26, 2018 | 1014 | | WO 1995/000279 (Azdasht) Download |
Mar 26, 2018 | 1013 | | Solder Ball Bumping (SBB) - A Flexible Equipment for FC, CSP, BGA and Printed Circuit Boards - ITAP-1997 San Jose, CA (Kasulke) Download |
Mar 26, 2018 | 1012 | | A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au - IEMP/IMC-1998 Japan (Oppert) Download |
Mar 26, 2018 | 1011 | | A Roadmap to Low Cost Bumping for DCA, COF, CSP and BGA IEMT-Europe 1998 (Zakel) Download |
Mar 26, 2018 | 1010 | | Solder Ball Bumper SB2 - A Flexible manufacturing tool for 3-dimensional sensor and microsystem packages- IEMT-Europe 1998 (Kasulke) Download |
Mar 26, 2018 | 1009 | | U.S. Patent No. 5,839,645 (Onitsuka) Download |
Mar 26, 2018 | 1008 | | U.S. Patent No. 6,270,989 (Yamamoto ) Download |
Mar 26, 2018 | 1007 | | WO 1997/45867 (Yamamoto) Download |
Mar 26, 2018 | 1006 | | U.S. Patent No. 6,274,524 (Shinji ) Download |
Mar 26, 2018 | 1005 | | WO 1998/49121 (Shunji) Download |
Mar 26, 2018 | 1004 | | Curriculum Vitae of Anthony Coyle Download |
Mar 26, 2018 | 1003 | | Declaration of Anthony Coyle Download |
Mar 26, 2018 | 1002 | | Prosecution History of USP 7,124,927 Download |
Mar 26, 2018 | 1001 | | U.S. Patent No. 7,124,927 (Reiber) Download |
Dec 13, 2018 | 9 | | Notice of Refund Download |
Nov 8, 2018 | 8 | | Petitioner's Request for Refund of Post-Institution Fees Download |
Oct 15, 2018 | 7 | | Trial Instituted Document Download |
Jul 18, 2018 | 6 | | Patent Owners Preliminary Response Download |
Apr 18, 2018 | 5 | | Notice of Accord Filing Date Download |
Apr 16, 2018 | 4 | | IPR2018-00828 Power of Attorney Download |
Apr 16, 2018 | 3 | | IPR2018-00828 Mandatory Notice Download |
Mar 26, 2018 | 2 | | Power of Attorney - Avant Technology, Inc. Download |
Mar 26, 2018 | 1 | | Petition for Inter Partes Review of U.S. Patent No, 7,124,927 Download |