Bell Semiconductor, LLC v. Micron Technology Inc. et al > Summary
Court Case Number 1:22-cv-01292
Filing Date Sep 30, 2022
Termination Date Jan 31, 2023
Court Delaware District Court
Status Dismissed - Voluntarily
JudgesColm F. Connolly
Plaintiff
Defendant
6Plaintiff Attorneys
Bell Semiconductor, LLC
Attorney Name: Timothy Devlin
Devlin Law Firm
Defendant Attorneys
19Advanced Micro Devices, Inc
Attorney Name: Frederick L. Cottrell III
Richards, Layton & Finger, P.A.
Advanced Micro Devices, Inc
Attorney Name: Christine Dealy Haynes
Richards, Layton & Finger, P.A.
CDW LLC
Attorney Name: Andrew C. Mayo
Ashby & Geddes
NVidia
Attorney Name: Brian A. Biggs
DLA Piper
CDW LLC
Attorney Name: Benjamin T. Horton
Marshall Gerstein & Borun
Micron Technology, Inc.
Attorney Name: Samantha G. Wilson
Young Conaway Stargatt & Taylor
Micron Technology, Inc.
Attorney Name: Jared Bobrow
Orrick Herrington & Sutcliffe
Micron Technology, Inc.
Attorney Name: Jeremy J. Lang
Orrick Herrington & Sutcliffe
Micron Technology, Inc.
Attorney Name: Jason K. Yu
Orrick Herrington & Sutcliffe
Micron Technology, Inc.
Attorney Name: Patrick Herman
Orrick Herrington & Sutcliffe
Micron Technology, Inc.
Attorney Name: Tyler S. Miller
Orrick Herrington & Sutcliffe
Hewlett Packard Enterprise
Attorney Name: John W. Shaw
Shaw Keller LLP
Advanced Micro Devices, Inc
Attorney Name: Christopher S. Ponder
Sheppard Mullin
Advanced Micro Devices, Inc
Attorney Name: Eric K. Gill
Sheppard Mullin
Advanced Micro Devices, Inc
Attorney Name: Ericka J. Schulz
Sheppard Mullin
Advanced Micro Devices, Inc
Attorney Name: Harper S. Batts
Sheppard Mullin
Advanced Micro Devices, Inc
Attorney Name: Jeffrey Liang
Sheppard Mullin
Advanced Micro Devices, Inc
Attorney Name: Lai Yip
Sheppard Mullin
Cause
35:1 Patent Infringement
Related Patents
| Doc No | Title | Issue date |
|---|---|---|
| 08319343 | Routing under bond pad for the replacement of an interconnect layer | Nov 27, 2012 |
| 08288269 | Methods for avoiding parasitic capacitance in an integrated circuit package | Oct 16, 2012 |
| 08049340 | Device for avoiding parasitic capacitance in an integrated circuit package | Nov 1, 2011 |
| 07646091 | Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation | Jan 12, 2010 |
| 07345245 | Robust high density substrate design for thermal cycling reliability | Mar 18, 2008 |
| 07064091 | Incorporation of a self-crosslinking polymer into a nonwoven binder for use in improving the wet strength of pre-moistened wipes | Jun 20, 2006 |
| 06818953 | Protection of an integrated circuit against electrostatic discharges and other overvoltages | Nov 16, 2004 |
