Bell Semiconductor, LLC v. Qualcomm Inc. et al > Summary
Court Case Number 8:22-cv-01519
Filing Date Aug 12, 2022
Termination Date Jan 9, 2023
Court California Central District Court
Status Dismissed - Settled
JudgesJohn W. Holcomb
Plaintiff
Defendant
7Plaintiff Attorneys
3Bell Semiconductor, LLC
Attorney Name: Alex H. Chan
Devlin Law Firm
Bell Semiconductor, LLC
Attorney Name: Jason G. Sheasby
Irell & Manella LLP
Bell Semiconductor, LLC
Attorney Name: Christopher R. Clayton
Devlin Law Firm
Defendant Attorneys
14Qualcomm Technologies, Inc.
Attorney Name: Andrea Weiss Jeffries
Jones Day
Qualcomm Technologies, Inc.
Attorney Name: Kristina N. Hendricks
Jones Day
Qualcomm Technologies, Inc.
Attorney Name: William E. Devitt
Jones Day
Netgear
Attorney Name: Alice E. Snedeker
Duane Morris LLP
Netgear
Attorney Name: Cyndie M. Chang
Duane Morris LLP
TP-Link USA Corporation
Attorney Name: David Howard Kwasniewski
BraunHagey & Borden LLP
Netgear
Attorney Name: Matthew S. Yungwirth
Duane Morris LLP
CommScope
Attorney Name: Derek Vandenburgh
Carlson Caspers Vandenburgh & Lindquist, PA.
TP-Link USA Corporation
Attorney Name: Kristopher L. Reed
Kilpatrick Townsend & Stockton
TP-Link USA Corporation
Attorney Name: Taylor J. Pfingst
Kilpatrick Townsend & Stockton
TP-Link USA Corporation
Attorney Name: Rishi Gupta
Kilpatrick Townsend & Stockton
CommScope
Attorney Name: Carole E. Reagan
Umberg/Zipser
CommScope
Attorney Name: Mark A. Finkelstein
Umberg/Zipser
CommScope
Attorney Name: Nathan D. Louwagie
Carlson Caspers Vandenburgh & Lindquist, PA.
Related Patents
| Doc No | Title | Issue date |
|---|---|---|
| 08288269 | Methods for avoiding parasitic capacitance in an integrated circuit package | Oct 16, 2012 |
| 08049340 | Device for avoiding parasitic capacitance in an integrated circuit package | Nov 1, 2011 |
| 07345245 | Robust high density substrate design for thermal cycling reliability | Mar 18, 2008 |
