Case number IPR2017-01470
Broadcom Corporation v. Tessera, Inc. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Jan 2, 2018 | 15 | Settlement After Institution of Trial Download | |
| Dec 21, 2017 | 14 | Patent Owner's Updated Exhibit List Download | |
| Dec 21, 2017 | 12 | Joint Motion to Terminate Download | |
| Dec 21, 2017 | 13 | Joint Request to File Business Confidential Information Download | |
| Dec 4, 2017 | 10 | Trial Instituted Document Download | |
| Dec 4, 2017 | 11 | Scheduling Order Download | |
| Nov 29, 2017 | 2004 | Ex 2004 - 007 Disclaimer Download | |
| Nov 29, 2017 | 9 | Patent Owner's Updated Exhibit List Download | |
| Nov 29, 2017 | 2005 | Ex 2005 - PTAB email, dated November 17, 2017 Download | |
| Nov 29, 2017 | 8 | Patent Owner's Notice of Statutory Disclaimer Download | |
| Sep 7, 2017 | 2003 | Ex 2003 - US 5285352 Download | |
| Sep 7, 2017 | 2001 | Ex 2001 - Inv. No. 337-TA-1010 Initial Determination (Public Version) Download | |
| Sep 7, 2017 | 2002 | Ex 2002 - US 5869887 Download | |
| Sep 7, 2017 | 7 | Patent Owner Preliminary Response Download | |
| Jul 18, 2017 | 6 | Patent Owner's Updated Mandatory Notice Download | |
| Jun 9, 2017 | 4 | Patent Owner's Mandatory Notices Download | |
| Jun 9, 2017 | 5 | Power of Attorney from Patent Owner Tessera, Inc. Download | |
| Jun 7, 2017 | 3 | Notice of Accord Filing Date Download | |
| May 24, 2017 | 1006 | Information Disclosure Statement, July 26, 2004, File History of Application 10/210,160 Download | |
| May 24, 2017 | 1019 | Syed et al., ¿¿¿LGA vs. BGA: What is more reliable? A 2nd Level Reliability Comparison,¿¿¿ Surface Mount Technology Association (SMTA) International Conference Proceedings, September 24, 2000 Download | |
| May 24, 2017 | 1020 | Order No. 63: Markman Order (Public), In the Matter of Certain Semiconductor Devices, Semiconductor Device Packages, And Products Containing Same, Inv. No. 337-TA-1010 (Feb. 6, 2017) Download | |
| May 24, 2017 | 1010 | Gunnar Gustafsson, ¿¿¿Solder Joint Reliability of a Lead-Less RF-transistor¿¿¿ (June, 1998) Download | |
| May 24, 2017 | 1004 | Response to Non-final Office Action, Aug. 12, 2004, File History of Application 10/210,160 Download | |
| May 24, 2017 | 1008 | Excerpts from Ken Gilleo, ¿¿¿Area Array Packaging Handbook,¿¿¿ 2001 Download | |
| May 24, 2017 | 1 | PETITION FOR INTER PARTES REVIEW UNDER 35 U.S.C. Sections 311-319 AND 37 C.F.R. Sections 42.100 et seq. Download | |
| May 24, 2017 | 1007 | U.S. Patent No. 6,521,987 (Glenn et al.) Download | |
| May 24, 2017 | 1012 | Peter Hall et al., ¿¿¿Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring Boards,¿¿¿ IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, No. 4 (Dec. 1983) Download | |
| May 24, 2017 | 1001 | U.S. Patent No. 6,856,007 Download | |
| May 24, 2017 | 1003 | Non-final Office Action, May 11, 2004, File History of Application 10/210,160 Download | |
| May 24, 2017 | 1018 | U.S. Patent No. 6,420,779 (Sharma) Download | |
| May 24, 2017 | 1002 | Declaration of Jeffrey C. Suhling Download | |
| May 24, 2017 | 1011 | Xiangcheng Luo et al., ¿¿¿Effect of the Thickness of a Thermal Interface Material (Solder) on Heat Transfer Between Copper Surfaces,¿¿¿ 24(2) Int¿¿¿l J. of Microcircuits and Electronic Packaging 141-147 (2nd Q 2001) Download | |
| May 24, 2017 | 1009 | Jean-Paul Clech, ¿¿¿Solder Reliability Solutions: A PC-Based Design-for-Reliability,¿¿¿ ESPI (Sept. 1996) Download | |
| May 24, 2017 | 1005 | Notice of Allowance, Oct. 7, 2004, File History of Application 10/210,160 Download | |
| May 24, 2017 | 1013 | Amkor MicroLeadframe Package Product Development Announcement (February 1999) Download | |
| May 24, 2017 | 1017 | Information Disclosure Statement, Aug. 20, 2001, Application 09/606,428 Download | |
| May 24, 2017 | 2 | Petitioner's Power of Attorney Download | |
| May 24, 2017 | 1015 | Application Notes for Surface Mount Assembly of Amkor¿¿¿s MicroLeadFrame (MLF) Packages, Amkor Technology (March, 2001) Download | |
| May 24, 2017 | 1016 | Amkor Technology: Products: Application Notes & White Papers webpage from April 2001 Download | |
| May 24, 2017 | 1014 | Amkor MicroLeadframe Data Sheet (June 2000) Download |
