INVENSAS BONDING TECHNOLOGIES, INC. v. SAMSUNG ELECTRONICS AMERICA, INC. et al > Summary
Court Case Number 1:17-cv-07609
Filing Date Sep 28, 2017
Termination Date Dec 17, 2018
Court New Jersey District Court
Status Dismissed - Settled
Plaintiff
Defendant
Plaintiff Attorneys
12Invensas Bonding Technologies Inc.
Attorney Name: Arnold B. Calmann
Saiber
Invensas Bonding Technologies Inc.
Attorney Name: Matthew J. Moore
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Maximilian A. Grant
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Bert C. Reiser
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Charles H. Sanders
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Clement J. Naples
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Dale Chang
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Kyle S. Smith
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Thomas W. Yeh
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: Michael A. David
Latham & Watkins
Invensas Bonding Technologies Inc.
Attorney Name: John M. Dallesasse
Invensas Bonding Technologies Inc.
Invensas Bonding Technologies Inc.
Attorney Name: Ethan Y. Park
Latham & Watkins
Defendant Attorneys
5Samsung Electronics
Attorney Name: William C. Baton
Saul Ewing LLP
Samsung Electronics
Attorney Name: Charles M. Lizza
Saul Ewing LLP
Samsung Electronics
Attorney Name: Daniel S. Trainor
Fish & Richardson
Samsung Electronics
Attorney Name: C. Bradley Hunt
Hunton Andrews Kurth
Samsung Electronics
Attorney Name: Marc J. Pensabene
O'Melveny & Myers LLP
Cause
15:1126 Patent Infringement
Related Patents
| Doc No | Title | Issue date |
|---|---|---|
| 09431368 | Three dimensional device integration method and integrated device | Aug 30, 2016 |
| 09391143 | Method for low temperature bonding and bonded structure | Jul 12, 2016 |
| 08153505 | Method for low temperature bonding and bonded structure | Apr 10, 2012 |
| 07871898 | Method for low temperature bonding and bonded structure | Jan 18, 2011 |
| 07807549 | Method for low temperature bonding and bonded structure | Oct 5, 2010 |
| 07553744 | Method for low temperature bonding and bonded structure | Jun 30, 2009 |
