Case number 6:21-cv-00374
Katana Silicon Technologies LLC v. Western Digital Technologies, Inc. > Documents
| Date Field | Doc. No. | Description (Pages) |
|---|---|---|
| Feb 10, 2022 | 34 | Report on Patent/Trademark sent to U.S. Patent and Trademark Office. (bot1) (Entered: 02/10/2022) (1) |
| Feb 9, 2022 | 33 | STIPULATION of Dismissal with prejudice by Katana Silicon Technologies LLC. (Cox, Nathan) (Entered: 02/09/2022) (2) |
| Jan 10, 2022 | 32 | ORDER GRANTING 31 Motion to Stay Case. It is therefore ORDERED that all proceedings and deadlines in this case between the Parties shall be stayed for thirty (30) days, at which time the parties shall jointly submit a newproposed schedule. Signed by Judge Alan D Albright. (zv) (Entered: 01/10/2022) (1) |
| Jan 7, 2022 | 31 | Joint MOTION to Stay Case and Notice of Settlement by Western Digital Technologies, Inc.. (Attachments: # 1 Proposed Order)(Jones, Michael) (Entered: 01/07/2022) (Main Document) (2) |
| Jan 7, 2022 | 31 | Joint MOTION to Stay Case and Notice of Settlement by Western Digital Technologies, Inc.. (Attachments: # 1 Proposed Order)(Jones, Michael) (Entered: 01/07/2022) (Proposed Order) (1) |
| Jan 3, 2022 | 30 | NOTICE of Attorney Appearance by Theresa M. Dawson on behalf of Katana Silicon Technologies LLC (Dawson, Theresa) (Entered: 01/03/2022) (2) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Exhibit E) (18) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Exhibit D) (30) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Exhibit A) (4) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Exhibit B) (30) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Exhibit C) (11) |
| Dec 30, 2021 | 29 | ATTACHMENT Declaration of Theresa M. Dawson to 28 Response, by Katana Silicon Technologies LLC. (Breedlove, Scott) (Entered: 12/30/2021) (2) |
| Dec 30, 2021 | 28 | RESPONSE Katana's Responsive Claim Construction Brief to 27 Claim Construction Brief,,, by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit A, # 2 Exhibit B, # 3 Exhibit C, # 4 Exhibit D, # 5 Exhibit E)(Breedlove, Scott) (Entered: 12/30/2021) (Main Document) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 10 - WD_K_0002559_707 Patent) (15) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging) (5) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 8 - WD_K_0002515_McGraw-Hill) (4) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 7 - WD_K_0002550_111 Patent) (10) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 6 - WD_K_0002518_784 Patent) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation) (19) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version) (18) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 1 - US6181002) (12) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Main Document) (29) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 11 - WD_K_0002323_J-STD-012) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 12 - Chip Scale Package Implementation Challenges - 1999) (11) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 3 - USRE38806) (26) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 13 - TI MicroStar BGA Application Report - 1998) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 14 - WD_K_0002573_MicroElec HDBK) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Declaration of Dr. Leland Spangler) (30) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Exhibit 2 - US6352879) (25) |
| Dec 9, 2021 | 27 | Opening Claim Construction Brief by Western Digital Technologies, Inc.. (Attachments: # 1 Declaration of L. Tzeng, # 2 Exhibit 1 - US6181002, # 3 Exhibit 2 - US6352879, # 4 Exhibit 3 - USRE38806, # 5 Exhibit 4 - WD_K_0002498_JPH 09121002A_Japanese Version, # 6 Exhibit 5 - WD_K_0002724_JPH 09121002A Cert. Translation, # 7 Exhibit 6 - WD_K_0002518_784 Patent, # 8 Exhibit 7 - WD_K_0002550_111 Patent, # 9 Exhibit 8 - WD_K_0002515_McGraw-Hill, # 10 Exhibit 9 - WD_K_0002319_Chp. D Chip Scale Packaging, # 11 Exhibit 10 - WD_K_0002559_707 Patent, # 12 Exhibit 11 - WD_K_0002323_J-STD-012, # 13 Exhibit 12 - Chip Scale Package Implementation Challenges - 1999, # 14 Exhibit 13 - TI MicroStar BGA Application Report - 1998, # 15 Exhibit 14 - WD_K_0002573_MicroElec HDBK, # 16 Declaration of Dr. Leland Spangler)(Jones, Michael) (Entered: 12/09/2021) (Declaration of L. Tzeng) (3) |
| Dec 6, 2021 | 26 | ORDER GRANTING 25 Motion to Appear Pro Hac Vice for Attorney Linfong Tzeng. Attorney added for Western Digital Technologies, Inc. Pursuant to our Administrative Policies and Procedures for Electronic Filing, the attorney hereby granted to practice pro hac vice in this case must register for electronic filing with our court within 10 days of this order, if he/she has not previously done so for a prior case in this District. Signed by Judge Alan D Albright. (jkda) (Entered: 12/06/2021) (1) |
| Dec 1, 2021 | 25 | MOTION to Appear Pro Hac Vice by Michael E. Jones for Linfong Tzeng ( Filing fee $ 100 receipt number 0542-15486801) by on behalf of Western Digital Technologies, Inc.. (Jones, Michael) (Entered: 12/01/2021) (4) |
| Nov 19, 2021 | 23 | ORDER GRANTING 22 Motion to Appear Pro Hac Vice for Attorney Clara Wang. Attorney added for Western Digital Technologies, Inc. Pursuant to our Administrative Policies and Procedures for Electronic Filing, the attorney hereby granted to practice pro hac vice in this case must register for electronic filing with our court within 10 days of this order, if he/she has not previously done so for a prior case in this District. Signed by Judge Alan D Albright. (jkda) (Entered: 11/19/2021) (1) |
| Nov 19, 2021 | 24 | ORDER GRANTING 21 Motion for Protective Order. Signed by Judge Alan D Albright. (jc5) (Entered: 11/19/2021) (16) |
| Nov 17, 2021 | 22 | MOTION to Appear Pro Hac Vice by Michael E. Jones for Clara Wang ( Filing fee $ 100 receipt number 0542-15449637) by on behalf of Western Digital Technologies, Inc.. (Jones, Michael) (Entered: 11/17/2021) (4) |
| Oct 29, 2021 | 21 | Joint MOTION for Protective Order by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order Agreed Protective Order)(Cox, Nathan) (Entered: 10/29/2021) (Proposed Order Agreed Protective Order) (16) |
| Oct 29, 2021 | 21 | Joint MOTION for Protective Order by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order Agreed Protective Order)(Cox, Nathan) (Entered: 10/29/2021) (Main Document) (3) |
| Oct 8, 2021 | 20 | Standing Order Regarding Order Governing Proceedings Patent Cases. Signed by Judge Alan D Albright. (Entered: 10/13/2021) (11) |
| Aug 26, 2021 | 19 | Scheduling Recommendations/Proposed Scheduling Order Joint Motion for Entry of Agreed Scheduling Order by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order)(Breedlove, Scott) (Entered: 08/26/2021) (Main Document) (3) |
| Aug 26, 2021 | 19 | Scheduling Recommendations/Proposed Scheduling Order Joint Motion for Entry of Agreed Scheduling Order by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order)(Breedlove, Scott) (Entered: 08/26/2021) (Proposed Order) (5) |
| Aug 5, 2021 | 18 | STATUS REPORT Case Readiness Status Report by Katana Silicon Technologies LLC. (Breedlove, Scott) (Entered: 08/05/2021) (4) |
| Jul 29, 2021 | 16 | ANSWER to 15 Amended Complaint with Jury Demand by Western Digital Technologies, Inc..(Jones, Michael) Modified on 7/29/2021 (mc5). (Entered: 07/29/2021) (22) |
| Jul 29, 2021 | 17 | RULE 7 DISCLOSURE STATEMENT filed by Western Digital Technologies, Inc.. (Jones, Michael) (Entered: 07/29/2021) (2) |
| Jul 15, 2021 | 15 | Amended Complaint* (1) |
| Jul 15, 2021 | 15 | AMENDED COMPLAINT First Amended Complaint for Patent Infringement against Katana Silicon Technologies LLC amending, filed by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit, # 2 Exhibit, # 3 Exhibit)(Breedlove, Scott) (Entered: 07/15/2021) (Exhibit) (11) |
| Jul 15, 2021 | 15 | AMENDED COMPLAINT First Amended Complaint for Patent Infringement against Katana Silicon Technologies LLC amending, filed by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit, # 2 Exhibit, # 3 Exhibit)(Breedlove, Scott) (Entered: 07/15/2021) (Main Document) (30) |
| Jul 15, 2021 | 15 | AMENDED COMPLAINT First Amended Complaint for Patent Infringement against Katana Silicon Technologies LLC amending, filed by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit, # 2 Exhibit, # 3 Exhibit)(Breedlove, Scott) (Entered: 07/15/2021) (Exhibit) (25) |
| Jul 15, 2021 | 15 | AMENDED COMPLAINT First Amended Complaint for Patent Infringement against Katana Silicon Technologies LLC amending, filed by Katana Silicon Technologies LLC. (Attachments: # 1 Exhibit, # 2 Exhibit, # 3 Exhibit)(Breedlove, Scott) (Entered: 07/15/2021) (Exhibit) (24) |
| Jul 13, 2021 | N/A | Text Order GRANTING 14 Motion to Appear Pro Hac Vice. Pursuant to our Administrative Policies and Procedures for Electronic Filing, the attorney hereby granted to practice pro hac vice in this case must register for electronic filing with our court within 10 days of this order. entered by Judge Alan D Albright. (This is a text-only entry generated by the court. There is no document associated with this entry.) (JZ) (Entered: 07/13/2021) (0) |
| Jul 13, 2021 | N/A | Text Order GRANTING 13 Motion to Appear Pro Hac Vice. Pursuant to our Administrative Policies and Procedures for Electronic Filing, the attorney hereby granted to practice pro hac vice in this case must register for electronic filing with our court within 10 days of this order. entered by Judge Alan D Albright. (This is a text-only entry generated by the court. There is no document associated with this entry.) (JZ) (Entered: 07/13/2021) (0) |
| Jun 28, 2021 | 14 | MOTION to Appear Pro Hac Vice by Michael E. Jones for Douglas E. Lumish ( Filing fee $ 100 receipt number 0542-14959724) by on behalf of Western Digital Technologies, Inc.. (Jones, Michael) (Entered: 06/28/2021) (5) |
| Jun 28, 2021 | 13 | MOTION to Appear Pro Hac Vice by Michael E. Jones for Patricia Young ( Filing fee $ 100 receipt number 0542-14959713) by on behalf of Western Digital Technologies, Inc.. (Jones, Michael) (Entered: 06/28/2021) (5) |
| Jun 28, 2021 | N/A | Reset Deadlines: Western Digital Technologies, Inc. answer due 7/1/2021. (ls) (Entered: 06/28/2021) (0) |
| Jun 28, 2021 | 12 | Unopposed MOTION for Extension of Time to File Answer re 1 Complaint - Additional Extension by Western Digital Technologies, Inc.. (Attachments: # 1 Proposed Order)(Jones, Michael) (Entered: 06/28/2021) (Main Document) (2) |
| Jun 28, 2021 | N/A | Text Order GRANTING 8 Motion for Extension of Time to Answer entered by Judge Alan D Albright. (This is a text-only entry generated by the court. There is no document associated with this entry.) (JZ) (Entered: 06/28/2021) (0) |
| Jun 28, 2021 | 12 | Unopposed MOTION for Extension of Time to File Answer re 1 Complaint - Additional Extension by Western Digital Technologies, Inc.. (Attachments: # 1 Proposed Order)(Jones, Michael) (Entered: 06/28/2021) (Proposed Order) (1) |
| Jun 16, 2021 | 11 | Standing Order regarding Scheduling Order. Signed by Judge Alan D Albright. (Entered: 06/17/2021) (5) |
| Jun 4, 2021 | 10 | NOTICE of Attorney Appearance by Patrick C. Clutter on behalf of Western Digital Technologies, Inc.. Attorney Patrick C. Clutter added to party Western Digital Technologies, Inc.(pty:dft) (Clutter, Patrick) (Entered: 06/04/2021) (1) |
| Jun 4, 2021 | 9 | NOTICE of Attorney Appearance by Michael E. Jones on behalf of Western Digital Technologies, Inc.. Attorney Michael E. Jones added to party Western Digital Technologies, Inc.(pty:dft) (Jones, Michael) (Entered: 06/04/2021) (1) |
| May 21, 2021 | 8 | Unopposed MOTION for Extension of Time to File Answer re 1 Complaint Western Digital Technologies, Inc. by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order)(Breedlove, Scott) (Entered: 05/21/2021) (Main Document) (3) |
| May 21, 2021 | 8 | Unopposed MOTION for Extension of Time to File Answer re 1 Complaint Western Digital Technologies, Inc. by Katana Silicon Technologies LLC. (Attachments: # 1 Proposed Order)(Breedlove, Scott) (Entered: 05/21/2021) (Proposed Order) (1) |
| May 14, 2021 | 7 | SUMMONS Returned Executed by Katana Silicon Technologies LLC. Western Digital Technologies, Inc. served on 5/10/2021, answer due 6/1/2021. (Breedlove, Scott) (Entered: 05/14/2021) (3) |
| Apr 19, 2021 | 3 | RULE 7 DISCLOSURE STATEMENT filed by Katana Silicon Technologies LLC. (Breedlove, Scott) (Entered: 04/19/2021) (2) |
| Apr 19, 2021 | 1 | Complaint* (1) |
| Apr 19, 2021 | 4 | Notice of Filing of Patent/Trademark Form (AO 120). AO 120 forwarded to the Director of the U.S. Patent and Trademark Office. (Breedlove, Scott) (Main Document 4 replaced on 4/19/2021) (lad). (Entered: 04/19/2021) (1) |
| Apr 19, 2021 | N/A | All parties shall comply with the Standing Orders of Judge Alan D. Albright located at https://www.txwd.uscourts.gov/judges-information/standing-orders/. (lad) (Entered: 04/19/2021) (0) |
| Apr 19, 2021 | 5 | Pro Hac Vice Letter to Seth A. Lindner. (lad) (Entered: 04/19/2021) (1) |
| Apr 19, 2021 | N/A | Case assigned to Judge Alan D Albright. CM WILL NOW REFLECT THE JUDGE INITIALS AS PART OF THE CASE NUMBER. PLEASE APPEND THESE JUDGE INITIALS TO THE CASE NUMBER ON EACH DOCUMENT THAT YOU FILE IN THIS CASE. (lad) (Entered: 04/19/2021) (0) |
| Apr 19, 2021 | 6 | Summons Issued as to Western Digital Technologies, Inc.. (lad) (Entered: 04/19/2021) (2) |
| Apr 19, 2021 | 2 | REQUEST FOR ISSUANCE OF SUMMONS by Katana Silicon Technologies LLC. for Western Digital Technologies, Inc. (Breedlove, Scott) (Main Document 2 replaced on 4/19/2021) (lad). (Entered: 04/19/2021) (2) |
