Case number IPR2023-00900
Micron Technology, Inc. et al. v. BeSang Inc. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Dec 20, 2024 | 36 | petitioner | Petitioner's Notice of Appeal Download |
| Nov 13, 2024 | 35 | board | Judgment Final Written Decision Download |
| Sep 17, 2024 | 34 | board | Other: Hearing transcript Download |
| Aug 19, 2024 | 1063 | petitioner | Petitioner's Demonstratives Download |
| Aug 19, 2024 | 2053 | patent_owner | Patent Owner's Demonstratives Download |
| Aug 19, 2024 | 32 | patent_owner | Patent Owner's Updated Exhibit List Download |
| Aug 19, 2024 | 33 | petitioner | Petitioner's Updated List of Exhibits Download |
| Aug 16, 2024 | 31 | board | LEAP Practitioner Request and Verification Form (Petitioner) Download |
| Aug 13, 2024 | 30 | petitioner | Joint Stipulation To Modify Due Date To Exchange Demonstratives Download |
| Jul 30, 2024 | 29 | board | Download |
| Jul 3, 2024 | 27 | petitioner | Petitioner's Request for Oral Argument Download |
| Jul 3, 2024 | 28 | patent_owner | Patent Owner's Request for Oral Argument Download |
| Jun 21, 2024 | 2052 | patent_owner | Dr. Jack C. Lee Depo. Transcript (June 12, 2024) Download |
| Jun 21, 2024 | 26 | patent_owner | Patent Owner's Sur-Reply Download |
| Jun 12, 2024 | 25 | petitioner | Petitioner's Opposition to Patent Owner's Motion to Strike Download |
| May 29, 2024 | 24 | patent_owner | Patent Owner's Motion to Strike Download |
| May 15, 2024 | 22 | patent_owner | Patent Owner's Notice of Deposition of Dr. Jack C. Lee Download |
| May 15, 2024 | 23 | patent_owner | Joint Stipulation to Modify Due Date 3 Download |
| May 10, 2024 | 21 | patent_owner | Patent Owner's Objections to Evidence Download |
| May 3, 2024 | 1033 | petitioner | Download |
| May 3, 2024 | 1034 | petitioner | Perrine Batude et al., 3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS, 2 IEEE J. Emerging and Selected Topics in Circuits and Systems 714-22 (2012) Download |
| May 3, 2024 | 1035 | petitioner | Rafael Reif et al., Technology and Applications of Three- Dimensional Integration, 2004 Electrochemical Society Proceedings Volume 261-76 (2004) Download |
| May 3, 2024 | 1036 | petitioner | Download |
| May 3, 2024 | 1037 | petitioner | SEM Image Download |
| May 3, 2024 | 1038 | petitioner | Download |
| May 3, 2024 | 1039 | petitioner | Download |
| May 3, 2024 | 1040 | petitioner | Certain Semiconductor Chips and Prods. Containing Same, ITC Inv. No. 337-TA-753, 2012 WL 927056 (Mar. 2, 2012) Download |
| May 3, 2024 | 1040 | petitioner | Certain Semiconductor Chips and Prods. Containing Same, ITC Inv. No. 337-TA-753, 2012 WL 927056 (Mar. 2, 2012) Download |
| May 3, 2024 | 1041 | petitioner | Download |
| May 3, 2024 | 1042 | petitioner | Email thread from Sang-Yun Lee, dated Nov. 8-26, 2007 Download |
| May 3, 2024 | 1043 | petitioner | Sang-Yun Lee & Junil Park, Architecture of 3D Memory Cell Array on 3D IC, IEEE (2012) Download |
| May 3, 2024 | 1044 | petitioner | Email thread from Scott DeBoer (Micron), dated Oct. 10, 2017 Download |
| May 3, 2024 | 1045 | petitioner | Email from Scott DeBoer (Micron), dated July 19, 2016 Download |
| May 3, 2024 | 1046 | petitioner | Sang-Yun Lee & Junil Park, History and Trend of 3-Dimensional Integrated Circuit Download |
| May 3, 2024 | 1047 | petitioner | International Technology Roadmap for Semiconductors: Front End Processes (2003) Download |
| May 3, 2024 | 1048 | petitioner | U.S. Patent No. 6,951,798 Download |
| May 3, 2024 | 1049 | petitioner | Gerald Lucovsky et al., Integration of Plasma-Assisted and Rapid Thermal Processing for Low-Thermal Budget Preparation of Ultra- Thin Dielectrics for Stacked-Gate Device Structures, 33 Jpn. J. Appl. Phys. Vol. 7061-70 (1994) Download |
| May 3, 2024 | 1050 | petitioner | Download |
| May 3, 2024 | 1051 | petitioner | Dr. Steven A. Przybylski Deposition Transcript (Apr. 5, 2024) Download |
| May 3, 2024 | 1052 | petitioner | D.E. Mercer et al., Will Thermal Budget Really Matter in the Future, 2001-9 Electrochemical Soc. Proceedings 247 (2000) Download |
| May 3, 2024 | 1053 | petitioner | Download |
| May 3, 2024 | 1054 | petitioner | R. L. Smith & S. D. Collins, A Wafer-to-wafer Alignment Technique, 20 Sensors & Actuators 315-16 (1989) Download |
| May 3, 2024 | 1055 | petitioner | Frank Niklaus et al., A Method to Maintain Wafer Alignment Precision During Adhesive Wafer Bonding, 107 Sensors & Actuators 273-78 (2003) Download |
| May 3, 2024 | 1056 | petitioner | Updated Guidance for Making a Proper Determination of Obviousness, 89 Fed. Reg. 14,449-453 (Feb. 27, 2024), https://www.federalregister.gov/documents/2024/02/27/2024- 03967/updated-guidance-for-making-a-proper-determination-ofobviousness Download |
| May 3, 2024 | 1057 | petitioner | Roberto Bez et al., Introduction to Flash Memory, 91 Proc. IEEE 489-502 (2003) Download |
| May 3, 2024 | 1058 | petitioner | Download |
| May 3, 2024 | 1059 | petitioner | Keith Thompson, Electromagnetic Fast-Firing for the Rapid Thermal Processing of Silicon (Feb. 25, 2003) (Ph.D. dissertation, University of Wisconsin-Madison) Download |
| May 3, 2024 | 1060 | petitioner | Keith Thompson et al., Direct Silicon-Silicon Bonding by Electromagnetic Induction Heating, 11 J. Microelectromechanical Sys. 285-92 (2002) Download |
| May 3, 2024 | 1061 | petitioner | U.S. Patent No. 5,519,236 Download |
| May 3, 2024 | 1062 | petitioner | U.S. Patent No. 5,932,920 Download |
| May 3, 2024 | 20 | petitioner | Petitioner's Reply to Patent Owner's Response Download |
| Feb 22, 2024 | 19 | petitioner | Download |
| Feb 16, 2024 | 18 | patent_owner | Patent Owner's Response to Petition for Inter Partes Review Download |
| Feb 16, 2024 | 2021 | patent_owner | Bez, Intro to Flash Memory Download |
| Feb 16, 2024 | 2022 | patent_owner | Executive Summary, ITRS (2003) Download |
| Feb 16, 2024 | 2023 | patent_owner | '994 Patent, Fig. 12B (annotated by Dr. Lee) Download |
| Feb 16, 2024 | 2024 | patent_owner | '994 Patent, Fig. 12B (annotated by Dr. Lee) Download |
| Feb 16, 2024 | 2025 | patent_owner | '994 Patent, Fig. 12B (annotated by Dr. Lee) Download |
| Feb 16, 2024 | 2026 | patent_owner | '994 Patent, Fig. 12B (annotated by Dr. Lee) Download |
| Feb 16, 2024 | 2027 | patent_owner | Batude, 3-D Sequential Information (2012) Download |
| Feb 16, 2024 | 2028 | patent_owner | Dr. Jack C. Lee Depo. Transcript (Feb. 6, 2024) Download |
| Feb 16, 2024 | 2029 | patent_owner | Declaration of Steven A. Przybylski Download |
| Feb 16, 2024 | 2030 | patent_owner | CV of Steven A. Przybylski Download |
| Feb 16, 2024 | 2031 | patent_owner | Webster's Dictionary excerpt (2003) Download |
| Feb 16, 2024 | 2032 | patent_owner | Random House Dictionary excerpt (1997) Download |
| Feb 16, 2024 | 2033 | patent_owner | May, Fundamentals of Semiconductor Manufacturing (2006)(excerpts) Download |
| Feb 16, 2024 | 2034 | patent_owner | Keeth, DRAM Circuit Design Fundamental (2008) (excerpts) Download |
| Feb 16, 2024 | 2035 | patent_owner | Keeth, DRAM Circuit Design Tutorial (2001) (excerpts) Download |
| Feb 16, 2024 | 2036 | patent_owner | Itoh, VLSI Memory Chip Design (2001) (excerpts) Download |
| Feb 16, 2024 | 2037 | patent_owner | Interconnect, ITRS (2007) Download |
| Feb 16, 2024 | 2038 | patent_owner | 2/16/2024 Board email Download |
| Jan 12, 2024 | 16 | patent_owner | Joint Stipulation to Modify Due Date 1 Download |
| Jan 12, 2024 | 17 | patent_owner | Patent Owner's Amended Notice of Deposition of Dr. Jack C. Lee Download |
| Jan 3, 2024 | 15 | patent_owner | Patent Owner's Notice of Deposition of Dr. Jack C. Lee Download |
| Dec 29, 2023 | 13 | petitioner | Download |
| Dec 29, 2023 | 14 | petitioner | Download |
| Dec 27, 2023 | 1032 | petitioner | Download |
| Dec 27, 2023 | 12 | petitioner | Petitioner's Updated List of Exhibits Download |
| Dec 4, 2023 | 11 | patent_own | Patent Owner's Objections to Evidence Download |
| Nov 17, 2023 | 10 | board | Order: Scheduling Order Download |
| Nov 17, 2023 | 9 | board | Institution Decision: Grant Download |
| Sep 28, 2023 | 2020 | patent_own | 9-14-2023 Email from Board Authorizing Preliminary Reply and Sur-Reply Briefing Download |
| Sep 28, 2023 | 8 | patent_own | Patent Owner's Preliminary Sur-Reply Download |
| Sep 21, 2023 | 1031 | petitioner | Letter dated September 21, 2023 to counsel for Patent Owner from John Kappos Download |
| Sep 21, 2023 | 7 | petitioner | Petitioner's Preliminary Reply In Support of Inter Partes Review of U.S. Patent No. 7,378,702 Download |
| Aug 28, 2023 | 2001 | patent_own | First Amended Docket Control Order, BeSang v. Micron (E.D. Tex. June 21, 2023) Download |
| Aug 28, 2023 | 2002 | patent_own | Docket Re BeSang v. Micron (E.D. Tex.) (as of Aug. 28, 2023) Download |
| Aug 28, 2023 | 2004 | patent_own | Defs' Patent L.R. 3-3 Invalidity Contentions, BeSang v. Micron (E.D. Tex. July 11, 2023) Download |
| Aug 28, 2023 | 2005 | patent_own | Mutschler, Stanford, Korean nanofab center, EDN (Aug. 13, 2008) Download |
| Aug 28, 2023 | 2006 | patent_own | Press Release, Micron and Intel Unveil New 3D NAND Flash Memory (Mar. 26, 2015) Download |
| Aug 28, 2023 | 2007 | patent_own | Clarke, EE Times updates list of emerging startups (Feb. 2, 2009) Download |
| Aug 28, 2023 | 2008 | patent_own | GSA Forum, Exploring the Potential of Emerging Semiconductor Technology (June 2011) Download |
| Aug 28, 2023 | 2009 | patent_own | Frost & Sullivan, Looking Beyond TSV For 3D IC Technology (Mar. 2009) Download |
| Aug 28, 2023 | 2010 | patent_own | Press Release, Micron and Intel Extend their Leadership (May 21, 2018) Download |
| Aug 28, 2023 | 2011 | patent_own | Micron Unveils 3D NAND (Mar. 26, 2015) (video file) Download |
| Aug 28, 2023 | 2012 | patent_own | Radar Scope, Semiconductor Times (Apr. 2007) Download |
| Aug 28, 2023 | 2014 | patent_own | 1-29-2007 Email from Peter Feeley to BeSang Download |
| Aug 28, 2023 | 2015 | patent_own | 7-30-2007 Email exchange between Tom Arnold, Sang-Yun Lee, and others Download |
| Aug 28, 2023 | 2019 | patent_own | Download |
| Aug 28, 2023 | 6 | patent_own | Patent Owner's Preliminary Response Download |
| May 26, 2023 | 5 | board | Notice: Notice filing date accorded Download |
| May 25, 2023 | 3 | patent_owner | Notice : Mandatory Notice Download |
| May 25, 2023 | 4 | patent_owner | Notice : Power of Attorney Download |
| May 4, 2023 | 1 | petitioner | Petition for Inter Partes Review of U.S. Patent No. 7,378,702 Download |
| May 4, 2023 | 1001 | petitioner | Download |
| May 4, 2023 | 1002 | petitioner | Declaration of Dr. Jack C. Lee Download |
| May 4, 2023 | 1003 | petitioner | Curriculum Vitae of Dr. Jack C. Lee Download |
| May 4, 2023 | 1004 | petitioner | Prosecution History of U.S. Patent No. 7,378,702 (App. No. 10/934,270) Download |
| May 4, 2023 | 1005 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1006 | petitioner | Download |
| May 4, 2023 | 1007 | petitioner | Download |
| May 4, 2023 | 1008 | petitioner | Download |
| May 4, 2023 | 1009 | petitioner | G. Groeseneken et al., Basics of Nonvolatile Semiconductor Memory Devices Download |
| May 4, 2023 | 1010 | petitioner | Philip M. Sailer et al., Creating 3D Circuits Using Transferred Films, IEEE Download |
| May 4, 2023 | 1011 | petitioner | Download |
| May 4, 2023 | 1012 | petitioner | Download |
| May 4, 2023 | 1013 | petitioner | Download |
| May 4, 2023 | 1014 | petitioner | Kee-Ho Yu et al., Real-Time Microvision System with Three-Dimensional Download |
| May 4, 2023 | 1015 | petitioner | Download |
| May 4, 2023 | 1016 | petitioner | Horacio Mendez, Silicon-on-Insulator: SOI Technology and Ecosystem Download |
| May 4, 2023 | 1017 | petitioner | Download |
| May 4, 2023 | 1018 | petitioner | T. Mikolajick et al., The Future of Charge Trapping Memories Download |
| May 4, 2023 | 1019 | petitioner | Complaint, BeSang Inc. v. Micron Tech., Inc., No. 2:23-cv-00028 Download |
| May 4, 2023 | 1020 | petitioner | Jim Handy, 3D NAND: Benefits of Charge Traps over Floating Gates Download |
| May 4, 2023 | 1021 | petitioner | E. Bertagnolli et al., ROS: An Extremely High Density MASK ROM Technology Download |
| May 4, 2023 | 1022 | petitioner | Tetsuo Endoh et al., Novel Ultrahigh-Density Flash memory Download |
| May 4, 2023 | 1023 | petitioner | F. Nemati & J.D. Plummer, A Novel High Density, Low Voltage SRAM Cell Download |
| May 4, 2023 | 1024 | petitioner | K.W. Lee et al., Three-Dimensional Shared Memory Fabricated Using Wafer Download |
| May 4, 2023 | 1025 | petitioner | NAND vs. NOR Flash Memory, Toshiba America Electronic Components, Inc. Download |
| May 4, 2023 | 1026 | petitioner | G.K. Celler & Sorin Crisoloveanu, Frontiers of Silicon-on-Insulator Download |
| May 4, 2023 | 1027 | petitioner | Timeline, Soitec Download |
| May 4, 2023 | 1028 | petitioner | G. Shahidi et al., Fabrication of CMOS on Ultrathin SOI Download |
| May 4, 2023 | 1029 | petitioner | MicroChemicals, Further Processing of Silicon Wafers Download |
| May 4, 2023 | 1030 | petitioner | Hiroshi Sakuraba et al., New Three-Dimensional High-Density Download |
| May 4, 2023 | 2 | petitioner | Petitioner Micron Technology, Inc. et al.'s Power of Attorney Download |
