Case number IPR2018-01000
Micron Technology v. North Star Innovations Inc. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Oct 26, 2021 | 36 | board | GENERAL ORDER Download |
| May 4, 2020 | 35 | GENERAL ORDER Download | |
| Dec 23, 2019 | 34 | Notice of Appeal Download | |
| Oct 24, 2019 | 33 | Termination Decision Document Download | |
| Sep 5, 2019 | 32 | Hearing Transcript Download | |
| Jul 22, 2019 | 31 | ORDER Granting Joint Request for Oral Argument Download | |
| Jul 19, 2019 | 30 | Joint Request for Oral Hearing Download | |
| Jun 28, 2019 | 29 | PATENT OWNER¿¿¿S SUR-REPLY TO PETITIONER¿¿¿S REPLY TO PATENT OWNER¿¿¿S RESPONSE Download | |
| Jun 28, 2019 | 2012 | Ex. 2012 Download | |
| Jun 28, 2019 | 2011 | Ex. 2011 Download | |
| Jun 28, 2019 | 2010 | Ex. 2010 Download | |
| May 31, 2019 | 1038 | Ex. 1038 Download | |
| May 31, 2019 | 1039 | Ex. 1039 Download | |
| May 31, 2019 | 1040 | Ex. 1040 Download | |
| May 31, 2019 | 1037 | Ex. 1037 Download | |
| May 31, 2019 | 28 | 2019.05.31 [Petitioner] Reply to Response IPR2018-01000 Download | |
| May 31, 2019 | 1041 | Ex. 1041 Download | |
| Apr 15, 2019 | 27 | Revised Scheduling Order 37 C.F.R. ¿¿ 42.5 Download | |
| Apr 11, 2019 | 26 | Joint Notice of Stipulation to Revised Schedule Download | |
| Mar 25, 2019 | 24 | ORDER Conduct of the Proceeding 37 C.F.R. § 42.5 Download | |
| Mar 25, 2019 | 2009 | North Star Ex. 2009 Download | |
| Mar 25, 2019 | 25 | Transmittal Letter for Supplemental Glew Declaration Download | |
| Mar 20, 2019 | 23 | 2019.03.20 [Micron] Updated Mandatory Notices Download | |
| Mar 19, 2019 | 22 | Order Granting Petitioner's Motions for Admission Pro Hac Vice of Jared Bobrow Download | |
| Mar 11, 2019 | 20 | Petitioner's Motion for Admission Pro Hac Vice of Jared Bobrow Download | |
| Mar 11, 2019 | 21 | Declaration of Jared Bobrow In Support of Petitioner's Motion of Admission Pro Hac Vice Download | |
| Mar 1, 2019 | 19 | Corrected Notice of Depo of Alexander D. Glew Download | |
| Feb 28, 2019 | 18 | 2019.02.28 [Petitioner] Notice of Depo of Andrew Glew Download | |
| Feb 26, 2019 | 2001 | North Star Ex. 2001 Download | |
| Feb 26, 2019 | 2001 | North Star Ex. 2001 Download | |
| Feb 7, 2019 | 17 | Petitioner's Objections to Patent Owner's Response Evidence Download | |
| Jan 31, 2019 | 2002 | North Star Ex. 2002 Download | |
| Jan 31, 2019 | 2006 | North Star Ex. 2006 Download | |
| Jan 31, 2019 | 2003 | North Star Ex. 2003 Download | |
| Jan 31, 2019 | 2005 | North Star Ex. 2005 Download | |
| Jan 31, 2019 | 2008 | North Star Ex. 2008 Download | |
| Jan 31, 2019 | 2004 | North Star Ex. 2004 Download | |
| Jan 31, 2019 | 2007 | North Star Ex. 2007 Download | |
| Jan 31, 2019 | 16 | Patent Owner's Response Download | |
| Jan 31, 2019 | 2001 | North Star Ex. 2001 Download | |
| Dec 21, 2018 | 15 | Order - Granting Patent Owner's Motions for Admission Pro Hac Vice of Edward C. Flynn - 37 CFR 42.10(c) Download | |
| Dec 11, 2018 | 12 | Pro Hac Vice - Edward C. Flynn Download | |
| Dec 11, 2018 | 13 | Declaration of Edward C. Flynn in Support of PHV Download | |
| Dec 11, 2018 | 14 | Certificate of Service of PHV and Declaration Download | |
| Nov 19, 2018 | 11 | JOINT STIPULATION TO REVISE SCHEDULE Download | |
| Oct 26, 2018 | 9 | Trial Instituted Document Download | |
| Oct 26, 2018 | 10 | Scheduling Order Download | |
| Aug 22, 2018 | 8 | PATENT OWNER¿¿¿S UPDATED MANDATORY NOTICES Download | |
| Jul 30, 2018 | 7 | WAIVER OF PATENT OWNER¿¿¿S PRELIMINARY RESPONSE Download | |
| Jun 1, 2018 | 6 | Petitioner's Updated Mandatory Notices Download | |
| May 21, 2018 | 4 | Mandatory Notice Download | |
| May 21, 2018 | 5 | Power of Attorney Download | |
| May 15, 2018 | 3 | Notice of Accord Filing Date Download | |
| May 1, 2018 | 1021 | Ex. 1021 W. Van Den Bogert et al., Thermal Stress in Semiconductor Encapsulating Materials, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. II, No. 3, September 1988 (¿¿¿Bogert¿¿¿) Download | |
| May 1, 2018 | 1001 | Ex. 1001 U.S. Patent No. 6,465,743 (¿¿¿743 Patent¿¿¿) Download | |
| May 1, 2018 | 1012 | Ex. 1012 Declaration of Mel DeSart regarding J. Lau et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Grid Array Carrier (OMPAC),¿¿¿ Proceedings of IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993, pp. 63-75 (¿¿¿DeSart Decl.¿¿¿) Download | |
| May 1, 2018 | 1016 | Ex. 1016 J. Houghten, ¿¿¿New Package Takes on QFPS,¿¿¿ Advanced Packaging, Winter 1993 Volume 2, No. 1, pp. 38-39 (¿¿¿Houghten¿¿¿) Download | |
| May 1, 2018 | 1032 | Ex. 1032 P. Lin and M. McShane, ¿¿¿Approaches to High Pin Count and High Power Surface Mount Packages,¿¿¿ 1991, VLSITSA, pp. 141-146 (¿¿¿Lin¿¿¿) Download | |
| May 1, 2018 | 1027 | Ex. 1027 Excerpts from McGraw Hill Dictionary of Chemical Terms, McGraw Hill Book Co., San Francisco, CA (¿¿¿1984 McGraw Hill Dictionary¿¿¿) Download | |
| May 1, 2018 | 1 | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,465,743 UNDER 35 U.S.C. ¿¿¿¿ 311-319 AND 37 C.F.R. ¿¿¿¿ 42.1-.80, 42.100-.123 Download | |
| May 1, 2018 | 1003 | Ex. 1003 Declaration of Philip Garrou, Ph.D. (Garrou Decl.¿¿¿) Download | |
| May 1, 2018 | 1029 | Ex. 1029 Excerpts from CRC Handbook of Chemistry and Physics, 74th Edition, The Chemical Rubber Co. (CRC) Press, 1993 (¿¿¿CRC Handbook¿¿¿) Download | |
| May 1, 2018 | 1035 | Ex. 1035 Array Package Users Guidelines, HDP User Group Int¿¿¿l, 1995 (¿¿¿Array Package Users Guidelines¿¿¿) Download | |
| May 1, 2018 | 1018 | Ex. 1018 F.F. Cappo, et al., ¿¿¿Highly Manufacturable Muli-Layered Ceramic Surface Mounted Package,¿¿¿ IEEE/CHMT ¿¿¿91 Symposium, pp. 424-428 (¿¿¿Cappo¿¿¿) Download | |
| May 1, 2018 | 1007 | Ex. 1007 U.S. Patent No. 5,435,482 (¿¿¿Variot¿¿¿) Download | |
| May 1, 2018 | 1011 | Ex. 1011 J. Lau et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Grid Array Carrier (OMPAC),¿¿¿ Proceedings of IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993, pp. 63-75 (¿¿¿Lau¿¿¿) Download | |
| May 1, 2018 | 1004 | Ex. 1004 Curriculum Vitae of Philip Garrou, Ph.D. Download | |
| May 1, 2018 | 1022 | Ex. 1022 L.T. Nguyen et al., ¿¿¿Molding Compound Trends in a Denser Packaging World: Part III ¿¿¿ Property Optimization for Minimum Stress,¿¿¿ EEP-Vol. 6, Electronic Packaging Reliability, ASME 1998 (¿¿¿Nguyen¿¿¿) Download | |
| May 1, 2018 | 1006 | Ex. 1006 PCT Application Publication No. WO 90/07792 (¿¿¿Altman¿¿¿) Download | |
| May 1, 2018 | 1019 | Ex. 1019 Electronic Materials Handbook, Vol. 1, Packaging, ASM International (First Printing, November 1989) (¿¿¿Electronic Materials Handbook¿¿¿) Download | |
| May 1, 2018 | 1002 | Ex. 1002 File History for U.S. Patent No. 6,465,743 (¿¿¿743 Patent FH¿¿¿) Download | |
| May 1, 2018 | 1015 | Ex. 1015 U.S. Patent No. 4,753,863 (¿¿¿Spanjer¿¿¿) Download | |
| May 1, 2018 | 1023 | Ex. 1023 N. Chidambaram (Raj), et al., ¿¿¿Stress and Coplanarity Analysis of 225 BGA Package,¿¿¿ 1994 IEE/CPMT Int¿¿¿l Elec. Mfg. Tech. Symp. (¿¿¿Chidambaram¿¿¿) Download | |
| May 1, 2018 | 1034 | Ex. 1034 E.J. Vardaman, ¿¿¿Ball Grid Array Packages: Market and Technology Developments,¿¿¿ TechSearch Int¿¿¿l, Inc., Dec. 1994 (¿¿¿Vardaman¿¿¿) Download | |
| May 1, 2018 | 1017 | Ex. 1017 Declaration of James L. Mullins regarding J. Houghten, ¿¿¿New Package Takes on QFPS,¿¿¿ Advanced Packaging, Winter 1993 Volume, pp. 38-39 (¿¿¿Mullins Decl.¿¿¿) Download | |
| May 1, 2018 | 1014 | Ex. 1014 Declaration of Julie Carlson regarding JEDEC Standard No. MO-151A, ¿¿¿S-PXGA-X/PBGA Plastic Ball Grid Array Family Registration,¿¿¿ issued November 1993 (¿¿¿Carlson Decl.¿¿¿) Download | |
| May 1, 2018 | 1024 | Ex. 1024 J. Shimizu, ¿¿¿Plastic Ball Grid Arrary Coplanrity,¿¿¿ Apart from the Crowd, Proceedings of the Technical Program, Surface Mount Int¿¿¿l Conf. & Expo., San Jose, California, August 29 ¿¿¿ September 2, 1993, pp. 86-91 (¿¿¿Shimizu¿¿¿) Download | |
| May 1, 2018 | 1009 | Ex. 1009 Declaration of Rachel J. Watters regarding W. Engelmaier, ¿¿¿Thermo-Mechanical Effects,¿¿¿ Electronic Materials Handbook, Vol. 1, Packaging (1989) (¿¿¿Watters Decl.¿¿¿) Download | |
| May 1, 2018 | 2 | Power of Attorney Download | |
| May 1, 2018 | 1028 | Ex. 1028 EP Patent Application No. 0 102 456 A2 (¿¿¿Christie¿¿¿) Download | |
| May 1, 2018 | 1031 | Ex. 1031 U.S. Patent No. 4,504,435 (¿¿¿Orcutt¿¿¿) Download | |
| May 1, 2018 | 1036 | Ex. 1036 B. Freyman and R. Pennisi, ¿¿¿Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics,¿¿¿ 41st Elec. Comp. & Tech. Conf., 1991 (¿¿¿Freyman II¿¿¿) Download | |
| May 1, 2018 | 1025 | Ex. 1025 F. Martin, C-5 Solder Sphere Robotic Placement Cell For Overmolded Pad Array Carrier, Motorola Inc., Austin, TX (¿¿¿Martin¿¿¿) Download | |
| May 1, 2018 | 1030 | Ex. 1030 Japanese Patent Application No. H5-226792 (¿¿¿Sakai¿¿¿) with certified translation Download | |
| May 1, 2018 | 1008 | Ex. 1008 W. Engelmaier, ¿¿¿Thermo-Mechanical Effects,¿¿¿ Electronic Materials Handbook, Vol. 1, Packaging (1989) (¿¿¿Engelmaier¿¿¿) Download | |
| May 1, 2018 | 1005 | Ex. 1005 U.S. Patent No. 5,285,352 (¿¿¿Pastore¿¿¿) Download | |
| May 1, 2018 | 1033 | Ex. 1033 R. Johnson et al., ¿¿¿A Feasibility Study of Ball Grid Array Packaging,¿¿¿ pp. 413-422 (¿¿¿Johnson¿¿¿) Download | |
| May 1, 2018 | 1013 | Ex. 1013 JEDEC Standard No. MO-151A, ¿¿¿S-PXGA-X/PBGA Plastic Ball Grid Array Family Registration¿¿¿ (¿¿¿JEDEC Standard¿¿¿) Download | |
| May 1, 2018 | 1020 | Ex. 1020 J. Lau, Ball Grid Array Technology, McGraw-Hill, Inc., 1995 (¿¿¿Lau II¿¿¿) Download | |
| May 1, 2018 | 1026 | Ex. 1026 J. Lau, et al., ¿¿¿No Clean Mass Reflow of Large Over Molded Plastic Pad Array Carriers (OMPAC),¿¿¿ Fifteenth IEEE/CHMT Int¿¿¿l Elec. Mfg. Tech. Symp., 1993 (¿¿¿Lau III¿¿¿) Download | |
| May 1, 2018 | 1010 | Ex. 1010 U.S. Patent No. 5,635,671 (¿¿¿Freyman¿¿¿) Download |
