NXP USA, Inc. et al. v. Bell Semiconductor, LLC et al. > Summary
Court Case Number IPR2024-00168
Filing Date Nov 9, 2023
Court Patent Trial and Appeal Board
Status Trial Instituted
Claims Challenged in the Petition: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12
Claims Instituted: 1, 2, 3, 4, 5, 6, 8
Petitioner
Patent Owner
Petitioner Attorneys
6NXP USA, Inc.
Attorney Name: Jacob Baker
Garlick & Markison
NXP USA, Inc.
Attorney Name: Bruce E. Garlick
Garlick & Markison
NXP USA, Inc.
Attorney Name: Patricia M. Healy
Garlick & Markison
NXP USA, Inc.
Attorney Name: Timothy D. Taylor
Garlick & Markison
NXP USA, Inc.
Attorney Name: Timothy W. Markison
Garlick & Markison
NXP USA, Inc.
Attorney Name: June Munford
NXP USA, Inc.
Patent Owner Attorneys
5Bell Semiconductor, LLC
Attorney Name: Jason Mitchell Shapiro
Devlin Law Firm
Bell Semiconductor, LLC
Attorney Name: Timothy Devlin
Devlin Law Firm
Bell Semiconductor, LLC
Attorney Name: Andrew J. Sherman
Devlin Law Firm
Bell Semiconductor, LLC
Attorney Name: Feng Xu
Devlin Law Firm
Bell Semiconductor, LLC
Attorney Name: Joseph Bernstein
Ariel University Center of Samaria
Related Patents
| Doc No | Title | Issue date |
|---|---|---|
| 07345245 | Robust high density substrate design for thermal cycling reliability | Mar 18, 2008 |
