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Case number IPR2019-00001

Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Summary

Court Case Number IPR2019-00001

Filing Date Oct 1, 2018

Institution Decision Date -

Decision Date Dec 21, 2018

Court Patent Trial and Appeal Board

Status Terminated-Settled

Administrative JudgesKen B. Barrett, Frances L. Ippolito, Christopher C. Kennedy

Judge Writing the Final DecisionKen B. Barrett

Claims Challenged in the Petition: 41, 44, 45

Related Patents

Doc No Title Issue date
07553744 Method for low temperature bonding and bonded structure Jun 30, 2009
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