Date Field | Doc. No. | Party | Description |
---|
Oct 1, 2018 | 1 | | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 7,807,549 Download |
Oct 1, 2018 | 2 | | Power of Attorney Samsung Electronics Co., Ltd. Download |
Oct 1, 2018 | 3 | | Power of Attorney Samsung Electronics America, Inc. Download |
Oct 17, 2018 | 4 | | Notice of Accord Filing Date Download |
Oct 22, 2018 | 5 | | Patent Owner's Power of Attorney Download |
Oct 22, 2018 | 6 | | Patent Owner's Mandatory Notices Download |
Oct 31, 2018 | 7 | | Patent Owner's Motion for District Court (Phillips) Patent Claim Construction Download |
Dec 10, 2018 | 8 | | ORDER - Granting Patent Owner¿¿¿s
Motions for a District Court-Type Claim Construction Approach
37 C.F.R. ¿¿ 42.100(b) Download |
Dec 13, 2018 | 9 | | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 13, 2018 | 10 | | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 21, 2018 | 11 | | Termination Decision Document Download |
Jan 8, 2019 | 12 | | Petitioner's Request for Refund of Fees Download |
Jan 25, 2019 | 13 | | Notice of Refund Download |
Oct 1, 2018 | 1001 | | U.S. Patent No. 7,807,549 ("the "549 Patent") Download |
Oct 1, 2018 | 1002 | | Prosecution File History of U.S. Patent No. 7,807,549 Download |
Oct 1, 2018 | 1003 | | Declaration of Dr. Charles Hunt Download |
Oct 1, 2018 | 1004 | | Curriculum Vitae for Dr. Charles Hunt Download |
Oct 1, 2018 | 1005 | | Y. Li et al., Systematic Low Temperature Silicon Bonding
Using Pressure and Temperature, 1998 Jpn. J. Appl. Phys. 37
(1998) ("Li") Download |
Oct 1, 2018 | 1006 | | M. Reiche et al., The Effect of a Plasma Pretreatment on the
Si/Si Bonding Behaviour, 97-36 Electrochemical Society
Proceedings 437 (1997) ("Reiche") Download |
Oct 1, 2018 | 1008 | | Q. Tong et al., Semiconductor Wafer Bonding: Recent
Developments, 37 Materials Chemistry and Physics 101 (1994)
("Tong (1994)") Download |
Oct 1, 2018 | 1009 | | G. Kissinger et al., Void-Free Silicon-Wafer-Bond
Strengthening in the 200-400C Range, 36 Sensors and
Actuators A 149 (1993) ("Kissinger") Download |
Oct 1, 2018 | 1010 | | Q. Tong et al., Semiconductor Wafer Bonding: Science and
Technology, John Wiley & Sons, Inc. (1999) Download |
Oct 1, 2018 | 1011 | | A. Li, Systematic Low Temperature Bonding and its
Application to the Hydrogen Ion Cut Process and Three-
Dimensional Structures (1999) Download |
Oct 1, 2018 | 1012 | | Q. Tong et al., Wafer Bonding and Layer Splitting for
Microsystems, 11 Advanced Materials 1409 (1999) Download |
Oct 1, 2018 | 1013 | | R. Bower et al., Low Temperature Si3N4 Direct Bonding, 62
Applied Physics Letters 3485 (1993) Download |
Oct 1, 2018 | 1014 | | U.S. Patent No. 5,503,704 Download |
Oct 1, 2018 | 1015 | | Q. Tong et al., Low Temperature Wafer Direct Bonding, 3 J. Microelectromechanical Sys. 29 (1994) ("Tong (Mar. 1994)") Download |
Oct 1, 2018 | 1016 | | Declaration of Dr. Sylvia Hall-Ellis Regarding Li, Reiche,
Tong (1994), Kissinger, and Tong (Mar. 1994) Download |
Oct 1, 2018 | 1017 | | Declaration of Rachel J. Watters Regarding Li Download |
Oct 1, 2018 | 1018 | | Declaration of Elizabeth Craanen of The Electrochemical
Society, Inc. Regarding Reiche Download |
Oct 1, 2018 | 1019 | | Declaration of Amanda Piel of Elsevier, Inc. Regarding Tong
(1994) and Kissinger (Part 1 of 2) Download |
Oct 1, 2018 | 1019 | | Declaration of Amanda Piel of Elsevier, Inc. Regarding Tong
(1994) and Kissinger (Part 1 of 2) Download |
Oct 1, 2018 | 1019 | | Declaration of Amanda Piel of Elsevier, Inc. Regarding Tong
(1994) and Kissinger (Part 2 of 2) Download |
Oct 1, 2018 | 1020 | | Declaration of Gerard Grenier of The Institute of Electronics
Engineers, Inc. Regarding Tong (Mar. 1994) Download |