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Case number IPR2019-00006

Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Summary

Court Case Number IPR2019-00006

Filing Date Oct 1, 2018

Institution Decision Date -

Decision Date Dec 21, 2018

Court Patent Trial and Appeal Board

Status Terminated-Settled

Administrative JudgesKen B. Barrett, Frances L. Ippolito, Christopher C. Kennedy

Judge Writing the Final DecisionKen B. Barrett

Claims Challenged in the Petition: 1, 2, 3, 4, 9, 13, 14, 15, 16, 21, 26, 32, 37

Related Patents

Doc No Title Issue date
07871898 Method for low temperature bonding and bonded structure Jan 18, 2011
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