Case number IPR2019-00007
Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Feb 1, 2019 | 12 | Notice of Refund Download | |
| Jan 8, 2019 | 11 | Petitioner's Request for Refund of Fees Download | |
| Dec 21, 2018 | 10 | Termination Decision Document Download | |
| Dec 13, 2018 | 8 | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Dec 13, 2018 | 9 | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Dec 3, 2018 | 7 | Notice of Accord Filing Date Download | |
| Oct 31, 2018 | 6 | Patent Owner's Motion for District Court (Phillips) Patent Claim Construction Download | |
| Oct 22, 2018 | 5 | Patent Owner's Mandatory Notices Download | |
| Oct 22, 2018 | 4 | Patent Owner's Power of Attorney Download | |
| Oct 1, 2018 | 1012 | John L. Vossen et al., Thin Film Processes, Academic Press (1978) (excerpts) Download | |
| Oct 1, 2018 | 1007 | U.S. Patent No. 5,413,952, Direct Wafer Bonded Structure Method of Making (filed Feb. 2, 1994) ("Pages") Download | |
| Oct 1, 2018 | 2 | Power of Attorney Samsung Electronics Co., Ltd. Download | |
| Oct 1, 2018 | 1013 | John L. Vossen et al., Thin Film Processes II, Academic Press (1991) (excerpts) Download | |
| Oct 1, 2018 | 1011 | Declaration of Amanda Peil from Elsevier Inc. Regarding Exhibit 1008. (Part 1 of 2) Download | |
| Oct 1, 2018 | 1001 | U.S. Patent No. 9,431,368 ("the "368 Patent") Download | |
| Oct 1, 2018 | 1004 | Curriculum Vitae for Dr. Charles Hunt in Support of Petition for Inter Partes Review of U.S. Patent No. 9,431,368 Download | |
| Oct 1, 2018 | 1002 | Prosecution File History of U.S. Patent No. 9,431,368 Download | |
| Oct 1, 2018 | 1008 | Q.-Y. Tong et al., Semiconductor Wafer Bonding: Recent Developments, 37 Materials Chemistry and Physics 101 (1994) ("Tong") Download | |
| Oct 1, 2018 | 3 | Power of Attorney Samsung Electronics America, Inc. Download | |
| Oct 1, 2018 | 1011 | Declaration of Amanda Peil from Elsevier Inc. Regarding Exhibit 1008. (Part 1 of 2) Download | |
| Oct 1, 2018 | 1005 | U.S. Patent No. 5,236,118, Aligned Wafer Bonding (filed May 12, 1992) ("Bower") Download | |
| Oct 1, 2018 | 1003 | Declaration of Dr. Charles Hunt Download | |
| Oct 1, 2018 | 1010 | Q.-Y. Tong et al., Semiconductor Wafer Bonding, Science and Technology, The Electrochemical Society Series (1999) (excerpts) Download | |
| Oct 1, 2018 | 1009 | U.S. Patent No. 5,753,536, Semiconductor Device and Associated Fabrication Method (filed Aug. 28,1995) ("Sugiyama") Download | |
| Oct 1, 2018 | 1006 | U.S. Patent No. 6,097,096, Metal Attachment Method and Structure for Attaching Substrates at Low Temperatures (filed Jul. 11, 1997) ("Gardner") Download | |
| Oct 1, 2018 | 1 | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 9,431,368 Download | |
| Oct 1, 2018 | 1011 | Declaration of Amanda Peil from Elsevier Inc. Regarding Exhibit 1008. (Part 2 of 2) Download |
