Date Field | Doc. No. | Party | Description |
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Feb 1, 2019 | 12 | | Notice of Refund Download |
Jan 8, 2019 | 11 | | Petitioner's Request for Refund of Fees Download |
Dec 21, 2018 | 10 | | Termination Decision Document Download |
Dec 13, 2018 | 8 | | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 13, 2018 | 9 | | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 3, 2018 | 7 | | Notice of Accord Filing Date Download |
Oct 31, 2018 | 6 | | Patent Owner's Motion for District Court (Phillips) Patent Claim Construction Download |
Oct 22, 2018 | 5 | | Patent Owner's Mandatory Notices Download |
Oct 22, 2018 | 4 | | Patent Owner's Power of Attorney Download |
Oct 1, 2018 | 1012 | | John L. Vossen et al., Thin Film Processes, Academic Press
(1978) (excerpts) Download |
Oct 1, 2018 | 1007 | | U.S. Patent No. 5,413,952, Direct Wafer Bonded Structure
Method of Making (filed Feb. 2, 1994) ("Pages") Download |
Oct 1, 2018 | 2 | | Power of Attorney Samsung Electronics Co., Ltd. Download |
Oct 1, 2018 | 1013 | | John L. Vossen et al., Thin Film Processes II, Academic Press
(1991) (excerpts) Download |
Oct 1, 2018 | 1011 | | Declaration of Amanda Peil from Elsevier Inc. Regarding
Exhibit 1008. (Part 1 of 2) Download |
Oct 1, 2018 | 1001 | | U.S. Patent No. 9,431,368 ("the "368 Patent") Download |
Oct 1, 2018 | 1004 | | Curriculum Vitae for Dr. Charles Hunt in Support of Petition
for Inter Partes Review of U.S. Patent No. 9,431,368 Download |
Oct 1, 2018 | 1002 | | Prosecution File History of U.S. Patent No. 9,431,368 Download |
Oct 1, 2018 | 1008 | | Q.-Y. Tong et al., Semiconductor Wafer Bonding: Recent
Developments, 37 Materials Chemistry and Physics 101
(1994) ("Tong") Download |
Oct 1, 2018 | 3 | | Power of Attorney Samsung Electronics America, Inc. Download |
Oct 1, 2018 | 1011 | | Declaration of Amanda Peil from Elsevier Inc. Regarding
Exhibit 1008. (Part 1 of 2) Download |
Oct 1, 2018 | 1005 | | U.S. Patent No. 5,236,118, Aligned Wafer Bonding (filed May
12, 1992) ("Bower") Download |
Oct 1, 2018 | 1003 | | Declaration of Dr. Charles Hunt Download |
Oct 1, 2018 | 1010 | | Q.-Y. Tong et al., Semiconductor Wafer Bonding, Science and
Technology, The Electrochemical Society Series (1999)
(excerpts) Download |
Oct 1, 2018 | 1009 | | U.S. Patent No. 5,753,536, Semiconductor Device and
Associated Fabrication Method (filed Aug. 28,1995)
("Sugiyama") Download |
Oct 1, 2018 | 1006 | | U.S. Patent No. 6,097,096, Metal Attachment Method and
Structure for Attaching Substrates at Low Temperatures (filed
Jul. 11, 1997) ("Gardner") Download |
Oct 1, 2018 | 1 | | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 9,431,368 Download |
Oct 1, 2018 | 1011 | | Declaration of Amanda Peil from Elsevier Inc. Regarding
Exhibit 1008. (Part 2 of 2) Download |