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Case number IPR2019-00020

Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Summary

Court Case Number IPR2019-00020

Filing Date Oct 2, 2018

Institution Decision Date -

Decision Date Dec 21, 2018

Court Patent Trial and Appeal Board

Status Terminated-Settled

Administrative JudgesKen B. Barrett, Frances L. Ippolito, Christopher C. Kennedy

Judge Writing the Final DecisionKen B. Barrett

Claims Challenged in the Petition: 1, 3, 4, 6, 14, 15, 20, 21, 22, 24, 29, 30, 31, 32, 33

Related Patents

Doc No Title Issue date
09391143 Method for low temperature bonding and bonded structure Jul 12, 2016
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