Case number IPR2019-00021
Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Jan 25, 2019 | 12 | Notice of Refund Download | |
| Jan 8, 2019 | 11 | Petitioner's Request for Refund of Fees Download | |
| Dec 21, 2018 | 10 | Termination Decision Document Download | |
| Dec 13, 2018 | 8 | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Dec 13, 2018 | 9 | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Nov 6, 2018 | 7 | Notice of Accord Filing Date Download | |
| Oct 31, 2018 | 6 | Patent Owner's Motion for District Court (Phillips) Patent Claim Construction Download | |
| Oct 22, 2018 | 4 | Patent Owner's Power of Attorney Download | |
| Oct 22, 2018 | 5 | Patent Owner's Mandatory Notices Download | |
| Oct 2, 2018 | 1004 | Curriculum Vitae for Dr. Charles Hunt Download | |
| Oct 2, 2018 | 1008 | C. Harendt et al., Vertical Polysilicon Interconnects by Aligned Wafer Bonding, 97-36 Electrochemical Society Proceedings 501 (1998) ("Harendt") Download | |
| Oct 2, 2018 | 1014 | R. Bower et al., Low Temperature Si3N4 Direct Bonding, 62 Applied Physics Letters 3485 (1993) Download | |
| Oct 2, 2018 | 1011 | Q. Tong et al., Semiconductor Wafer Bonding: Science and Technology, John Wiley & Sons, Inc. (1999) Download | |
| Oct 2, 2018 | 1010 | U.S. Patent No. 5,503,704 ("Bower") Download | |
| Oct 2, 2018 | 1016 | Declaration of Elizabeth Craanen of The Electrochemical Society, Inc. Regarding Reiche Download | |
| Oct 2, 2018 | 1006 | M. Reiche et al., The Effect of a Plasma Pretreatment on the Si/Si Bonding Behaviour, 97-36 Electrochemical Society Proceedings 437 (1997) ("Reiche") Download | |
| Oct 2, 2018 | 1005 | G. Krauter et al., Low Temperature Silicon Direct Bonding for Application in Micromechanics: Bonding Energies for Different Combinations of Oxides, Sensors and Actuators A 70, 271-275 (1998) ("Krauter") Download | |
| Oct 2, 2018 | 3 | Power of Attorney Samsung Electronics America, Inc. Download | |
| Oct 2, 2018 | 1003 | Declaration of Dr. Charles Hunt Download | |
| Oct 2, 2018 | 1012 | A. Li, Systematic Low Temperature Bonding and its Application to the Hydrogen Ion Cut Process and Three- Dimensional Structures (1999) Download | |
| Oct 2, 2018 | 1007 | Q. Tong et al., Semiconductor Wafer Bonding: Recent Developments, 37 Materials Chemistry and Physics 101 (1994) ("Tong (1994)") Download | |
| Oct 2, 2018 | 1001 | U.S. Patent No. 9,391,143 ("the "143 Patent") Download | |
| Oct 2, 2018 | 1017 | Declaration of Amanda Piel of Elsevier, Inc. Regarding Krauter and Tong (1994) (Part 2 of 2) Download | |
| Oct 2, 2018 | 1015 | Declaration of Dr. Sylvia Hall-Ellis Regarding Krauter, Reiche, Tong (1994), and Harendt Download | |
| Oct 2, 2018 | 1002 | Prosecution File History of U.S. Patent No. 9,391,143 Download | |
| Oct 2, 2018 | 2 | Power of Attorney Samsung Electronics Co., Ltd. Download | |
| Oct 2, 2018 | 1017 | Declaration of Amanda Piel of Elsevier, Inc. Regarding Krauter and Tong (1994) (Part 2 of 2) Download | |
| Oct 2, 2018 | 1009 | Original and Certified Translation of Japanese Patent Application Pub. No. H7-249749 ("Yamagata") Download | |
| Oct 2, 2018 | 1 | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 9,391,143 Download | |
| Oct 2, 2018 | 1013 | Q. Tong et al., Wafer Bonding and Layer Splitting for Microsystems, 11 Advanced Materials 1409 (1999) Download | |
| Oct 2, 2018 | 1017 | Declaration of Amanda Piel of Elsevier, Inc. Regarding Krauter and Tong (1994) (Part 1 of 2) Download |
