Date Field | Doc. No. | Party | Description |
---|
Oct 2, 2018 | 1 | | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 8,153,505 Download |
Oct 2, 2018 | 2 | | Power of Attorney Samsung Electronics Co., Ltd. Download |
Oct 2, 2018 | 3 | | Power of Attorney Samsung Electronics America, Inc. Download |
Oct 22, 2018 | 4 | | Patent Owner's Power of Attorney Download |
Oct 22, 2018 | 5 | | Patent Owner's Mandatory Notices Download |
Oct 31, 2018 | 6 | | Patent Owner's Motion for District Court (Phillips) Patent Claim Construction Download |
Nov 30, 2018 | 7 | | Notice of Accord Filing Date Download |
Dec 13, 2018 | 8 | | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 13, 2018 | 9 | | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download |
Dec 21, 2018 | 10 | | Termination Decision Document Download |
Jan 8, 2019 | 11 | | Petitioner's Request for Refund of Fees Download |
Jan 25, 2019 | 12 | | Notice of Refund Download |
Oct 2, 2018 | 1001 | | U.S. Patent No. 8,153,505 ("the "505 Patent") Download |
Oct 2, 2018 | 1002 | | Prosecution File History of U.S. Patent No. 8,153,505 Download |
Oct 2, 2018 | 1003 | | Declaration of Dr. Charles Hunt Download |
Oct 2, 2018 | 1004 | | Curriculum Vitae for Dr. Charles Hunt Download |
Oct 2, 2018 | 1005 | | C. Harendt, Vertical Polysilicon Interconnects by Aligned
Wafer Bonding, 97-36 Electrochemical Society Proceedings
501 (1998) ("Harendt") Download |
Oct 2, 2018 | 1009 | | Q. Tong et al., Semiconductor Wafer Bonding: Recent
Developments, 37 Materials Chemistry and Physics 101
(1994) ("Tong") Download |
Oct 2, 2018 | 1010 | | Q. Tong et al., Semiconductor Wafer Bonding: Science and
Technology, John Wiley & Sons, Inc. (1999) Download |
Oct 2, 2018 | 1011 | | Johann Steinkirchner et al., Silicon Wafer Bonding via
Designed Monolayers, 7 Advanced Materials 7, 662 (1995) Download |
Oct 2, 2018 | 1012 | | John L. Vossen et al., Thin Film Processes, Academic Press
(1978) (excerpts) Download |
Oct 2, 2018 | 1013 | | John L. Vossen et al., Thin Film Processes II, Academic
Press (1991) (excerpts) Download |
Oct 2, 2018 | 1015 | | Japan Patent Appl. Laid-Open Pub. No. H7-249749, Method
of Manufacturing SOI Substrate (Sept. 26, 1995)
("Yamagata") Download |
Oct 2, 2018 | 1016 | | Elsevier Declaration regarding Tong (Ex-1009) (Part 1 of 2) Download |
Oct 2, 2018 | 1016 | | Elsevier Declaration regarding Tong (Ex-1009) (Part 1 of 2) Download |
Oct 2, 2018 | 1016 | | Elsevier Declaration regarding Tong (Ex-1009) (Part 2 of 2) Download |
Oct 2, 2018 | 1019 | | U.S. Patent No. 5,503,704, Nitrogen Based Low Temperature
Direct Bonding (filed 1994) ("Bower") Download |
Oct 2, 2018 | 1020 | | Yang Li, Systematic Low Temperature Bonding and Its
Application To The Hydrogen Ion Cut Process And Three-
Dimensional Structures, University of California, Davis
(1999) Download |
Oct 2, 2018 | 1021 | | Qin-Yi Tong, Wafer Bonding and Layer Splitting for
Microsystems, 11 Adv. Mater. 17, 1409 (1999) Download |
Oct 2, 2018 | 1022 | | Robert W. Bower, Low temperature Si3N4 direct bonding, 62
Appl. Phys. Lett. 26, 3485 (1993) Download |
Oct 2, 2018 | 1026 | | Hall-Ellis Declaration Download |